Tool of wafer annealing processing mechanism

Abstract

The utility model relates to a tool of a wafer annealing processing mechanism, which comprises a base horizontally arranged; the two side plates are symmetrically arranged on the two sides of the base; the lifting assembly comprises a horizontally-arranged driving part and a horizontal sliding block connected with the driving part; the lower wedge-shaped block is connected to the horizontal sliding block of the lifting assembly; the upper wedge-shaped block is connected to the upper portion of the lower wedge-shaped block in a sliding mode, and the upper wedge-shaped block is connected to the inner wall of the side plate in an up-down sliding mode; the adsorption disc is connected to the top of the upper wedge-shaped block; the PIN rod assemblies comprise PIN rods, height-adjustable workpieces used for adjusting the heights of the PIN rods and horizontal angle-adjustable workpieces used for adjusting the angles of the PIN rods in the horizontal plane and the distance between the PIN rods and the center of the adsorption disc. A stop block is arranged on the outer side of the top end of the PIN rod. The device is compact in structure and large in bearing capacity, and avoids wafer breakage caused by triggering a manipulator.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production, in particular to a tooling for a wafer annealing processing mechanism. Background Art

[0002] With the development of domestic chip manufacturing, in the back-end production process of chips, it is necessary to anneal the wafer processed chips. The specific processing process is as follows: the robot moves the wafer from the previous process to the designated position of the annealing station, and then anneals it at the annealing station. After the annealing is completed, the robot moves the wafer from the annealing station to the next process at the designated position. The annealing processing mechanism in the prior art has the following problems:

[0003] 1. After long-term use, due to the influence of the external environment or the robot's own reasons, the robot will produce errors and cannot reach the specified position, which can easily trigger the robot and cause the wafer to break;

[0004] 2. The lifting structure is not compact enough and the carrying capacity is insufficient. Utility Model Content

[0005] To this end, the technical problem to be solved by the utility model is to overcome the problems in the prior art that the robot is easily triggered to cause wafer breakage and the lifting structure is not compact enough and the carrying capacity is insufficient.

[0006] In order to solve the above technical problems, the utility model provides a tooling for a wafer annealing processing mechanism, comprising:

[0007] Base, horizontal setting;

[0008] Two side panels are symmetrically arranged on both sides of the base;

[0009] A lifting assembly, comprising a horizontally arranged driving component and a horizontal sliding block connected to the driving component;

[0010] A lower wedge block connected to the horizontal slider of the lifting assembly;

[0011] An upper wedge block is slidably connected above the lower wedge block, and the upper wedge block is slidably connected to the inner wall of the side plate up and down;

[0012] A suction disc connected to the top of the upper wedge-shaped block;

[0013] A plurality of PIN rod assemblies are distributed at intervals along the circumferential direction; the PIN rod assembly comprises a PIN rod, a height-adjustable workpiece for adjusting the height of the PIN rod, and a horizontal angle-adjustable workpiece for adjusting the angle of the PIN rod in the horizontal plane and the distance between the PIN rod and the center of the adsorption disc; the height-adjustable workpiece is connected to the side plate, the horizontal angle-adjustable workpiece is connected to the height-adjustable workpiece, the PIN rod connector is on the horizontal angle-adjustable workpiece, the top end of the PIN rod is higher than the upper surface of the adsorption disc; a stopper is provided on the outer side of the top end of the PIN rod;

[0014] The driving component drives the horizontal slider and the lower wedge block to move horizontally on the base, and the horizontal movement of the lower wedge block drives the upper wedge block and the adsorption disc to move up and down.

[0015] Preferably, the height-adjustable workpiece includes a main body and a connecting portion extending radially along the adsorption disk; the main body is provided with a first waist-shaped hole extending along the height direction, and the first waist-shaped hole is a countersunk hole; the side plate is provided with a first threaded hole corresponding to the first waist-shaped hole, and the first waist-shaped hole is connected to the first threaded hole by bolts; the horizontal angle-adjustable workpiece is connected to the connecting portion.

[0016] Preferably, the horizontally adjustable workpiece is provided with a second waist-shaped hole, which is a countersunk hole; the connecting portion of the height-adjustable workpiece is provided with a second threaded hole corresponding to the second waist-shaped hole, and the second waist-shaped hole is connected to the second threaded hole by bolts.

[0017] Preferably, the present application also includes a limit switch for limiting the up and down lifting travel of the adsorption disc.

[0018] Preferably, in the PIN rod assembly, there are multiple PIN rods and multiple horizontal angle adjustable workpieces, and the horizontal angle adjustable workpieces correspond to the PIN rods one by one.

[0019] Preferably, the driving component includes a servo motor, a lead screw, a lead screw nut, a first guide rail and a first slider;

[0020] The servo motor is connected to the base, the output end of the servo motor is coaxially connected to the lead screw, the lead screw nut cooperates with the lead screw, and the lower wedge block is connected to the top of the lead screw nut; the first guide rail is horizontally arranged on the base, the first slider is slidably connected to the first guide rail, and the first slider is connected to the bottom of the lower wedge block.

[0021] Preferably, there are two first guide rails and two first sliding blocks, and the two first guide rails are symmetrically arranged on both sides of the lower wedge block.

[0022] Preferably, the servo motor and the lead screw are coaxially connected via a coupling.

[0023] Preferably, a sliding component is provided at the position where the lower wedge block is connected to the upper wedge block, and the sliding component includes a second guide rail and a second slider slidably connected to the second guide rail; one of the lower wedge block and the upper wedge block is connected to the second guide rail and the other is connected to the second slider.

[0024] Preferably, the upper wedge block is slidably connected to the side plate via a cross roller guide.

[0025] The above technical solution of the utility model has the following beneficial effects compared with the prior art:

[0026] The tooling of the wafer annealing processing mechanism described in the utility model drives the lower wedge block to move horizontally through a horizontally arranged driving component, thereby driving the upper wedge block and the adsorption disc to move up and down, so that the structure of the lifting component is compact, and the cooperation bearing capacity of the lower wedge block and the upper wedge block is large; the height-adjustable workpiece and the horizontal angle-adjustable workpiece provided in this embodiment can adjust the height of the PIN rod, the angle of the PIN rod in the horizontal plane, and the distance between the PIN rod and the center of the adsorption disc when the robot arm has an error and cannot reach the specified position, thereby avoiding triggering the robot arm to cause wafer breakage, increasing the fault tolerance rate of the wafer transmission process, and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to make the content of the utility model easier to understand, the utility model is further described in detail according to the specific embodiments of the utility model and in combination with the accompanying drawings.

[0028] Figure 1 It is a structural schematic diagram of a tooling of a wafer annealing processing mechanism in a preferred embodiment of the utility model;

[0029] Figure 2 yes Figure 1 A magnified image of point A;

[0030] Figure 3 It is a structural schematic diagram of another perspective of a tooling of a wafer annealing processing mechanism in a preferred embodiment of the utility model;

[0031] Figure 4 It is a top view of a tooling of a wafer annealing processing mechanism in a preferred embodiment of the utility model;

[0032] Figure 5 yes Figure 4 BB cross-sectional view.

[0033] Description of the accompanying drawings in the specification: 100, base;

[0034] 200, side panels;

[0035] 300, lifting assembly; 310, horizontal slider; 320, servo motor; 330, lead screw; 340, lead screw nut; 350, first guide rail; 360, first slider; 370, second guide rail; 380, second slider; 390, coupling;

[0036] 400, lower wedge block;

[0037] 500, upper wedge block;

[0038] 600, adsorption disc;

[0039] 700, PIN rod assembly; 710, PIN rod; 720, height-adjustable workpiece; 721, body; 7211, first waist-shaped hole; 722, connecting portion; 730, horizontal angle-adjustable workpiece; 731, second waist-shaped hole;

[0040] 800, limit switch;

[0041] 900, Cross Roller Guide. DETAILED DESCRIPTION

[0042] The utility model is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the utility model and implement it, but the embodiments are not intended to limit the utility model.

[0043] Reference Figure 1 to Figure 5 As shown, the utility model provides a tooling for a wafer annealing processing mechanism, including:

[0044] The base 100 is arranged horizontally;

[0045] Two side panels 200 are symmetrically arranged on both sides of the base 100;

[0046] The lifting assembly 300 includes a horizontally arranged driving component and a horizontal slider 310 connected to the driving component;

[0047] A lower wedge block 400 connected to the horizontal slider 310 of the lifting assembly 300;

[0048] The upper wedge block 500 is slidably connected to the upper part of the lower wedge block 400, and the upper wedge block 500 is slidably connected to the inner wall of the side plate 200;

[0049] The adsorption disc 600 is connected to the top of the upper wedge block 500;

[0050] A plurality of PIN rod assemblies 700 are distributed at intervals along the circumferential direction; the PIN rod assembly 700 includes a PIN rod 710, a height-adjustable workpiece 720 for adjusting the height of the PIN rod 710, and a horizontal angle-adjustable workpiece 730 for adjusting the angle of the PIN rod 710 in the horizontal plane and the distance between the PIN rod 710 and the center of the adsorption disc 600; the height-adjustable workpiece 720 is connected to the side plate 200, the horizontal angle-adjustable workpiece 730 is connected to the height-adjustable workpiece 720, the PIN rod 710 connector is on the horizontal angle-adjustable workpiece 730, and the top of the PIN rod 710 is higher than the upper surface of the adsorption disc 600; a stopper is provided on the outer side of the top of the PIN rod 710;

[0051] The driving component drives the horizontal slider 310 and the lower wedge block 400 to move horizontally on the base 100 , and the horizontal movement of the lower wedge block 400 drives the upper wedge block 500 and the adsorption disc 600 to move up and down.

[0052] It should be noted that the robot moves the wafer from the previous process to the adsorption disk 600, and the adsorption disk 600 adsorbs the wafer for wafer annealing. After the annealing is completed, the adsorption disk 600 releases the adsorption of the wafer, and the lifting assembly 300 drives the upper wedge block 500 and the adsorption disk 600 to descend so that the wafer is separated from the adsorption disk 600. At this time, the PIN rod 710 supports the wafer, and the robot moves the wafer to the next process.

[0053] Specifically, the present embodiment drives the lower wedge block 400 to move horizontally through a horizontally arranged driving component, thereby driving the upper wedge block 500 and the adsorption disc 600 to move up and down, so that the structure of the lifting assembly 300 is compact, and the lower wedge block 400 and the upper wedge block 500 have a large carrying capacity; the height-adjustable workpiece 720 and the horizontal angle-adjustable workpiece 730 provided in the present embodiment can adjust the height of the PIN rod 710, the angle of the PIN rod 710 in the horizontal plane, and the distance between the PIN rod 710 and the center of the adsorption disc 600 when the robot generates an error and cannot reach the specified position, thereby avoiding triggering the robot to cause the wafer to break, increasing the fault tolerance of the wafer transmission process, and improving production efficiency. In addition, the present embodiment can also adjust the height, horizontal angle, etc. of the PIN rod 710 during assembly and debugging of the annealing station to compensate for the errors caused by the manufacturing process, so that the debugging of the PIN rod 710 is greatly simplified during the assembly process, and no longer requires manual frequent maintenance.

[0054] Further, the height-adjustable workpiece 720 includes a body 721 and a connecting portion 722 extending radially along the adsorption disk 600; the body 721 is provided with a first waist-shaped hole 7211 extending in the height direction, and the first waist-shaped hole 7211 is a countersunk hole; the side plate 200 is provided with a first threaded hole corresponding to the first waist-shaped hole 7211, and the first waist-shaped hole 7211 is connected to the first threaded hole by bolts; the horizontal angle-adjustable workpiece 730 is connected to the connecting portion 722. Specifically, in this embodiment, the height-adjustable workpiece 720 and the PIN rod 710 are adjusted by moving the height-adjustable workpiece 720 up and down so that different positions of the first threaded hole are connected to the first threaded hole by bolts.

[0055] Furthermore, the horizontal angle adjustable workpiece 730 is provided with a second waist-shaped hole 731, and the second waist-shaped hole 731 is a countersunk hole; the connecting portion 722 of the height adjustable workpiece 720 is provided with a second threaded hole corresponding to the second waist-shaped hole 731, and the second waist-shaped hole 731 is connected to the second threaded hole by bolts. Specifically, in this embodiment, the horizontal angle of the PIN rod 710 is adjusted by rotating the horizontal angle adjustable workpiece 730 to a corresponding angle. Then, the horizontal angle adjustable workpiece 730 is moved so that different positions of the second waist-shaped hole 731 are connected to the second threaded hole by bolts, that is, the distance between the PIN rod 710 and the center of the adsorption disk 600 is adjusted.

[0056] Furthermore, the present application also includes a limit switch 800 for limiting the up and down stroke of the adsorption disc 600. Specifically, the limit switch 800 can limit the up and down stroke of the adsorption disc 600 to avoid over-travel operation and collision with other components to cause accidents.

[0057] Furthermore, in the PIN rod assembly 700, there are multiple PIN rods 710, and there are also multiple horizontal angle adjustable workpieces 730, and the horizontal angle adjustable workpieces 730 correspond one to one with the PIN rods 710. The distances between the multiple PIN rods 710 and the center of the adsorption disk 600 are different. For example, there are three PIN rods 710, and these three PIN rods 710 correspond to clamping a 12-inch wafer, an 8-inch wafer, and a 6-inch wafer. When in use, the corresponding PIN rods 710 and the horizontal angle adjustable workpiece 730 can be installed according to the wafers of the specifications. It can be seen that this embodiment can be used for annealing processing of wafers of different specifications, is compatible with wafers of different specifications, and has a wide range of applications.

[0058] Further, the driving component includes a servo motor 320, a lead screw 330, a lead screw nut 340, a first guide rail 350 and a first slider 360; the servo motor 320 is connected to the base 100, the output end of the servo motor 320 is coaxially connected to the lead screw 330, the lead screw nut 340 cooperates with the lead screw, and the lower wedge block 400 is connected to the top of the lead screw nut 340; the first guide rail 350 is horizontally arranged on the base 100, the first slider 360 is slidably connected to the first guide rail 350, and the first slider 360 is connected to the bottom of the lower wedge block 400. There are two first guide rails 350 and first slider 360, and the two first guide rails 350 are symmetrically arranged on both sides of the lower wedge block 400. The servo motor 320 is coaxially connected to the lead screw 330 through a coupling 390. Specifically, the overall structure of the driving component in this embodiment is compact and highly integrated.

[0059] Further, a sliding component is provided at the position where the lower wedge block 400 is connected to the upper wedge block 500, and the sliding component includes a second guide rail 370 and a second slider 380 slidably connected to the second guide rail 370; one of the lower wedge block 400 and the upper wedge block 500 is connected to the second guide rail 370, and the other is connected to the second slider 380. Specifically, the second guide rail 370 and the second slider 380 in this embodiment play a guiding role for the relative sliding of the lower wedge block 400 and the upper wedge block 500.

[0060] Further, the upper wedge block 500 is slidably connected to the side plate 200 via the cross roller guide rail 900. Specifically, the cross roller guide rail 900 allows the upper wedge block 500 to slide up and down relative to the side plate 200 more smoothly.

[0061] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the utility model creation.

Claims

1. A tooling for a wafer annealing processing mechanism, characterized in that: include: Base, horizontal setting; Two side panels are symmetrically arranged on both sides of the base; A lifting assembly, comprising a horizontally arranged driving component and a horizontal sliding block connected to the driving component; A lower wedge block connected to the horizontal slider of the lifting assembly; An upper wedge block is slidably connected above the lower wedge block, and the upper wedge block is slidably connected to the inner wall of the side plate up and down; A suction disc connected to the top of the upper wedge-shaped block; A plurality of PIN rod assemblies are distributed at intervals along the circumferential direction; the PIN rod assembly comprises a PIN rod, a height-adjustable workpiece for adjusting the height of the PIN rod, and a horizontal angle-adjustable workpiece for adjusting the angle of the PIN rod in the horizontal plane and the distance between the PIN rod and the center of the adsorption disc; the height-adjustable workpiece is connected to the side plate, the horizontal angle-adjustable workpiece is connected to the height-adjustable workpiece, the PIN rod connector is on the horizontal angle-adjustable workpiece, the top end of the PIN rod is higher than the upper surface of the adsorption disc; a stopper is provided on the outer side of the top end of the PIN rod; The driving component drives the horizontal slider and the lower wedge block to move horizontally on the base, and the horizontal movement of the lower wedge block drives the upper wedge block and the adsorption disc to move up and down.

2. The tooling of the wafer annealing processing mechanism according to claim 1, characterized in that: The height-adjustable workpiece includes a main body and a connecting portion extending radially along the adsorption disk; the main body is provided with a first waist-shaped hole extending along the height direction, and the first waist-shaped hole is a countersunk hole; the side plate is provided with a first threaded hole corresponding to the first waist-shaped hole, and the first waist-shaped hole is connected to the first threaded hole by bolts; the horizontal angle-adjustable workpiece is connected to the connecting portion.

3. The tooling of the wafer annealing processing mechanism according to claim 2, characterized in that: The horizontal angle adjustable workpiece is provided with a second waist-shaped hole, which is a countersunk hole; the connecting part of the height adjustable workpiece is provided with a second threaded hole corresponding to the second waist-shaped hole, and the second waist-shaped hole is connected to the second threaded hole by bolts.

4. The tooling of the wafer annealing processing mechanism according to claim 1, characterized in that: It also includes a limit switch for limiting the up and down lifting stroke of the adsorption disc.

5. The tooling of the wafer annealing processing mechanism according to claim 1, characterized in that: In the PIN rod assembly, there are multiple PIN rods and multiple horizontal angle adjustable workpieces, and the horizontal angle adjustable workpieces correspond to the PIN rods one by one.

6. The tooling of the wafer annealing processing mechanism according to claim 1, characterized in that: The driving component includes a servo motor, a lead screw, a lead screw nut, a first guide rail and a first slider; The servo motor is connected to the base, the output end of the servo motor is coaxially connected to the lead screw, the lead screw nut cooperates with the lead screw, and the lower wedge block is connected to the top of the lead screw nut; the first guide rail is horizontally arranged on the base, the first slider is slidably connected to the first guide rail, and the first slider is connected to the bottom of the lower wedge block.

7. The tooling of the wafer annealing processing mechanism according to claim 6, characterized in that: There are two first guide rails and two first sliding blocks, and the two first guide rails are symmetrically arranged on both sides of the lower wedge block.

8. The tooling of the wafer annealing processing mechanism according to claim 7, characterized in that: The servo motor and the lead screw are coaxially connected via a coupling.

9. The tooling of the wafer annealing processing mechanism according to claim 1, characterized in that: A sliding component is provided at the position where the lower wedge block is connected to the upper wedge block, and the sliding component includes a second guide rail and a second slider slidably connected to the second guide rail; one of the lower wedge block and the upper wedge block is connected to the second guide rail, and the other is connected to the second slider.

10. The tooling of the wafer annealing processing mechanism according to claim 1, characterized in that: The upper wedge block is slidably connected to the side plate via a cross roller guide rail.

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