Material bearing tray for eutectic and eutectic device

Abstract

The utility model relates to the technical field of microelectronic packaging, and particularly discloses a material bearing tray for eutectic and an eutectic device, the material bearing tray comprises a body provided with a material bearing groove, a support column arranged at the bottom of the body and used for supporting the body, and an isolation layer arranged at the bottom of the support column and forming an air cavity with the body. The utility model also discloses a eutectic device. After the material bearing tray is placed on the eutectic heating stage, the isolating layer is arranged to ensure that welding flux on the material bearing tray is not baked and melted at high temperature. By using the device, the picking stroke is effectively reduced, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of microelectronic packaging, and more specifically to a material receiving tray for eutectic and a eutectic device. Background Art

[0002] Eutectic welding technology belongs to the patch link in the microelectronic packaging process. It is to heat and melt the conductive alloy material. The molten solder wetting and diffusion between the attached component and the substrate forms a weld. Eutectic welding has the characteristics of good thermal conductivity and high shear strength.

[0003] The existing manual eutectic technology is to place the workpiece to be welded on a hot table for heating, and then place the eutectic device and eutectic solder on a receiving plate and then place it on a bracket outside the hot table. During the eutectic operation, a manual operating device is used to first suck the solder and place it in the eutectic common area. After it melts, the operating device clamps the eutectic device and moves it to the eutectic area. The eutectic device is used to press the molten solder to achieve eutectic operation by friction. The two moving parts are reciprocated to complete the eutectic operation.

[0004] Since the receiving tray is located on a bracket next to the hot plate, the travel time for picking up solder and eutectic devices back and forth during eutectic operation is relatively long, which will cause a certain degree of efficiency reduction when performing large-scale eutectic operations. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a material receiving tray and a eutectic device for eutectic;

[0006] The solution adopted by the utility model to solve the technical problem is:

[0007] A material receiving tray for eutectic is used in conjunction with a eutectic hot plate to receive solder and eutectic devices; it comprises a body provided with a material receiving groove, a support column arranged at the bottom of the body and used to support the body, and an isolation layer arranged at the bottom of the support column and forming an air cavity between the support column and the body.

[0008] The utility model places the material receiving tray on the eutectic hot stage during the eutectic operation, and cools the solder in the material receiving tray through the isolation layer formed between the two, thereby ensuring that the solder on the material receiving tray is not baked and melted by high temperature, and effectively protecting the solder; compared with the prior art, placing the material receiving tray on the eutectic hot stage can greatly reduce the picking-up stroke of the solder and the eutectic device during the eutectic operation, thereby greatly improving the work efficiency;

[0009] In some possible implementations, in order to effectively cool down the solder and eutectic devices in the material receiving tray through the air cavity to avoid excessive temperature;

[0010] The support columns are in multiple groups and are bonded to the isolation layer, and a channel communicating with the air cavity is formed between two adjacent groups of support columns.

[0011] In some possible implementations, in order to effectively support the body;

[0012] The body is square or circular, and the support columns are at least three groups and are evenly arranged along the circumference of the body.

[0013] In some possible implementations, the support column is cylindrical or square, and the length of the support column along its axial direction is 1-5 mm.

[0014] In some possible implementations, in order to effectively implement the installation of the receiving tray;

[0015] The isolation layer is a double-sided high-temperature adhesive tape; the side of the double-sided high-temperature adhesive tape away from the support column is pasted on the eutectic hot stage; an air cavity is formed between the double-sided high-temperature adhesive tape and the bottom of the body.

[0016] A eutectic device comprises a eutectic hot stage, a material receiving tray as described above and installed on the eutectic hot stage, an air pipe installed on the eutectic hot stage and conveying low-temperature gas into an air cavity to form a gas insulation layer, and a eutectic substrate detachably installed on the eutectic hot stage.

[0017] In some possible implementations, the eutectic hot plate includes a bottom plate, and a protective periphery mounted on the bottom plate and cooperating with the bottom plate to form a mounting cavity.

[0018] In some possible implementations, an annular groove communicating with the mounting cavity is formed at the top surface of the protective edge and the bottom plate, and air inlet holes communicating with the annular groove are evenly arranged on the bottom plate and along the circumference of the annular groove.

[0019] In some possible implementations, the invention further includes a clamping assembly disposed on the eutectic hot stage and used to clamp and fix the eutectic substrate;

[0020] The clamping assembly comprises a wedge-shaped plug which is detachably mounted on the protective edge and located in the mounting cavity, and a clamp which is slidably matched with the bottom plate and moves linearly toward or away from the wedge-shaped plug; a clamping cavity is formed between the wedge-shaped plug and the clamp.

[0021] In some possible implementations, a slot for plugging and cooperating with the wedge-shaped plug block is provided on one side of the protective edge close to the installation cavity;

[0022] The clamping member includes a clamping plate located in the installation cavity and slidably matched with the base plate, a locking screw for fixing the clamping plate and the base plate, a threaded hole provided on the base plate and used in conjunction with the locking screw, and a waist-shaped hole provided on the base plate and corresponding to the threaded hole;

[0023] The long direction of the waist-shaped hole is arranged along the sliding direction of the clamping block.

[0024] Compared with the prior art, the utility model has the following beneficial effects:

[0025] Compared with the prior art, the utility model places the solder and the eutectic device on the eutectic hot table through the material receiving tray provided; thereby reducing the picking stroke of the solder and the eutectic device during the eutectic operation; thereby greatly improving the work efficiency;

[0026] The utility model arranges double-sided high-temperature adhesive tape at the bottom of the material receiving tray to form an air cavity between the double-sided high-temperature adhesive tape and the bottom of the body. Low-temperature gas enters the air cavity through the air pipe to form a gas isolation layer, which effectively reduces the temperature of the material receiving tray and avoids the melting of the solder in the material receiving tray.

[0027] The utility model can effectively realize the clamping and fixing of different eutectic substrates by setting a clamping component;

[0028] The utility model has a simple structure and strong practicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of the structure of the material receiving tray in the utility model;

[0030] Figure 2 This is a schematic diagram of the structure of the eutectic device in the utility model;

[0031] Among them: 1. material receiving tray; 2. eutectic hot plate; 21. mounting cavity; 3. eutectic substrate; 4. eutectic device; 5. protective edge; 6. air inlet; 7. wedge-shaped plug; 8 clamping piece; 9. solder; 10 air pipe; 11. double-sided high-temperature tape; 101. main body; 102. material receiving groove; 103. support column; 104. channel. DETAILED DESCRIPTION

[0032] In the present utility model, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral body; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. The "first", "second" and similar words mentioned in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, "one" or "one" and other similar words do not indicate a quantity limit, but indicate the existence of at least one. In the implementation of this application, "and / or" describes the association relationship of the associated objects, indicating that there can be three relationships, for example, A and / or B can indicate: A exists alone, A and B exist at the same time, and B exists alone. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" refers to two or more. For example, multiple positioning columns refer to two or more positioning columns. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to the specific circumstances.

[0033] The utility model is described in detail below.

[0034] Embodiment 1:

[0035] like Figure 1-Figure 2 As shown, a material receiving tray 1 for eutectic is used in conjunction with a eutectic hot stage 2 to receive solder 9 and eutectic devices 4 (eutectic chips, transmission lines, eutectic chip capacitors); it includes a body 101 provided with a material receiving groove 102, a support column 103 provided at the bottom of the body 101 and used to support the body 101, and an isolation layer provided at the bottom of the support column 103 and forming an air cavity with the body 101; wherein Figure 1 The material held in the tray is solder 9; the material tray 1 is made of polytetrafluoroethylene material; the melting point of the material tray 1 is 50 degrees higher than the melting point of the eutectic solder 9;

[0036] The utility model places the material receiving tray 1 on the eutectic hot stage 2 during the eutectic operation, and cools the solder 9 in the material receiving tray 1 through the isolation layer formed between the two, so as to ensure that the solder 9 on the material receiving tray 1 is not baked and melted by high temperature, and effectively protects the solder 9; compared with the prior art, placing the material receiving tray 1 on the eutectic hot stage 2 can greatly reduce the picking stroke of the solder 9 and the eutectic device 4 during the eutectic operation, thereby greatly improving the work efficiency;

[0037] In some possible implementations, in order to effectively cool down the solder 9 and the eutectic device 4 in the receiving tray 1 through the air cavity to avoid excessive temperature;

[0038] The support columns 103 are multiple groups and are bonded to the isolation layer, and a channel 104 communicating with the air cavity is formed between two adjacent groups of support columns 103;

[0039] After passing through the channel 104, the low-temperature gas enters the air cavity to form a gas isolation layer, absorbs the heat of the material tray 1, and flows out from other channels 104 to take away the heat. The low-temperature gas continues to enter the air cavity, thereby ensuring that during eutectic formation, the solder 9 on the material tray 1 will not melt in the material tray 1, thereby affecting its welding performance;

[0040] In some possible implementations, in order to effectively support the body 101;

[0041] The body 101 is square or circular, and the support columns 103 are at least three groups and are evenly arranged along the circumference of the body 101;

[0042] Specifically, when the body 101 is square, four groups of support columns 103 can be used to support the body 101. Furthermore, the support columns 103 are arranged at the corners of the body 101, so that the volume of the air cavity is larger, and the heat dissipation and cooling effect of the material tray 1 is better;

[0043] Specifically, the support column 103 is cylindrical or square, and the length of the support column 103 along its axial direction is 1-5 mm.

[0044] In some possible implementations, in order to effectively realize the installation of the receiving tray 1;

[0045] The isolation layer is a double-sided high-temperature tape 11, which is made of polytetrafluoroethylene material; the side of the double-sided high-temperature tape 11 away from the support column 103 is pasted on the eutectic hot stage 2; an air cavity is formed between the double-sided high-temperature tape 11 and the bottom of the main body 101; the heat resistance temperature of the double-sided high-temperature tape 11 is 20 degrees higher than the eutectic welding temperature.

[0046] The assembly of the material receiving tray 1 and the eutectic hot plate 2 is achieved by gluing, so that a detachable connection is achieved. The material receiving tray 1 of different sizes can be selected according to the needs of use. The isolation layer may also be replaced after long-term use to avoid the isolation layer from failing and ineffectively slowing down the heat from the position.

[0047] Embodiment 2:

[0048] like Figure 1-Figure 2 As shown, a eutectic device includes a eutectic hot stage 2, a material receiving tray 1 installed on the eutectic hot stage 2 and as described above, an air pipe 10 installed on the eutectic hot stage 2 and conveying low-temperature gas into the air cavity and forming a gas insulation layer, and a eutectic substrate 3 detachably installed on the eutectic hot stage 2.

[0049] Specifically, the output end of the air pipe 10 is arranged corresponding to one of the channels 104, and the other end thereof is connected to the gas source. The low-temperature gas passes through the air pipe 10 and the channels 104 arranged corresponding to the air pipe 10 and enters the air cavity to form a gas isolation layer in the air cavity; after absorbing heat, the low-temperature gas will flow out from other channels 104 to take away the heat;

[0050] The utility model effectively reduces the temperature of the material receiving tray 1 by using the double-sided high-temperature adhesive tape 11 and the gas isolation layer, so that the weldment and the eutectic solder are not heated at high temperature for a long time, which would affect their performance.

[0051] Specifically, the cryogenic gas is cryogenic nitrogen.

[0052] In some possible implementations, the eutectic hot stage 2 includes a bottom plate, and a protective edge 5 mounted on the bottom plate and cooperating with the bottom plate to form a mounting cavity;

[0053] An annular groove communicating with the mounting cavity is formed at the top surface of the protective edge 5 and the bottom plate, and air inlet holes 6 communicating with the annular groove are evenly arranged on the bottom plate along the circumference of the annular groove;

[0054] The air inlet 6 is used for the nitrogen gas to enter the nitrogen protective cover. After entering the air inlet 6, the nitrogen gas is guided in the annular groove. As the nitrogen gas continues to enter the installation cavity, a protective cover is formed, thereby preventing the solder from being oxidized.

[0055] In some possible implementations, in order to effectively fix the eutectic substrate 3 in the mounting cavity, a clamping assembly is further provided on the eutectic hot stage 2 and used for clamping and fixing the eutectic substrate 3;

[0056] The clamping assembly comprises a wedge-shaped plug block 7 which is detachably mounted on the protective edge 5 and is located in the mounting cavity, and a clamping member 8 which is slidably matched with the bottom plate and moves linearly toward or away from the wedge-shaped plug block 7; a clamping cavity is formed between the wedge-shaped plug block 7 and the clamping member 8;

[0057] The eutectic substrate 3 is used as a eutectic operating platform for solder 9 and eutectic devices 4; the eutectic substrates 3 of different sizes are fixed by the cooperation of the wedge-shaped plug 7 and the clamping piece 8; the eutectic substrates 3 that do not pass through can be selected according to the use requirements and placed in the clamping cavity, and the wedge-shaped plug 7 and the clamping piece 8 are close to each other and abutted against the outer side surface of the eutectic substrate 3 for clamping and fixing;

[0058] During operation, firstly, the solder 9 in the material receiving tray 1 is placed into the welding area of ​​the eutectic substrate 3, and then the eutectic device 4 is placed on the molten solder 9 for friction to achieve the eutectic operation;

[0059] In some possible implementations, a slot for plugging and cooperating with the wedge-shaped plug block 7 is provided on one side of the protective edge 5 close to the installation cavity; the slot is in a U-shaped structure, and its opening is provided on one side close to the installation cavity, and the interior of the slot is connected to the installation cavity;

[0060] The clamping member 8 comprises a clamping plate located in the mounting cavity and slidably matched with the bottom plate, a locking screw for fixing the clamping plate and the bottom plate, a threaded hole provided on the bottom plate and used in conjunction with the locking screw, and a waist-shaped hole provided on the bottom plate and corresponding to the threaded hole; the axis of the threaded hole and the axis of the long direction of the waist-shaped hole are in the same plane;

[0061] The long direction of the waist-shaped hole is arranged along the sliding direction of the clamping block.

[0062] When clamping the eutectic substrate 3, the eutectic substrate 3 is placed in the mounting cavity, and one of the outer side surfaces is abutted against the side of the clamping plate close to the slot; then the wedge-shaped plug 7 is inserted into the slot, and the inclined surface of the wedge-shaped plug 7 is close to the mounting cavity and abutted against the eutectic substrate 3, so as to fix the eutectic substrate 3.

[0063] Compared with the prior art, the use of this device effectively reduces the picking stroke to only about one tenth of the original stroke, and the operating efficiency is significantly improved.

[0064] The present invention is not limited to the above-mentioned specific implementation modes, but extends to any new features or any new combination disclosed in this specification, as well as any new method or process steps or any new combination disclosed.

Claims

1. A material receiving tray for eutectic, used in conjunction with a eutectic hot stage, characterized in that: The invention comprises a body provided with a material receiving groove, a support column arranged at the bottom of the body and used for supporting the body, and an isolation layer arranged at the bottom of the support column and forming an air cavity with the body.

2. A material receiving tray for eutectic according to claim 1, characterized in that: The support columns are in multiple groups and are bonded to the isolation layer, and a channel communicating with the air cavity is formed between two adjacent groups of support columns.

3. A material receiving tray for eutectic according to claim 1, characterized in that: The body is square or circular, and the support columns are at least three groups and are evenly arranged along the circumference of the body.

4. A material receiving tray for eutectic according to claim 1, characterized in that: The support column is cylindrical or square, and the length of the support column along its axial direction is 1-5 mm.

5. A material receiving tray for eutectic according to claim 1, characterized in that: The isolation layer is a double-sided high-temperature adhesive tape; the side of the double-sided high-temperature adhesive tape away from the support column is pasted on the eutectic hot stage; an air cavity is formed between the double-sided high-temperature adhesive tape and the bottom of the body.

6. A eutectic device, characterized in that: It comprises a eutectic hot stage, a material receiving tray installed on the eutectic hot stage and as described in any one of claims 1 to 5, an air pipe installed on the eutectic hot stage and conveying low-temperature gas into the air cavity to form a gas insulation layer, and a eutectic substrate detachably installed on the eutectic hot stage.

7. A eutectic device according to claim 6, characterized in that: The eutectic hot plate comprises a bottom plate and a protective edge mounted on the bottom plate and cooperating with the bottom plate to form a mounting cavity.

8. The eutectic device according to claim 7, characterized in that: An annular groove communicating with the mounting cavity is formed at the top surface of the protective edge and the bottom plate, and air inlet holes communicating with the annular groove are evenly arranged on the bottom plate and along the circumference of the annular groove.

9. The eutectic device according to claim 6, characterized in that: It also includes a clamping assembly disposed on the eutectic hot stage and used to clamp and fix the eutectic substrate; The clamping assembly comprises a wedge-shaped plug which is detachably mounted on the protective edge and located in the mounting cavity, and a clamp which is slidably matched with the bottom plate and moves linearly toward or away from the wedge-shaped plug; a clamping cavity is formed between the wedge-shaped plug and the clamp.

10. The eutectic device according to claim 9, characterized in that: A slot for plugging and cooperating with the wedge-shaped plug block is provided on one side of the protective edge close to the installation cavity; The clamping member includes a clamping plate located in the installation cavity and slidably matched with the base plate, a locking screw for fixing the clamping plate and the base plate, a threaded hole provided on the base plate and used in conjunction with the locking screw, and a waist-shaped hole provided on the base plate and corresponding to the threaded hole; The long direction of the waist-shaped hole is arranged along the sliding direction of the clamping block.

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