Semiconductor wafer thickness detection mechanism

Abstract

The utility model discloses a semiconductor wafer thickness detection mechanism, which comprises a bottom plate, the top of the bottom plate is provided with a supporting plate, the supporting plate is connected with the bottom plate through an adjusting assembly, the upper surface of the supporting plate is provided with a placing plate, and a limiting assembly is arranged between the supporting plate and the placing plate, so that the placing plate is positioned. A plurality of grooves are formed in the upper surface of the containing plate, two fixing plates are fixedly connected to the upper surface of the bottom plate, a linear motor is fixedly connected between the two fixing plates, and a supporting frame is fixedly connected to the bottom of the linear motor. According to the utility model, a plurality of semiconductor wafers can be detected at the same time, the time is saved, the detection efficiency of the semiconductor wafers is improved, the semiconductor wafers with different thicknesses can be detected, the use effect of the detection mechanism is improved, the semiconductor wafers with different shapes can be placed and detected, and the detection efficiency is improved. And the use effect of the detection mechanism is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafers, in particular to a detection mechanism for the thickness of semiconductor wafers. Background Art

[0002] Semiconductor wafers are the carriers for manufacturing chips. Because the raw material is silicon, they are also called silicon wafers. After the semiconductor wafers are produced, in order to make them meet the standards, the thickness of the semiconductor wafers needs to be tested.

[0003] After searching, a Chinese patent with the announcement number CN216694746U discloses a semiconductor wafer thickness detection device, including a bottom plate, the center of the top of the bottom plate is fixedly connected to the placement box, which can prevent the crystal from being damaged by hard collision and ensure its service life. However, there is still the following defect: during the detection, only one semiconductor wafer can be detected at a time, resulting in a waste of time. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a semiconductor wafer thickness detection mechanism.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor wafer thickness detection mechanism comprises a base plate, a support plate is provided on the top of the base plate, the support plate is connected to the base plate through an adjusting component, a placement plate is placed on the upper surface of the support plate, a limit assembly is provided between the support plate and the placement plate to position the placement plate, a plurality of grooves are provided on the upper surface of the placement plate, two fixing plates are fixedly connected to the upper surface of the base plate, a linear motor is fixedly connected between the two fixing plates, a support frame is fixedly connected to the bottom of the linear motor, two springs are fixedly connected to one side of the support frame, one end of the two springs is fixedly connected to the detection plate, a contact switch is fixedly connected to one side of the support frame, the contact switch is electrically connected to the linear motor, a detection block is provided on one side of the detection plate, a power assembly is provided on one side of the detection plate to enable the detection block to move horizontally along the detection plate, and a supporting component is provided on the other side of the detection plate to support the detection plate.

[0007] As a further solution of the utility model, the adjustment assembly includes a first threaded rod, a threaded hole is opened on the upper surface of the base plate, the first threaded rod is threadedly connected in the threaded hole, the first threaded rod is rotatably connected to the support plate, and a guide component is provided at the bottom of the support plate to enable the support plate to move vertically.

[0008] As a further solution of the utility model, the guide component is a guide rod, the guide rod is fixedly connected to the bottom of the support plate, and the guide rod passes through the bottom plate.

[0009] As a further solution of the utility model, the limit assembly includes a plurality of card blocks, and the plurality of card blocks are respectively fixedly connected to the four corners of the upper surface of the support plate, and card slots are opened at the four corners of the bottom of the placement plate, and the card blocks are engaged with the card slots.

[0010] As a further solution of the utility model, the power assembly includes two protrusions, and the two protrusions are respectively fixedly connected on both sides of the detection plate, and a second threaded rod is rotatably connected between the two protrusions, and the second threaded rod passes through the detection block and is threadedly connected to the detection block, and one side of one of the protrusions is fixedly connected to a motor, and one end of the motor output shaft passes through the protrusion and is fixed to the second threaded rod.

[0011] As a further solution of the utility model, the supporting component is two positioning columns, the two positioning columns are fixedly connected to the other side of the detection plate, and the two positioning columns pass through the supporting frame.

[0012] As a further solution of the utility model, a scale is fixedly connected to the bottom of the support plate, and the scale passes through the bottom plate.

[0013] As a further solution of the present invention, the groove is any one or more of circular and polygonal shapes.

[0014] The beneficial effects of the utility model are:

[0015] 1. By using the detection plate and the detection block together, the semiconductor wafer is placed in the groove, and then the thickness of the semiconductor wafer is detected by the detection plate and the detection block. Multiple semiconductor wafers can be detected at the same time, saving time and improving the efficiency of semiconductor wafer detection.

[0016] 2. By setting the adjustment component, the adjustment component can adjust the height of the support plate, so that semiconductor wafers of different thicknesses can be placed in the groove, and semiconductor wafers of different thicknesses can be tested, thereby improving the use effect of the detection mechanism.

[0017] 3. By setting the groove, the shape of the groove is any one or more of circular, square, rectangular and polygonal, so that semiconductor wafers of different shapes can be placed and tested, thereby improving the use effect of the detection mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a three-dimensional structural schematic diagram of a semiconductor wafer thickness detection mechanism proposed by the utility model;

[0019] Figure 2 This is a partial enlarged structural schematic diagram of a semiconductor wafer thickness detection mechanism proposed by the utility model;

[0020] Figure 3 The utility model is a schematic diagram of a cross-sectional structure of a placement plate of a semiconductor wafer thickness detection mechanism.

[0021] In the figure: 1. fixing plate; 2. linear motor; 3. groove; 4. support plate; 5. placement plate; 6. support frame; 7. scale; 8. first threaded rod; 9. guide rod; 10. bottom plate; 11. second threaded rod; 12. detection block; 13. bump; 14. spring; 15. detection plate; 16. positioning column; 17. contact switch; 18. card block; 19. card slot. DETAILED DESCRIPTION

[0022] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, so that the embodiments of the application described here, based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application.

[0023] Reference Figure 1-Figure 3A semiconductor wafer thickness detection mechanism includes a base plate 10, a support plate 4 is provided on the top of the base plate 10, the support plate 4 is connected to the base plate 10 through an adjustment component, a placement plate 5 is placed on the upper surface of the support plate 4, a limit component is provided between the support plate 4 and the placement plate 5, so that the placement plate 5 is positioned, a plurality of grooves 3 are provided on the upper surface of the placement plate 5, two fixing plates 1 are fixed to the upper surface of the base plate 10 by bolts, a linear motor 2 is fixed between the two fixing plates 1 by bolts, a support frame 6 is fixed to the bottom of the linear motor 2 by bolts, two springs 14 are welded to one side of the support frame 6, a detection plate 15 is welded to one end of the two springs 14, a contact switch 17 is fixed to one side of the support frame 6 by bolts, and the detection plate 15 can contact the contact switch 17, the contact switch 17 is electrically connected to the linear motor 2, a detection block 12 is provided on one side of the detection plate 15, and the detection block 12 contacts the detection plate 15, and a detection plate 15 is provided on one side A power component is provided to enable the detection block 12 to move horizontally along the detection plate 15. A supporting component is provided on the other side of the detection plate 15 to support the detection plate 15. The semiconductor wafer is placed in the groove 3 on the placement plate 5, and then the placement plate 5 is adjusted to a suitable height by the adjustment component. The support frame 6 is driven to move by the linear motor 2, and the support frame 6 drives the detection plate 15 to move. If the detection plate 15 encounters a thicker semiconductor wafer during the movement, the detection plate 15 will contact the thicker semiconductor wafer and squeeze the spring 14. At the same time, the detection plate 15 will contact the contact switch 17, thereby turning off the linear motor 2. Then the detection block 12 is driven to move by the power component, so that the detection block 12 detects the semiconductor wafers in the same row, thereby detecting the thicker semiconductor wafers in the same row. Multiple semiconductor wafers can be detected at the same time, which saves time and improves the efficiency of semiconductor wafer detection.

[0024] The power assembly includes two bumps 13, which are respectively welded on both sides of the detection plate 15, and a second threaded rod 11 is rotatably connected between the two bumps 13. The second threaded rod 11 passes through the detection block 12 and is threadedly connected to the detection block 12. A motor is fixed to one side of one of the bumps 13 by bolts, and one end of the motor output shaft passes through the bump 13 and is fixed to the second threaded rod 11. When the motor is started, the motor drives the second threaded rod 11 to rotate, and the second threaded rod 11 drives the detection block 12 to move horizontally along the detection plate 15, so that the detection block 12 detects the semiconductor wafer.

[0025] In the utility model, the adjustment component includes a first threaded rod 8, a threaded hole is opened on the upper surface of the base plate 10, the first threaded rod 8 is threadedly connected in the threaded hole, the first threaded rod 8 is rotatably connected to the support plate 4, and a guide component is provided at the bottom of the support plate 4 to enable the support plate 4 to move vertically. The guide component is a guide rod 9, and the guide rod 9 is fixed to the bottom of the support plate 4 by bolts. The guide rod 9 passes through the base plate 10, and the first threaded rod 8 is rotated. The first threaded rod 8 will move through the threaded engagement with the threaded hole, thereby driving the support plate 4 to move vertically upward through the guide rod 9, and the support plate 4 will push the placement plate 5 to move upward. The limit assembly includes a plurality of blocks 18, and the plurality of blocks 18 are respectively welded at the four corners of the upper surface of the support plate 4. The bottom of the placement plate 5 Slots 19 are provided at the four corners of the part, and the card block 18 is engaged with the card slot 19. The engagement of the card block 18 with the card slot 19 can limit the placement plate 5 to prevent the placement plate 5 from moving. The supporting component is two positioning columns 16. The two positioning columns 16 are welded to the other side of the detection plate 15. The two positioning columns 16 pass through the support frame 6. The positioning columns 16 support the detection plate 15 to prevent the detection plate 15 from falling under the action of gravity. The bottom of the support plate 4 is fixed with a scale 7 by bolts, and the scale 7 passes through the bottom plate 10. The height of the placement plate 5 can be observed through the scale 7. The groove 3 is any one or more of a circular and a polygonal shape, and semiconductor wafers of different shapes can be placed and detected, thereby improving the use effect of the detection mechanism.

[0026] Working principle: when it is needed, place the semiconductor wafer into the groove 3 on the placement plate 5, and then rotate the first threaded rod 8. The first threaded rod 8 will move through the threaded engagement with the threaded hole, thereby driving the support plate 4 to move vertically upward through the guide rod 9. The support plate 4 will push the placement plate 5 to move upward. When the placement plate 5 moves upward to a suitable position, the support frame 6 is driven to move by the linear motor 2, and the support frame 6 will drive the detection plate 15 to move. If the detection plate 15 encounters a thicker semiconductor wafer during the movement, the detection plate 15 will contact the thicker semiconductor wafer at this time, and the detection plate 15 will squeeze the spring 14. At the same time, the detection plate 15 will contact the contact switch 17, thereby turning off the linear motor 2, and then starting the motor. The motor drives the second threaded rod 11 to rotate, and the second threaded rod 11 will drive the detection block 12 to move horizontally along the detection plate 15, so that the detection block 12 detects the semiconductor wafers in the same row, thereby detecting the thicker semiconductor wafers in the same row. Multiple semiconductor wafers can be detected at the same time, saving time and improving the efficiency of semiconductor wafer detection.

[0027] The present invention has been described through the above-mentioned embodiments. Those skilled in the art will appreciate that the present invention is not limited to the above-mentioned embodiments, and more modifications may be made according to the teachings of the present invention. These modifications are all within the scope of protection claimed by the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A semiconductor wafer thickness detection mechanism, comprising a base plate (10), characterized in that: A support plate (4) is provided on the top of the base plate (10), and the support plate (4) is connected to the base plate (10) through an adjustment component. A placement plate (5) is placed on the upper surface of the support plate (4). A limiter component is provided between the support plate (4) and the placement plate (5) to position the placement plate (5). A plurality of grooves (3) are provided on the upper surface of the placement plate (5). Two fixing plates (1) are fixedly connected to the upper surface of the base plate (10), and a linear motor (2) is fixedly connected between the two fixing plates (1). A support frame (6) is fixedly connected to the bottom of the linear motor (2). One side of the support frame (6) is fixedly connected with two springs (14), one end of the two springs (14) is fixedly connected with a detection plate (15), one side of the support frame (6) is fixedly connected with a contact switch (17), the contact switch (17) is electrically connected to the linear motor (2), one side of the detection plate (15) is provided with a detection block (12), one side of the detection plate (15) is provided with a power assembly for making the detection block (12) move horizontally along the detection plate (15), and the other side of the detection plate (15) is provided with a supporting component to support the detection plate (15).

2. A semiconductor wafer thickness detection mechanism according to claim 1, characterized in that: The adjustment assembly comprises a first threaded rod (8), a threaded hole is provided on the upper surface of the base plate (10), the first threaded rod (8) is threadedly connected in the threaded hole, the first threaded rod (8) is rotatably connected to the support plate (4), and a guide component is provided at the bottom of the support plate (4) to enable the support plate (4) to move vertically.

3. A semiconductor wafer thickness detection mechanism according to claim 2, characterized in that: The guide component is a guide rod (9), the guide rod (9) is fixedly connected to the bottom of the support plate (4), and the guide rod (9) passes through the bottom plate (10).

4. A semiconductor wafer thickness detection mechanism according to claim 1, characterized in that: The limiting assembly comprises a plurality of clamping blocks (18), the plurality of clamping blocks (18) being fixedly connected to the four corners of the upper surface of the support plate (4), respectively; the four corners of the bottom of the placement plate (5) are each provided with a clamping slot (19), and the clamping blocks (18) are clamped to the clamping slot (19).

5. A semiconductor wafer thickness detection mechanism according to claim 1, characterized in that: The power assembly comprises two protrusions (13), the two protrusions (13) are respectively fixedly connected to two sides of the detection plate (15), a second threaded rod (11) is rotatably connected between the two protrusions (13), and the second threaded rod (11) passes through the detection block (12) and is threadedly connected to the detection block (12), one side of one of the protrusions (13) is fixedly connected to a motor, and one end of the motor output shaft passes through the protrusion (13) and is fixed to the second threaded rod (11).

6. A semiconductor wafer thickness detection mechanism according to claim 1, characterized in that: The supporting components are two positioning columns (16), the two positioning columns (16) are fixedly connected to the other side of the detection plate (15), and the two positioning columns (16) pass through the supporting frame (6).

7. A semiconductor wafer thickness detection mechanism according to claim 3, characterized in that: A scale (7) is fixedly connected to the bottom of the support plate (4), and the scale (7) passes through the bottom plate (10).

8. A semiconductor wafer thickness detection mechanism according to claim 1, characterized in that: The groove (3) is any one or more of circular and polygonal shapes.

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