Liquid metal sheet base material heat-conducting fin and heat-conducting fin manufacturing mold

Abstract

The utility model relates to a liquid metal sheet base material heat-conducting fin which comprises a liquid metal sheet, a first heat-conducting and electric-conducting silica gel layer, a second heat-conducting and electric-conducting silica gel layer and a third heat-conducting and electric-conducting silica gel layer, the first heat-conducting and electric-conducting silica gel layer is attached to the top of the liquid metal sheet, and the second heat-conducting and electric-conducting silica gel layer is attached to the bottom of the liquid metal sheet. And the third heat-conducting and electric-conducting silica gel layer wraps the four side surfaces of the liquid metal sheet. The liquid metal sheet base material heat-conducting fin does not overflow after being heated, and is good in heat-conducting effect and good in shock absorption performance and compression resilience.

Description

Technical Field

[0001] The utility model relates to the electronics industry, in particular to a liquid metal sheet substrate heat conducting sheet and a heat conducting sheet manufacturing mold. Background Art

[0002] The liquid metal sheet in the prior art is a metal with no compression resilience. When used as a thermal conductive material between a heat source and a heat sink, as the temperature rises during operation, the low-melting-point liquid metal in the liquid metal sheet melts. The molten liquid metal easily overflows and contaminates electronic components, thereby causing risks such as short circuit and burning of electronic components. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a liquid metal sheet substrate heat conducting sheet, which not only does not overflow after being heated, but also has good heat conduction effect, good shock absorption and compression resilience.

[0004] The utility model solves the technical problem by adopting the following technical solution: a liquid metal sheet substrate thermal conductive sheet, comprising a liquid metal sheet, a first thermal conductive conductive silicone layer, a second thermal conductive conductive silicone layer and a third thermal conductive conductive silicone layer, the first thermal conductive conductive silicone layer is attached to the top of the liquid metal sheet, the second thermal conductive conductive silicone layer is attached to the bottom of the liquid metal sheet, and the third thermal conductive conductive silicone layer is wrapped on the four sides of the liquid metal sheet.

[0005] The above-mentioned liquid metal sheet substrate thermal conductive sheet encapsulates the liquid metal sheet through the first thermal conductive conductive silicone layer, the second thermal conductive conductive silicone layer and the third thermal conductive conductive silicone layer, so that the liquid metal sheet is wrapped in the first thermal conductive conductive silicone layer, the second thermal conductive conductive silicone layer and the third thermal conductive conductive silicone layer. The formed liquid metal sheet substrate thermal conductive sheet not only does not overflow when heated, but also has good thermal conductivity, and has good shock absorption and compression resilience.

[0006] In one of the embodiments, the thickness of the liquid metal sheet of the liquid metal sheet substrate thermal conductive sheet is 0.2-10 mm.

[0007] In one embodiment, the thickness of the first thermally conductive and electrically conductive silicone layer of the liquid metal sheet substrate thermal conductive sheet is 0.5-1 mm.

[0008] In one of the embodiments, the thickness of the second thermally conductive and electrically conductive silicone layer of the liquid metal sheet substrate thermal conductive sheet is 0.5-2 mm.

[0009] In one of the embodiments, the thickness of the third thermally conductive and electrically conductive silicone layer of the liquid metal sheet substrate thermal conductive sheet is 1-3 mm.

[0010] A mold for making a liquid metal sheet substrate thermal conductive sheet, comprising a mold frame and a fixing component for making the liquid metal sheet substrate thermal conductive sheet, wherein the mold frame is provided with a through hole extending vertically and used for placing the liquid metal sheet, the top and bottom of the mold frame are respectively arranged flush, the fixing component is slidably connected to the four sides of the mold frame, and the fixing component is used to fix and support the liquid metal sheet in the mold frame.

[0011] The beneficial effects of this application are:

[0012] The present application provides a liquid metal sheet substrate thermal conductive sheet, which encapsulates the liquid metal sheet through a first thermal conductive conductive silicone layer, a second thermal conductive conductive silicone layer and a third thermal conductive conductive silicone layer, so that the liquid metal sheet is wrapped in the first thermal conductive conductive silicone layer, the second thermal conductive conductive silicone layer and the third thermal conductive conductive silicone layer. The formed liquid metal sheet substrate thermal conductive sheet not only does not overflow when heated, but also has good thermal conductivity, and has good shock absorption and compression resilience.

[0013] The thermally conductive silicone of the first thermally conductive conductive silicone layer, the second thermally conductive conductive silicone layer and the third thermally conductive conductive silicone layer have a relatively low hardness and not only have excellent shock absorption, compression resilience, interface wettability and conformability, but also have good thermal conductivity. When packaged together with a liquid metal sheet with high thermal conductivity, the thermal conductivity effect is greatly improved.

[0014] The mold for manufacturing the liquid metal sheet substrate heat conducting sheet not only has a simple structure, but also improves the manufacturing efficiency of the liquid metal sheet substrate heat conducting sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of a liquid metal sheet substrate heat conducting sheet according to an embodiment of the present application;

[0016] Figure 2 A schematic diagram of a mold for manufacturing a liquid metal sheet substrate thermal conductive sheet according to an embodiment of the present application;

[0017] in:

[0018] 1. Liquid metal sheet; 2. First thermally conductive and electrically conductive silicone layer; 3. Second thermally conductive and electrically conductive silicone layer; 4. Third thermally conductive and electrically conductive silicone layer; 5. Mold frame; 6. First release film; 7. Second release film; 8. Fixed component. DETAILED DESCRIPTION

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0020] like Figure 1As shown, an embodiment of the present application provides a liquid metal sheet substrate thermal conductive sheet, comprising a liquid metal sheet 1, a first thermally conductive conductive silicone layer 2, a second thermally conductive conductive silicone layer 3 and a third thermally conductive conductive silicone layer 4, the first thermally conductive conductive silicone layer 2 is attached to the top of the liquid metal sheet, the second thermally conductive conductive silicone layer 3 is attached to the bottom of the liquid metal sheet, and the third thermally conductive conductive silicone layer 4 is wrapped on the four sides of the liquid metal sheet.

[0021] Specifically, the second release film 7 is attached to the bottom of the mold frame 5, and the liquid metal sheet 1 is fixed in the mold frame 5 through the fixing components 8 such as the fixing pins and the supporting pins, so that the top of the liquid metal sheet 1 is spaced 0.5-1mm from the top of the mold frame 5, the bottom of the liquid metal sheet 1 is spaced 0.5-2mm from the bottom of the mold frame 5, and the four sides of the liquid metal sheet 1 are spaced 1-3mm from the mold frame 5. After the liquid metal sheet 1 is fixed, the thermal conductive and conductive silicone is poured into the mold frame 5, and the gap between the mold frame 5 and the liquid metal sheet 1 is filled. After vacuuming and standing to defoam, the first release film 6 is attached to the top of the mold frame 5. After low-temperature hot pressing and vulcanization, the fixing components 8 such as the fixing pins and the supporting pins are removed, and the exposed part of the liquid metal sheet 1 is filled with supplementary materials, and then vulcanization and baking are performed to finally form a liquid metal sheet substrate thermal conductive sheet, and the total thickness of the product is 1.2-13mm. The liquid metal sheet is a block structure.

[0022] Among them, the mixed base material of the thermally conductive and electrically conductive silicone is an addition-type silicone oil system, compounded with spherical metal powder, spherical alumina and carbon fiber or graphene, etc., and diluted with a small amount of organic solvent to adjust the viscosity. The hardness after vulcanization is 20 to 50.

[0023] The thermally conductive silicone layers after the thermally conductive silicone is formed are respectively the first thermally conductive silicone layer 2, the second thermally conductive silicone layer 3 and the third thermally conductive silicone layer 4. The first thermally conductive silicone layer 2 is attached to the top of the liquid metal sheet, the second thermally conductive silicone layer 3 is attached to the bottom of the liquid metal sheet, and the third thermally conductive silicone layer 4 is wrapped on the four sides of the liquid metal sheet. The first thermally conductive silicone layer 2, the second thermally conductive silicone layer 3 and the third thermally conductive silicone layer 4 are coated on the liquid metal sheet 1 to prevent the liquid metal sheet 1 from melting and flowing out to contaminate the electronic components when the operating temperature of the electronic components rises, causing short circuits and burning of the electronic components.

[0024] It combines the advantages of the liquid metal sheet 1 and the thermally conductive and electrically conductive silicone layer, so that the thermal conductivity of the two is superimposed. Take a 2.0T liquid metal sheet substrate thermal conductive sheet sample to test the thermal conductivity coefficient. The thermal conductivity coefficient is tested according to the ASTM-D5470 standard and can reach 10-15W / mk. The thermally conductive and electrically conductive silicone layer is tested using this standard, and the thermal conductivity coefficient generally does not exceed 8W / mk. In addition, in terms of application, the electrically conductive and electrically conductive silicone layer with a hardness of 20-50 has a relatively low hardness, good compression shock absorption effect, and good gap filling ability. It can be widely used in electronic products, CPUs, chips or PCB boards and other electronic components.

[0025] The liquid metal sheet substrate heat conductive sheet not only does not overflow when heated, but also has good heat conduction effect, good shock absorption and compression resilience.

[0026] like Figure 1 As shown, in one embodiment, the thickness of the liquid metal sheet 1 of the liquid metal sheet substrate heat conductive sheet is 0.2-10 mm. Preferably, the liquid metal sheet 1 is 0.2 mm, 5 mm and 10 mm. The liquid metal sheet 1 of this thickness cooperates with the first heat conductive and conductive silicone layer 2, the second heat conductive and conductive silicone layer 3 and the third heat conductive and conductive silicone layer 4 to greatly improve the heat conduction effect.

[0027] like Figure 1 As shown, in one embodiment, the thickness of the first thermally conductive and electrically conductive silicone layer 2 of the liquid metal sheet substrate thermal conductive sheet is 0.5-1 mm. Preferably, the first thermally conductive and electrically conductive silicone layer 2 is 0.5 mm, 0.8 mm and 1 mm. The first thermally conductive and electrically conductive silicone layer 2 of this thickness cooperates with the liquid metal sheet 1 to greatly improve the thermal conductivity effect.

[0028] like Figure 1 As shown, in one embodiment, the thickness of the second thermally conductive and electrically conductive silicone layer 3 of the liquid metal sheet substrate thermal conductive sheet is 0.5-2 mm. Preferably, the second thermally conductive and electrically conductive silicone layer 3 is 0.5 mm, 1.2 mm and 2 mm. The second thermally conductive and electrically conductive silicone layer 3 of this thickness cooperates with the liquid metal sheet 1 to greatly improve the thermal conductivity effect.

[0029] like Figure 1 As shown, in one embodiment, the thickness of the third thermally conductive and electrically conductive silicone layer 4 of the liquid metal sheet substrate thermal conductive sheet is 1-3 mm. Preferably, the third thermally conductive and electrically conductive silicone layer 4 is 1 mm, 1.5 mm and 3 mm. The third thermally conductive and electrically conductive silicone layer 4 of this thickness cooperates with the liquid metal sheet 1 to greatly improve the thermal conductivity effect.

[0030] like Figure 2As shown, a mold for making a liquid metal sheet substrate thermal conductive sheet includes a mold frame 5 and a fixing component 8 for making the liquid metal sheet substrate thermal conductive sheet. The mold frame 5 is provided with a through hole that runs through from top to bottom for placing the liquid metal sheet 1. The top and bottom of the mold frame 5 are respectively set flush. The fixing component 8 is slidably connected to the four sides of the mold frame 5. The fixing component 8 is used to fix and support the liquid metal sheet 1 in the mold frame 5.

[0031] Specifically, the size of the mold frame 5 can be adjusted according to the size of the liquid metal sheet 1, and the mold frame 5 is a square structure with a hollow center. A second release film 7 is attached to the bottom of the mold frame 5, and the liquid metal sheet 1 is fixed in the mold frame 5 through fixing components 8 such as fixing pins and support pins, so that the top of the liquid metal sheet 1 is spaced 0.5-1mm from the top of the mold frame 5, the bottom of the liquid metal sheet 1 is spaced 0.5-2mm from the bottom of the mold frame 5, and the four sides of the liquid metal sheet 1 are spaced 1-3mm from the mold frame 5. After the liquid metal sheet 1 is fixed, the thermally conductive and electrically conductive silicone is poured into the mold frame 5. After filling the gap between the mold frame 5 and the liquid metal sheet 1, it is evacuated and left to stand for defoaming, and then the first release film 6 is attached to the top of the mold frame 5. After low-temperature hot pressing and vulcanization, the fixing needles, support needles and other fixing components 8 are removed, and the exposed parts of the liquid metal sheet 1 are filled with materials, and then vulcanization and baking are performed to finally form a liquid metal sheet substrate thermal conductive sheet. The total thickness of the product is 1.2-13mm.

[0032] The cooperation between the mold frame 5 and the fixing assembly 8 is not only convenient for fixing the liquid metal sheet 1 , but also convenient for molding the liquid metal sheet 1 and the thermally and electrically conductive silica gel.

[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A liquid metal sheet substrate thermal conductive sheet, characterized in that: The invention comprises a liquid metal sheet (1), a first thermally conductive and electrically conductive silicone layer (2), a second thermally conductive and electrically conductive silicone layer (3) and a third thermally conductive and electrically conductive silicone layer (4), wherein the first thermally conductive and electrically conductive silicone layer (2) is attached to the top of the liquid metal sheet, the second thermally conductive and electrically conductive silicone layer (3) is attached to the bottom of the liquid metal sheet, and the third thermally conductive and electrically conductive silicone layer (4) is wrapped around four sides of the liquid metal sheet.

2. The liquid metal sheet substrate thermal conductive sheet according to claim 1, characterized in that: The thickness of the liquid metal sheet (1) is 0.2-10 mm.

3. The liquid metal sheet substrate thermal conductive sheet according to claim 1, characterized in that: The thickness of the first thermally and electrically conductive silicone layer (2) is 0.5-1 mm.

4. The liquid metal sheet substrate thermal conductive sheet according to claim 1, characterized in that: The thickness of the second thermally and electrically conductive silicone layer (3) is 0.5-2 mm.

5. The liquid metal sheet substrate thermal conductive sheet according to claim 1, characterized in that: The thickness of the third thermally and electrically conductive silicone layer (4) is 1-3 mm.

6. A mold for making a liquid metal sheet substrate thermal conductive sheet, characterized in that: The invention comprises a mold frame (5) and a fixing assembly (8) for manufacturing a liquid metal sheet substrate heat conducting sheet. The mold frame (5) is provided with a through hole extending vertically and used for placing the liquid metal sheet (1). The top and bottom of the mold frame (5) are respectively arranged flush. The fixing assembly (8) is slidably connected to the four side surfaces of the mold frame (5). The fixing assembly (8) is used to fix and support the liquid metal sheet (1) in the mold frame (5).

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