Semiconductor furnace tube device

Abstract

The utility model discloses a semiconductor furnace tube device which comprises a furnace body, a furnace body opening is arranged at the bottom of the furnace body, a plurality of furnace door mechanisms are arranged below the furnace body, each furnace door mechanism comprises a furnace door, a wafer boat frame, a lifting assembly and a horizontal position adjusting assembly, and the wafer boat frame is arranged on the furnace door and used for loading wafers. The lifting assembly is used for driving the furnace door to ascend and descend so that the furnace door can be in butt joint with or separated from the furnace body opening. The horizontal position adjusting assembly is used for driving the furnace door to horizontally adjust the position to align with or deviate from the furnace body opening. The semiconductor furnace tube device is provided with a plurality of sets of furnace door mechanisms, the structure is compact, other sets of furnace door mechanisms can perform cooling or feeding and discharging operation in the heating process of one set of furnace door mechanism, the process waiting time of two adjacent batches of products is shortened on the premise that the number of equipment is not increased, feeding and discharging are more convenient and faster, and the production efficiency is improved. The production efficiency is improved, and the equipment productivity is improved. The semiconductor furnace tube device provided by the utility model has the advantages of compact structure, high production efficiency and high productivity.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a semiconductor furnace tube device. Background Art

[0002] In the semiconductor manufacturing process, especially in semiconductor heat treatment and thin film processes, vertical furnaces have the advantages of small footprint, high degree of automation, and high processing efficiency, and are widely used by semiconductor manufacturers in oxidation, annealing furnaces, thin film deposition and other processes. At present, the furnace tube equipment is generally designed with a single furnace door or a horizontal double furnace door. This mechanism has some problems. Although the single furnace door structure has a large internal operating space, the waiting time for cooling is long, the feeding and unloading efficiency is low, and the equipment capacity is low. Although the high-temperature furnace tube device with a horizontal double furnace door has a double furnace door structure, due to the horizontal placement of the furnace door, it is easy to cause heat loss and uneven temperature distribution in the furnace. The degree of automation of feeding and unloading is low, and most of them use manual placement and unloading. At the same time, the horizontal furnace tube equipment occupies a much larger area than the vertical equipment, and the process effect is not as good as the vertical furnace tube.

[0003] Chinese patent document announcement number CN115332125A discloses a semiconductor process furnace, including a furnace body, a furnace door assembly, a first air intake assembly and an exhaust pipe, the bottom of the furnace body has an opening, the furnace door assembly is arranged at the bottom of the furnace body, and the furnace door assembly is used to cover the opening. Although the process furnace has a large internal operating space, the applicant found that there are some disadvantages in this technical solution: the process furnace is only provided with a single furnace door, and after one process operation is completed, it is necessary to wait for the temperature to be lowered before the next process operation can be carried out, the waiting time is long, the material loading and unloading efficiency is low, and the equipment capacity is low. Utility Model Content

[0004] The utility model aims to solve the problems existing in the prior art during use and provides a semiconductor furnace tube device with compact structure, high production efficiency and high production capacity.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] A semiconductor furnace tube device comprises a furnace body, a furnace opening is arranged at the bottom of the furnace body, a plurality of furnace door mechanisms are arranged below the furnace body, the furnace door mechanism comprises a furnace door, a wafer boat rack, a lifting assembly and a horizontal position adjustment assembly, the wafer boat is mounted on the furnace door for loading wafers, the lifting assembly is used to drive the furnace door to lift and lower so that the furnace door is docked with or separated from the furnace opening, and the horizontal position adjustment assembly is used to drive the furnace door to adjust its position horizontally so as to align with or deviate from the furnace opening.

[0007] As a further improvement of the above technical solution:

[0008] The lifting assembly comprises a fixed vertical plate and a lifting seat slidably arranged on the fixed vertical plate, and the furnace door is arranged on the lifting seat.

[0009] The horizontal position adjustment assembly includes a first driving member, a first rotating shaft and a swing arm. The swing arm is rotationally connected to the lifting seat through the first rotating shaft. The furnace door is arranged on the swing arm. The first driving member is used to drive the first rotating shaft to rotate.

[0010] The horizontal position adjustment assembly further includes a first driving wheel, a first driven wheel, and a first synchronous belt wound between the first driving wheel and the first driven wheel. The first driving wheel is connected to the first driving member, and the first driven wheel is coaxially connected to the first rotating shaft.

[0011] The diameter of the first driving wheel is smaller than the diameter of the first driven wheel.

[0012] The semiconductor furnace tube device also includes a rotating assembly, which includes a second driving member and a second rotating shaft. The second rotating shaft passes through the furnace door and is connected to the crystal boat frame and can rotate relative to the furnace door. The second driving member is used to drive the second rotating shaft to rotate.

[0013] The rotating assembly further includes a second driving wheel, a second driven wheel, and a second synchronous belt wound between the second driving wheel and the second driven wheel. The second driving wheel is connected to the second driving member, and the second driven wheel is coaxially connected to the second rotating shaft.

[0014] The rotating assembly also includes a buffer spring, which is connected between the furnace door and the swing arm.

[0015] The second rotating shaft is a magnetic fluid rotating shaft and is sealed with the furnace door.

[0016] The semiconductor furnace tube device also includes a loading and unloading assembly, which includes a fixed column and a transfer member slidably arranged on the fixed column.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] The semiconductor furnace tube device of the utility model has a compact structure by setting multiple sets of furnace door mechanisms. When one set of furnace door mechanisms is heating up, other sets of furnace door mechanisms are cooling or loading and unloading operations. Without increasing the number of equipment, the process waiting time of two adjacent batches of products can be reduced, making loading and unloading more convenient and quick, improving production efficiency, and increasing equipment capacity; by cooperating with the horizontal position adjustment component and the lifting component, multiple sets of furnace door mechanisms can be operated independently without interference; by setting multiple sets of wafer boat racks, the number of wafers stored inside the equipment is greatly increased. The semiconductor furnace tube device of the utility model has the advantages of compact structure, high production efficiency and high capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is an axonometric diagram of the semiconductor furnace tube device of the utility model.

[0020] Figure 2 It is a front view of the semiconductor furnace tube device of the utility model.

[0021] Figure 3 It is a side view of the semiconductor furnace tube device of the utility model.

[0022] Figure 4 It is a top view of the semiconductor furnace tube device of the utility model.

[0023] Figure 5 The utility model is an axonometric diagram of a furnace door mechanism in a semiconductor furnace tube device during a process.

[0024] Figure 6 The utility model is a front view of a furnace door mechanism in a semiconductor furnace tube device during a process.

[0025] Figure 7 yes Figure 5 Enlarged view of point A in the middle.

[0026] Figure 8 yes Figure 6 Enlarged view of point B in the middle.

[0027] Legend: 1. Furnace body; 11. Furnace body opening; 2. Furnace door; 3. Crystal boat rack; 4. Lifting assembly; 41. Fixed vertical plate; 42. Lifting seat; 5. Horizontal position adjustment assembly; 51. First driving member; 52. First rotating shaft; 53. Swing arm; 54. First driving wheel; 55. First driven wheel; 56. First synchronous belt; 6. Rotating assembly; 61. Second driving member; 62. Second rotating shaft; 63. Second driving wheel; 64. Second driven wheel; 65. Second synchronous belt; 66. Mounting base plate; 67. Buffer spring; 7. Loading and unloading assembly; 71. Fixed column; 72. Transfer member; 8. Wafer. DETAILED DESCRIPTION

[0028] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] In the present invention, unless otherwise clearly specified and limited, the terms "assemble", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] like Figures 1 to 6 As shown, the semiconductor furnace tube device of this embodiment includes a furnace body 1, a furnace opening 11 is provided at the bottom of the furnace body 1, and multiple sets of furnace door mechanisms are provided below the furnace body 1. The furnace door mechanism includes a furnace door 2, a wafer boat rack 3, a lifting assembly 4 and a horizontal position adjustment assembly 5. The wafer boat rack 3 is arranged on the furnace door 2 for loading wafers 8. The lifting assembly 4 is used to drive the furnace door 2 to lift and lower so that the furnace door 2 is docked or separated from the furnace opening 11. The horizontal position adjustment assembly 5 is used to drive the furnace door 2 to adjust its position horizontally to align with or deviate from the furnace opening 11.

[0033] The semiconductor furnace tube device of the present embodiment has two sets of furnace door mechanisms, which are located below the furnace body 1. The crystal boat rack 3 of the first set of furnace door mechanisms is used to load the wafer 8. After the loading is completed, the lifting component 4 drives the furnace door 2 to rise so that the furnace door 2 is docked with the furnace body opening 11, and the crystal boat rack 3 loaded with the wafer 8 is extended into the chamber of the furnace body 1 for a heat treatment process. At this time, the second set of furnace door mechanisms is used to load the material. After the process is completed, the lifting component 4 drives the furnace door 2 to descend so that the furnace door 2 is separated from the furnace body opening 11, and the horizontal position adjustment component 5 drives the furnace door 2 to adjust its horizontal position away from the bottom of the furnace body opening 11 to avoid the other furnace door 2. The second set of furnace door mechanism drives the second set of furnace door 2 to adjust its position horizontally to the right below the furnace opening 11 through the second set of horizontal position adjustment components 5 to align with the furnace opening 11, and the second set of lifting components 4 drives the second set of furnace door 2 to rise so that the second set of furnace door 2 is docked with the furnace opening 11, and the second set of wafer boat racks 3 loaded with wafers 8 are extended into the furnace chamber 1 for heat treatment process. At this time, the wafers 8 on the wafer boat racks 3 of the first set of furnace door mechanism are cooled and unloaded, and the above actions are repeated to achieve continuous operation of the two sets of furnace door mechanisms. The semiconductor furnace tube device of this embodiment is compact in structure by setting multiple sets of furnace door mechanisms. During the heating process of one set of furnace door mechanisms, other sets of furnace door mechanisms can be cooled or loaded and unloaded. Without increasing the number of equipment, the waiting time of the process of two adjacent batches of products can be reduced, making loading and unloading more convenient and quick, improving production efficiency, and increasing equipment capacity; through the cooperation of the horizontal position adjustment component 5 and the lifting component 4, multiple sets of furnace door mechanisms can be operated independently without interference; by setting multiple sets of wafer boat racks 3, the number of wafers 8 stored inside the equipment is greatly increased. The semiconductor furnace tube device of this embodiment has the advantages of compact structure, high production efficiency and high production capacity.

[0034] Preferably, the horizontal position adjustment component 5 in this embodiment is a rotating component, which adjusts the horizontal position of the furnace door 2 by rotation, and has a simple structure. In other embodiments, the horizontal position adjustment component 5 can also be a translation component, which adjusts the horizontal position of the furnace door 2 by translation.

[0035] Furthermore, in this embodiment, the lifting assembly 4 includes a fixed vertical plate 41 and a lifting seat 42 slidably mounted on the fixed vertical plate 41, and the furnace door 2 is arranged on the lifting seat 42. The furnace door 2 is installed on the lifting seat 42 slidably mounted on the fixed vertical plate 41, so that loading and unloading of materials is more convenient.

[0036] Furthermore, in this embodiment, if Figure 7 and Figure 8As shown, the horizontal position adjustment assembly 5 includes a first driving member 51, a first rotating shaft 52 and a swing arm 53. The swing arm 53 is rotatably connected to the lifting seat 42 through the first rotating shaft 52. The furnace door 2 is arranged on the swing arm 53. The first driving member 51 is used to drive the first rotating shaft 52 to rotate. The swing arm 53 is rotatably connected to the lifting seat 42 through the first rotating shaft 52, that is, the swing arm 53 rotates around the first rotating shaft 52 to be hinged with the lifting seat 42, so that the furnace door 2 has the freedom of rotation in two directions of the plane, which can align and separate the furnace door 2 and the furnace body opening 11, and make the two furnace doors 2 avoid each other to avoid interference. Preferably, the first driving member 51 is a stepping motor, and the control is more precise.

[0037] Furthermore, in this embodiment, the horizontal position adjustment component 5 also includes a first driving wheel 54, a first driven wheel 55, and a first synchronous belt 56 wound between the first driving wheel 54 and the first driven wheel 55. The first driving wheel 54 is connected to the first driving member 51, and the first driven wheel 55 is coaxially connected to the first rotating shaft 52. The pulley structure is simple in structure. By driving the first rotating shaft 52 to rotate through the pulley structure, the control accuracy and reaction speed of the equipment can be improved. When the load is too large, the pulley structure can provide overload protection, and the pulley will slip to protect the motor from damage. Preferably, the first driving wheel 54, the first driven wheel 55 and the first driving member 51 are all arranged on the swing arm 53, and the structure is simple.

[0038] Furthermore, in this embodiment, the diameter of the first driving wheel 54 is smaller than the diameter of the first driven wheel 55. The wafer boat rack 3 loaded with wafers 8 is placed on the furnace door 2 and is heavy. By setting the diameter of the first driving wheel 54 to be smaller than the diameter of the first driven wheel 55, a greater driving torque can be provided while saving space.

[0039] Further, in this embodiment, the semiconductor furnace tube device also includes a rotating assembly 6, which includes a second driving member 61 and a second rotating shaft 62 provided on the swing arm 53. The second rotating shaft 62 passes through the furnace door 2 and is connected to the crystal boat rack 3, and can rotate relative to the furnace door 2. The second driving member 61 is used to drive the second rotating shaft 62 to rotate. The second rotating shaft 62 passes through the furnace door 2 and is connected to the crystal boat rack 3, so that the crystal boat rack 3 can rotate around the second rotating shaft 62. When the crystal boat rack 3 rises to the chamber of the furnace body 1 for processing, the second rotating shaft 62 can drive the crystal boat rack 3 and the wafer 8 to rotate in the furnace body 1, thereby improving the uniformity of the temperature field and flow field inside the furnace body 1, and improving the overall process effect of the device, so that the device can be used for large-size wafers such as 6 inches, 8 inches, and 12 inches. Preferably, the crystal boat rack 3 is coaxially connected to the second rotating shaft 62, that is, the second rotating shaft 62 drives the crystal boat rack 3 to rotate, the structure is more stable, and the process effect is better. Preferably, the second driving member 61 is a stepping motor, and the control is more precise.

[0040] Furthermore, in the present embodiment, the rotating assembly 6 further includes a second driving wheel 63, a second driven wheel 64, and a second synchronous belt 65 wound between the second driving wheel 63 and the second driven wheel 64, the second driving wheel 63 is connected to the second driving member 61, and the second driven wheel 64 is coaxially connected to the second rotating shaft 62. The pulley structure is simple in structure, and the second rotating shaft 62 is driven to rotate by the pulley structure, which can improve the control accuracy and reaction speed of the equipment. When the load is too large, the pulley structure can provide overload protection, and the pulley will slip to protect the motor from damage. Preferably, the second driving wheel 63, the second driven wheel 64 and the second driving member 61 are all arranged on the swing arm 53, and the structure is simple.

[0041] Furthermore, in this embodiment, the rotating assembly 6 further includes a buffer spring 67, which is connected between the furnace door 2 and the swing arm 53. The buffer spring 67 is used to provide a buffer when the furnace door 2 is docked with the furnace body opening 11, to avoid collision when the furnace door 2 is docked with the furnace body opening 11, and can also provide a buffer when the rotating assembly 6 drives the crystal boat rack 3 to rotate, reduce vibration, and improve sealing. Preferably, a mounting base plate 66 is also provided on the swing arm 53, and the buffer spring 67 is connected between the furnace door 2 and the mounting base plate 66 for easy loading and unloading.

[0042] Furthermore, in this embodiment, the second rotating shaft 62 is a magnetic fluid rotating shaft, and is sealed with the furnace door 2. The magnetic fluid rotating shaft can maintain a sealing effect when the shaft rotates at a high speed, so that the gas or other substances in the chamber of the furnace body 1 will not leak, thereby ensuring the overall process effect of the device.

[0043] Further, in the present embodiment, the semiconductor furnace tube device further includes a loading and unloading assembly 7, and the loading and unloading assembly 7 includes a fixed column 71 and a transfer member 72 slidably mounted on the fixed column 71. The loading and unloading transfer is performed by the transfer member 72, and the transfer efficiency is high. In the present embodiment, the transfer member 72 is a manipulator. Preferably, the fixed column 71 is arranged in parallel with the fixed upright plate 41, and the transfer member 72 can be raised and lowered to perform loading and unloading operations on the wafers 8 on the crystal boat rack 3 along the vertical direction by arranging the fixed column 71 in parallel with the fixed upright plate 41, with a simple structure and high transfer efficiency. Further preferably, the fixed column 71 is located between the two sets of fixed upright plates 41, and the loading and unloading stations of the two sets of furnace door mechanisms are the same, so that the loading and unloading of the two sets of furnace door mechanisms can be completed with one set of loading and unloading assembly 7, with a simple structure and high equipment utilization rate.

[0044] In the semiconductor furnace tube device of the present embodiment, the furnace door 2 has three operating positions, the loading and unloading position (i.e., the furnace door 2 is separated from the furnace body opening 11, the furnace door 2 is located directly below the furnace body opening 11, and is aligned with the furnace body opening 11), the cooling waiting position (i.e., the furnace door 2 is separated from the furnace body opening 11, the furnace door 2 is located below the furnace body opening 11, and is offset from the furnace body opening 11) and the process position (i.e., the position when the furnace door 2 is docked with the furnace body opening 11). The loading and unloading positions and the process positions of the two sets of furnace door mechanisms are the same, and the cooling waiting positions of the two sets of furnace door mechanisms are different.

[0045] The semiconductor furnace tube device of this embodiment mainly includes three operation processes, namely, the loading process, the unloading process and the process process, which are specifically as follows:

[0046] Loading process: the first set of furnace doors 2 moves through the first set of horizontal position adjustment components 5, so that the first set of furnace doors 2 and the first set of wafer boat racks 3 move as a whole to the loading waiting station, and the transfer member 72 grabs 5 wafers 8 from the external wafer box each time and places them on the top of the first set of wafer boat racks 3, repeats the process of grabbing and placing wafers, and places them on the first set of wafer boat racks 3 in turn, from top to bottom, until the wafers 8 fill the entire first set of wafer boat racks 3, and the loading is completed;

[0047] Process; the first set of lifting components 4 raises the first set of furnace doors 2 to the position where the first set of furnace doors 2 and the furnace body opening 11 are fitted, that is, the process station. The furnace body 1 is heated, kept warm and cooled according to the process index requirements. In this process, in order to improve the uniformity of the temperature field and flow field inside the process tube, the first set of rotating components 6 drives the wafers 8 on the first set of wafer boat racks 3 to rotate in the furnace body 1. At the same time, in order to improve the loading and unloading efficiency, the second set of wafer boat racks 3 are loaded while the first set of furnace doors 2 rises to the process station. The main process is as follows: The second set of furnace doors 2 The second set of horizontal position adjustment components 5 are moved so that the second set of furnace door 2 and the second set of wafer boat racks 3 are moved as a whole to the loading waiting station, and the transfer member 72 grabs 5 wafers from the external wafer box each time and places them on the second set of wafer boat racks 3, repeats the wafer grabbing and placing process, and sequentially places them on the first set of wafer boat racks 3 from top to bottom until the entire second set of wafer boat racks 3 are filled, and at the same time, the second set of furnace door 2 is moved to the second set of furnace door cooling waiting station by the second set of horizontal position adjustment components 5 to wait for loading;

[0048] Unloading process: After the wafers 8 on the first set of furnace door mechanisms complete the process, the high temperature is lowered. First, the first set of furnace doors 2 are driven by the first set of lifting components 4 to move to the loading and unloading stations. Then, the first set of furnace doors 2 are moved to the first set of furnace door cooling waiting stations for cooling through the first set of horizontal position adjustment components 5. Then, the second set of furnace doors 2 are moved through the second set of horizontal position adjustment components 5, so that the second set of furnace doors 2 and the second set of wafer boat racks 3 are moved as a whole to the loading and unloading waiting stations. Then, the second set of lifting components 4 raises the second set of furnace doors 2 to the position where the second set of furnace doors 2 fit with the furnace body opening 11, that is, the process position, and the process is started. After the temperature of the wafers 8 on the first set of wafer boat racks 3 drops to a suitable temperature, the first set of furnace doors 2 are moved from the cooling waiting station to the loading and unloading waiting station through the first set of horizontal position adjustment components 5, and the transfer member 72 starts to take wafers from the bottom to the top, taking 5 wafers from the first wafer boat each time and placing them in the external wafer box until all wafers on the first set of wafer boat racks 3 are taken.

[0049] After unloading is completed, the loading process and process can be repeated to achieve continuous operation.

[0050] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model has been disclosed as above in the preferred embodiment, it is not used to limit the utility model. Any technician familiar with the field can make many possible changes and modifications to the technical solution of the utility model by using the methods and technical contents disclosed above without departing from the spirit and technical solution of the utility model, or modify it into an equivalent embodiment of equivalent changes. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model, still fall within the scope of protection of the technical solution of the utility model.

Claims

1. A semiconductor furnace tube device, characterized in that: The invention comprises a furnace body (1), wherein a furnace body opening (11) is provided at the bottom of the furnace body (1), and a plurality of furnace door mechanisms are provided below the furnace body (1), wherein the furnace door mechanisms comprise a furnace door (2), a wafer boat rack (3), a lifting assembly (4) and a horizontal position adjustment assembly (5), wherein the wafer boat rack (3) is provided on the furnace door (2) for loading wafers (8), the lifting assembly (4) is used to drive the furnace door (2) to lift and lower so that the furnace door (2) is docked with or separated from the furnace body opening (11), and the horizontal position adjustment assembly (5) is used to drive the furnace door (2) to adjust its position horizontally so as to align with or deviate from the furnace body opening (11).

2. The semiconductor furnace tube device according to claim 1, characterized in that: The lifting assembly (4) comprises a fixed vertical plate (41) and a lifting seat (42) slidably arranged on the fixed vertical plate (41), and the furnace door (2) is arranged on the lifting seat (42).

3. The semiconductor furnace tube device according to claim 2, characterized in that: The horizontal position adjustment assembly (5) comprises a first driving member (51), a first rotating shaft (52) and a swing arm (53); the swing arm (53) is rotationally connected to the lifting seat (42) via the first rotating shaft (52); the furnace door (2) is arranged on the swing arm (53); and the first driving member (51) is used to drive the first rotating shaft (52) to rotate.

4. The semiconductor furnace tube device according to claim 3, characterized in that: The horizontal position adjustment assembly (5) further comprises a first driving wheel (54), a first driven wheel (55), and a first synchronous belt (56) wound between the first driving wheel (54) and the first driven wheel (55), wherein the first driving wheel (54) is connected to the first driving member (51), and the first driven wheel (55) is coaxially connected to the first rotating shaft (52).

5. The semiconductor furnace tube device according to claim 4, characterized in that: The diameter of the first driving wheel (54) is smaller than the diameter of the first driven wheel (55).

6. The semiconductor furnace tube device according to claim 3, characterized in that: The semiconductor furnace tube device also includes a rotating assembly (6), which includes a second driving member (61) and a second rotating shaft (62). The second rotating shaft (62) passes through the furnace door (2) and is connected to the crystal boat rack (3), and can rotate relative to the furnace door (2). The second driving member (61) is used to drive the second rotating shaft (62) to rotate.

7. The semiconductor furnace tube device according to claim 6, characterized in that: The rotating assembly (6) further comprises a second driving wheel (63), a second driven wheel (64), and a second synchronous belt (65) wound between the second driving wheel (63) and the second driven wheel (64), wherein the second driving wheel (63) is connected to the second driving member (61), and the second driven wheel (64) is coaxially connected to the second rotating shaft (62).

8. The semiconductor furnace tube device according to claim 6 or 7, characterized in that: The rotating assembly (6) further comprises a buffer spring (67), wherein the buffer spring (67) is connected between the furnace door (2) and the swing arm (53).

9. The semiconductor furnace tube device according to claim 6 or 7, characterized in that: The second rotating shaft (62) is a magnetic fluid rotating shaft and is sealed with the furnace door (2).

10. The semiconductor furnace tube device according to any one of claims 1 to 7, characterized in that: The semiconductor furnace tube device further comprises a loading and unloading assembly (7), wherein the loading and unloading assembly (7) comprises a fixed column (71) and a transfer member (72) slidably arranged on the fixed column (71).

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