Packaging structure of insulated discrete device

Abstract

The utility model discloses a packaging structure of an insulating discrete device, and belongs to the technical field of semiconductor discrete devices. Comprising a plastic package shell, a metal heat dissipation plate is wrapped in the plastic package shell, a chip is arranged on the metal heat dissipation plate, a metal pin is arranged at one end of the metal heat dissipation plate, and one end, far away from the metal heat dissipation plate, of the metal pin extends out of the plastic package shell. The beneficial effects of the above technical scheme are that by adopting the above technical scheme, the back surface of the discrete device is insulated, an insulation spacer is not needed to be added, the production cost and operation links are saved, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor discrete devices, in particular to a packaging structure of an insulating discrete device. Background Art

[0002] At present, when using IGBT (Insulated Gate Bipolar Transistor) discrete devices on the market, because the back side of the discrete device is exposed and not insulated from the inside, that is, the back side is conductive, customers need to use insulating gaskets during installation, which increases material costs and increases the number of working steps, ultimately increasing the production links and production costs of the entire machine, affecting production efficiency. Utility Model Content

[0003] The purpose of the utility model is to provide a packaging structure of an insulating discrete device to solve the above technical problems;

[0004] A packaging structure for an insulating discrete device, comprising:

[0005] A plastic-sealed shell, wherein the plastic-sealed shell is coated with,

[0006] A metal heat sink, a chip is arranged on the metal heat sink, a metal pin is arranged at one end of the metal heat sink, and an end of the metal pin away from the metal heat sink extends out of the plastic package shell.

[0007] Preferably, the shape of the plastic-sealed shell is a rectangle, the length of the plastic-sealed shell is 20 mm to 30 mm, the width of the plastic-sealed shell is 10 mm to 20 mm, and the thickness of the plastic-sealed shell is 2 mm to 7 mm;

[0008] The size of the metal heat dissipation plate is smaller than that of the plastic-sealed housing.

[0009] Preferably, the chip is at least one of an insulated gate bipolar transistor, a field effect transistor, a diode and a thyristor.

[0010] Preferably, the number of the metal pins is 2 to 4, the gap between the metal pins is 1 mm to 10 mm, the width of the metal pins is 0.5 mm to 3 mm, and the thickness of the metal pins is 0.4 mm to 1 mm.

[0011] Preferably, the plastic package shell includes a first boss, a connecting portion and a second boss in the length direction;

[0012] The connecting portion includes a first connecting portion and a second connecting portion, wherein the first connecting portion is located above the second connecting portion.

[0013] Preferably, the inclination angles of the bevel of the first connecting portion, the bevel of the second connecting portion, and the bevel of the second boss are 4° to 20°.

[0014] Preferably, the thickness of the first boss, the thickness of the second connecting portion and the thickness of the second boss are 2 mm to 5 mm.

[0015] Preferably, the length of the first boss is 8 mm to 15 mm, the length of the first connecting portion is 10 mm to 20 mm, the length of the second boss is 3 mm to 8 mm, and the width of the second boss is 1 mm to 4 mm.

[0016] Preferably, the distance between the plastic package shell and the metal heat sink is 0.2 mm to 1 mm.

[0017] Preferably, the plastic-sealed shell is provided with a circular hole for heat dissipation, and the diameter of the circular hole is 2 mm to 5 mm.

[0018] The beneficial effects of the utility model are as follows: due to the adoption of the above technical solution, the back side of the discrete device is insulated, and there is no need to add an insulating gasket, which saves production costs and operation links and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front view of the packaging structure of the insulating discrete device of the utility model;

[0020] Figure 2 It is a side view of the packaging structure of the insulating discrete device of the utility model.

[0021] In the accompanying drawings: 1. plastic package shell; 11. first boss; 12. second boss; 13. first connection part; 14. second connection part; 2. metal heat sink; 3. metal pin; 4. round hole; 5. chip. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0024] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0025] A packaging structure for an insulating discrete device, such as Figure 1 , Figure 2 As shown, including,

[0026] A plastic-sealed shell 1, wherein the plastic-sealed shell 1 is coated with,

[0027] A metal heat sink 2 is provided with a chip 5 . A metal pin 3 is provided at one end of the metal heat sink 2 . An end of the metal pin 3 away from the metal heat sink 2 extends out of the plastic package housing 1 .

[0028] Specifically, the utility model provides a packaging structure of an insulated discrete device, which is mainly used for semiconductor discrete device packaging, including a metal frame, a plastic package shell 1 and an internal chip 5. The metal frame includes a metal heat sink 2 and metal pins 3. The metal heat sink 2 is completely covered in the plastic package shell 1. There is no need to add an insulating gasket when in use, which saves the cost and operation links of the insulating gasket and improves production efficiency.

[0029] In a preferred embodiment, the shape of the plastic-sealed shell 1 is a rectangle, the length of the plastic-sealed shell 1 is 20 mm to 30 mm, the width of the plastic-sealed shell 1 is 10 mm to 20 mm, and the thickness of the plastic-sealed shell 1 is 2 mm to 7 mm;

[0030] The size of the metal heat sink 2 is smaller than that of the plastic housing 1 .

[0031] Specifically, the size of the metal heat sink 2 is smaller than that of the plastic shell 1, so that the metal heat sink 2 is completely enclosed in the plastic shell 1, and can better contact with the internal components, improve the heat dissipation effect, and prevent the components from overheating.

[0032] In a preferred embodiment, the chip 5 is at least one of an insulated gate bipolar transistor, a field effect transistor, a diode and a thyristor.

[0033] Specifically, the number of the chips 5 is one or more, which can achieve a higher level of integration and reduce the size and power consumption of the chip 5 .

[0034] In a preferred embodiment, the number of the metal pins 3 is 2 to 4, the gap between the metal pins 3 is 1 mm to 10 mm, the width of the metal pins 3 is 0.5 mm to 3 mm, and the thickness of the metal pins 3 is 0.4 mm to 1 mm.

[0035] Specifically, the metal pin 3 is internally connected to the device, and the number of terminal pins varies depending on the internal circuit structure, and there may be 2 to 4. The terminal pin structure may also have a variety of sizes to adapt to different connection requirements and provide better electrical performance and reliability.

[0036] To be more specific, the metal pin 3 can be bare copper or surface-plated with a solderable metal coating such as silver or tin. Bare copper can improve the conductivity of the pin, reduce resistance, and improve signal transmission efficiency; surface-plated with a metal coating such as silver or tin can effectively prevent oxidation corrosion and extend the service life of the pin.

[0037] In a preferred embodiment, the plastic package housing 1 includes a first boss 11, a connecting portion and a second boss 12 in the length direction;

[0038] The connecting portion includes a first connecting portion 13 and a second connecting portion 14, wherein the first connecting portion 13 is located above the second connecting portion 14;

[0039] The inclined angles of the hypotenuse of the first connecting portion 13, the hypotenuse of the second connecting portion 14 and the hypotenuse of the second boss 12 are 4° to 20°;

[0040] The thickness of the first boss 11, the thickness of the second connecting portion 14 and the thickness of the second boss 12 are 2 mm to 5 mm;

[0041] The length of the first boss 11 is 8 mm to 15 mm, the length of the first connection portion 13 is 10 mm to 20 mm, the length of the second boss 12 is 3 mm to 8 mm, and the width of the second boss 12 is 1 mm to 4 mm.

[0042] Specifically, the metal heat sink 2 is completely covered according to its outer shape, thereby ensuring the insulation of the product as a whole and further saving production costs and operations.

[0043] More specifically, the interior of the pin is tightly wrapped by the shell body, and the second boss 12 is provided at the connection between the plastic package shell 1 and the metal pin 3 , which can increase the creepage distance between the metal pins 3 .

[0044] In a preferred embodiment, the distance between the plastic package housing 1 and the metal heat sink 2 is 0.2 mm to 1 mm.

[0045] Specifically, the metal heat sink 2 is usually used for heat dissipation, and the plastic housing 1 may generate a certain amount of heat. By maintaining an appropriate distance, the air flow channel can be increased, and the heat conduction and dissipation can be promoted, thereby improving the overall heat dissipation effect.

[0046] To be more specific, the plastic housing 1 is usually used to protect internal circuits and components, while the metal heat sink 2 may have sharp edges or surfaces that can easily damage the housing. By maintaining a certain distance, the direct contact of the metal heat sink 2 with the housing can be reduced, thereby reducing the risk of damage.

[0047] More specifically, the metal heat sink 2 may generate electromagnetic radiation, and the plastic shell 1 usually has a certain shielding effect. By maintaining a certain distance, the direct contact between the metal heat sink 2 and the shell can be reduced, reducing the interference of electromagnetic radiation to the external environment and other electronic equipment.

[0048] In a preferred embodiment, the plastic package shell 1 is provided with a circular hole 4 for heat dissipation, and the diameter of the circular hole 4 is 2 mm to 5 mm.

[0049] Specifically, after the product is fully encapsulated, heat is dissipated through the plastic shell 1, and the circular hole 4 in the middle assists in heat dissipation without affecting the overall heat dissipation.

[0050] In summary, the present application provides a packaging structure of an insulated discrete device, which is mainly used for semiconductor discrete device packaging. The shell has upper and lower dividing lines, and the shell may have chamfers around it, and the size of the upper and lower chamfers of the dividing line may be consistent or inconsistent. The shell completely covers the metal heat sink 2, and the metal pin 3 is partially exposed. When the whole machine is produced and used, there is no need to add an insulating gasket, which saves the cost of the insulating gasket, can save operating links, and thus improve production efficiency.

[0051] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A packaging structure of an insulating discrete device, characterized in that: include, A plastic-sealed shell (1), wherein the plastic-sealed shell (1) is coated with: A metal heat sink (2), wherein a chip (5) is provided on the metal heat sink (2), a metal pin (3) is provided at one end of the metal heat sink (2), and an end of the metal pin (3) away from the metal heat sink (2) extends out of the plastic housing (1); The plastic-sealed housing (1) comprises a first boss (11), a connecting portion and a second boss (12) in the length direction; The connecting portion comprises a first connecting portion (13) and a second connecting portion (14), wherein the first connecting portion (13) is located above the second connecting portion (14); The plastic-sealed housing (1) is provided with a circular hole (4) for heat dissipation, and the diameter of the circular hole (4) is 2 mm to 5 mm.

2. The packaging structure of the insulated discrete device according to claim 1, characterized in that: The shape of the plastic-sealed shell (1) is a rectangle, the length of the plastic-sealed shell (1) is 20 mm to 30 mm, the width of the plastic-sealed shell (1) is 10 mm to 20 mm, and the thickness of the plastic-sealed shell (1) is 2 mm to 7 mm; The size of the metal heat dissipation plate (2) is smaller than the size of the plastic-sealed housing (1).

3. The packaging structure of the insulated discrete device according to claim 1, characterized in that: The chip (5) is at least one of an insulated gate bipolar transistor, a field effect transistor, a diode and a thyristor.

4. The packaging structure of the insulated discrete device according to claim 1, characterized in that: The number of the metal pins (3) is 2 to 4, the gap between the metal pins (3) is 1 mm to 10 mm, the width of the metal pins (3) is 0.5 mm to 3 mm, and the thickness of the metal pins (3) is 0.4 mm to 1 mm.

5. The packaging structure of the insulated discrete device according to claim 1, characterized in that: The inclination angles of the hypotenuse of the first connecting portion (13), the hypotenuse of the second connecting portion (14) and the hypotenuse of the second boss (12) are 4° to 20°.

6. The packaging structure of the insulated discrete device according to claim 1, characterized in that: The thickness of the first boss (11), the thickness of the second connecting portion (14) and the thickness of the second boss (12) are 2 mm to 5 mm.

7. The packaging structure of the insulated discrete device according to claim 1, characterized in that: The length of the first boss (11) is 8 mm to 15 mm, the length of the first connecting portion (13) is 10 mm to 20 mm, the length of the second boss (12) is 3 mm to 8 mm, and the width of the second boss (12) is 1 mm to 4 mm.

8. The packaging structure of the insulated discrete device according to claim 1, characterized in that: The distance between the plastic-sealed housing (1) and the metal heat dissipation plate (2) is 0.2 mm to 1 mm.

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