Optical transceiver assembly

Abstract

The utility model discloses an optical transceiver assembly, and belongs to the technical field of optical fiber communication. The optical plastic part is arranged on the wiring side of the PCB, and one side of the optical plastic part is provided with an optical port used for being connected with an optical fiber; the optical transmitter is connected with the PCB and is used for transmitting an optical signal to the optical port; the optical receiver is connected with the PCB and is used for receiving optical signals emitted by the optical port; the optical element is arranged in the optical plastic part, an optical signal transmitted by the optical transmitter is transmitted by the optical element and then enters the optical port, and the optical signal entering the optical port is reflected by the optical element and then enters the optical receiver; according to the invention, the optical transmitter and the optical receiver are packaged on the same PCB, so that metal structural members such as tube sockets, tube caps and shells of the optical transmitter and the optical receiver in the TO coaxial packaging technology are omitted, and the optical assembly is lower in cost, simpler in production process and higher in production efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of optical fiber communication, and more specifically, to an optical transceiver component. Background Art

[0002] With the development of modern fiber-optic communication technology, access networks represented by fiber-to-the-home (FTTH) are being deployed on a large scale. In the future, they are moving towards the direction of optical interconnection of all things. With the expansion of various application scenarios, the demand will increase significantly, and the cost pressure of optical transceiver circuits is increasing, which poses higher challenges to the packaging and cost of integrated optical transceiver components.

[0003] At present, the optical transceiver components used for access networks mainly use TO coaxial packages (also called TO packages) as the transmitting and receiving terminals of optical signals. However, with this technical solution, the pins of the TO coaxial packages are located on different sides of the optical transceiver components, which is not convenient for connection with other devices. In addition, the TO coaxial packages include metal structural parts such as tube holders and tube caps. During installation, the metal structural parts of each TO coaxial package need to be coaxially capped, receiver coupled, and laser welded, which makes the material cost and process cost of the optical transceiver components relatively high. Utility Model Content

[0004] The utility model aims to solve the technical problem that the TO coaxial packaging material cost and process cost of the optical transceiver assembly in the prior art are relatively high, and proposes an optical transceiver assembly.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An optical transceiver assembly, comprising:

[0007] PCB board;

[0008] An optical plastic part, wherein the optical plastic part is arranged on a side of the PCB board for wiring, and one side of the optical plastic part is provided with an optical port for connecting an optical fiber;

[0009] An optical transmitter, which is connected to the PCB board and is located in the optical plastic part, and is used to transmit an optical signal to the optical port;

[0010] An optical receiver, the optical receiver is connected to the PCB board and is located in the optical plastic part, and is used to receive an optical signal incident from the optical port;

[0011] Among them, an optical element is provided in the optical plastic part, and the optical element is located simultaneously on the optical path between the optical receiver and the optical port, and on the optical path between the optical transmitter and the optical port; the optical element is used to transmit the optical signal emitted by the optical transmitter into the optical port, and reflect the optical signal incident in the optical port into the optical receiver.

[0012] Furthermore, the optical plastic part is provided with: a first chamber for accommodating an optical transmitter, a second chamber for accommodating an optical element, and a third chamber for accommodating an optical receiver;

[0013] The optical port is connected to the second chamber, and the second chamber is provided with a first light-through hole for connecting to the first chamber and a second light-through hole for connecting to the third chamber.

[0014] Further, the optical transmitter is located in the first chamber, and includes:

[0015] A heat sink substrate, the heat sink substrate is fixed to the PCB board, and the heat sink substrate is provided with a plurality of electrode pads for electrical connection with the PCB board;

[0016] A laser diode chip is electrically connected to the heat sink substrate, and a light outlet of the laser diode chip corresponds to a position of the first light hole.

[0017] Further, the optical receiver is located in the third chamber, and includes:

[0018] A photodiode chip, wherein the photodiode chip is fixed on the PCB board and corresponds to the position of the second light-through hole;

[0019] A transimpedance amplifier, which is fixed on the PCB board and is electrically connected to the photodiode chip and the PCB board;

[0020] A plurality of capacitors are electrically connected to the transimpedance amplifier and the PCB board.

[0021] Furthermore, the optical transmitter, the optical receiver and the electrodes on the PCB board are all connected via bonding gold wires; the photodiode chip and the transimpedance amplifier, and the transimpedance amplifier and the capacitor are all connected via bonding gold wires.

[0022] Furthermore, the optical element comprises:

[0023] a first lens, the first lens being located in the first light-through hole and being used for collimating the optical signal emitted by the optical transmitter into the second chamber;

[0024] a second lens, the second lens being located in the optical port at one end close to the second chamber;

[0025] a third lens, the third lens being located in the second light-through hole and being used for converging the optical signal emitted from the second chamber into the optical receiver;

[0026] A first filter, which is tilted and fixed in the second cavity and located between the first lens and the second lens;

[0027] A second filter is fixed between the second filter and the third lens, and is used to filter out stray light signals directed to the optical receiver.

[0028] Furthermore, the laser diode chip is an edge-emitting laser diode chip.

[0029] Furthermore, the photodiode chip is a PIN photodiode chip or an APD avalanche photodiode chip.

[0030] Furthermore, the heat sink substrate is an aluminum nitride ceramic heat sink substrate.

[0031] Furthermore, the optical plastic part is made of polyetherimide material.

[0032] The beneficial effects of the utility model are:

[0033] The optical transceiver assembly provided by the present application encapsulates the optical transmitter and the optical receiver on the same PCB board, so that other devices can be conveniently connected to the optical transceiver assembly through the PCB board, and omits the metal structural parts such as the tube seat and tube cap of the optical transmitter and the optical receiver in the TO coaxial packaging technology, and also reduces the processes such as coaxial sealing cap, receiver coupling and laser welding. On the basis of realizing single-fiber bidirectional optical signal transmission, the cost of optical components is lower, the production process is simpler, and the production efficiency is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a schematic diagram of the overall structure of an optical transceiver assembly provided in an embodiment of the utility model;

[0035] Figure 2 A cross-sectional view of an optical transceiver assembly provided in an embodiment of the utility model;

[0036] Figure 3 A schematic diagram of the internal structure of an optical transceiver assembly provided in an embodiment of the utility model;

[0037] Figure 4 This is a schematic diagram of the positional relationship between the PCB board and the optical transmitter and the optical receiver in the embodiment of the utility model;

[0038] Figure 5 for Figure 4 Enlarged view of point A in the middle;

[0039] Figure 6 This is a schematic diagram of the positional relationship between the optical element and the optical plastic part in the embodiment of the utility model;

[0040] The markings in the figure are as follows:

[0041] 1. PCB board;

[0042] 11. Laser diode chip positive electrode; 12. Laser diode chip negative electrode; 13. Reference ground electrode; 14. Transimpedance amplifier power supply positive electrode; 15. Photocurrent output electrode; 16. Common ground electrode; 17. Signal output positive electrode; 18. Signal output negative electrode;

[0043] 2. Optical plastic parts;

[0044] 21. optical port; 22. first chamber; 23. second chamber; 24. third chamber;

[0045] 3. Optical transmitter;

[0046] 31. heat sink substrate; 32. laser diode chip;

[0047] 4. Optical receiver;

[0048] 41. Photodiode chip; 42. Transimpedance amplifier; 43. Capacitor;

[0049] 5. Optical components;

[0050] 51. First filter; 52. Second filter; 53. First lens; 54. Second lens; 55. Third lens. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0052] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0053] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0055] Example

[0056] The embodiment of the present application provides an optical transceiver assembly. In practical applications, the output end of the optical transceiver assembly is connected to an optical fiber to provide a high-speed optical fiber transmission capability for the device. Figure 1 and Figure 2 , the optical transceiver assembly includes: a PCB board 1, an optical plastic part 2 connected to the PCB board 1, an optical transmitter 3, an optical receiver 4, and an optical element 5 located in the optical plastic part 2;

[0057] Among them, the PCB board 1 is provided with circuit wiring compatible with the optical transmitter 3 and the optical receiver 4 and a plurality of electrode pads for realizing the electrical connection between the PCB board 1 and the optical transmitter 3 and the optical receiver 4; it can be understood that the circuit wiring of the PCB board 1 can adopt single-layer wiring or multi-layer wiring according to the density of components, so that the PCB board 1 is suitable for circuit layouts of different complexities.

[0058] In this embodiment, the optical plastic part 2 is in a T-shaped structure as a whole, and is arranged on the circuit wiring surface of the PCB board 1, as shown in FIG. Figure 2, an optical port 21 for connecting an optical fiber is provided on one side of the optical plastic part 2; a first chamber 22 for accommodating an optical transmitter 3, a second chamber 23 for accommodating an optical element 5, and a third chamber 24 for accommodating an optical receiver 4 are provided inside the optical plastic part 2; the optical port 21 in the above technical solution is connected to the second chamber 23, and the second chamber 23 is provided with a first light-through hole for communicating with the first chamber 22, and a second light-through hole for communicating with the third chamber 24; by adopting this technical solution, the optical plastic part 2 covers the optical transmitter 3 and the optical receiver 4 inside, the optical transmitter 3 emits a first wavelength optical signal, and the optical port 21 emits a second wavelength optical signal that passes through the first light-through hole and the second light-through hole and is transmitted inside the optical plastic part 2.

[0059] In order to lower the material and manufacturing costs of optical components, and at the same time realize the optical signal transmission function in single-fiber bidirectional optical signal transmission; please refer to Figure 3 , the optical transmitter 3 is located in the first chamber 22, and includes: a heat sink substrate 31 and a laser diode chip 32; wherein the heat sink substrate 31 is connected to the PCB board 1 by means of silver glue, and the silver glue can still maintain the conductive performance and adhesion performance between the heat sink substrate 31 and the PCB board 1 under high temperature environment; the laser diode chip 32 is connected to the heat sink substrate 31 by means of eutectic or silver glue, and is used to transmit the first wavelength optical signal to the optical port 21; adopting this technical solution, the laser diode chip 32 and the heat sink substrate 31 form an integral electronic device, and share the electrode of the heat sink substrate 31; the design of the heat sink substrate 31 can effectively absorb, conduct and dissipate the heat generated by the laser diode chip 32 when working, so as to maintain the normal working temperature and ensure the performance and reliability of the optical component; compared with the TO coaxial package in the related art, the optical transmitter 3 in the embodiment of the present application adopts the technical solution of directly connecting the PCB board 1, and on the basis of ensuring the heat dissipation effect, optimizes the metal structures such as the tube seat and tube cap of the traditional coaxial package, and reduces the material and production costs.

[0060] Specifically, see Figure 4 , the circuit wiring on the PCB board 1 at least includes: a positive electrode 11 (LD+) of the laser diode chip, a negative electrode 12 (LD-) of the laser diode chip, a reference ground electrode 13 (TGND), and a plurality of electrode pads matching the above electrodes; it can be understood that an electrode pad is provided on the electrode of the heat sink substrate 31; further, the heat sink substrate 31 is connected to the reference ground electrode 13, and the electrode pad of the electrode of the heat sink substrate 31 is connected to the electrode pad of the negative electrode 12 of the laser diode chip through a bonding wire, thereby realizing power supply and electrical signal transmission to the laser diode chip 32;

[0061] As a preferred implementation of the present application, a backlight monitoring diode may be added to the position of the laser diode chip 32 facing away from the light emitting direction to realize the optical power monitoring function.

[0062] In order to realize the optical signal receiving function in single-fiber bidirectional optical signal transmission, please refer to Figure 3 and Figure 5 , the optical receiver 4 is located in the third chamber 24, and includes: a photodiode chip 41, a transimpedance amplifier 42, and a plurality of capacitors 43; wherein, the electrodes of the photodiode chip 41, the transimpedance amplifier 42 and the capacitor 43 are all provided with electrode pads; the photodiode chip 41 is fixed on the PCB board 1 by means of silver glue, and is used to receive the second wavelength optical signal transmitted from the optical port 21; as an embodiment of the present application, a passive alignment mark is provided at a position corresponding to the second light-through hole on the PCB board 1, and the photodiode chip 41 implements a passive alignment process through the passive alignment mark. When the photodiode chip 41 is fixed above the passive alignment mark, it is in an aligned state, and there is no need to operate the active optical device for optical coupling, thereby optimizing the steps of optical coupling with the optical receiver 4.

[0063] In the above technical scheme, the transimpedance amplifier 42 and the capacitor 43 are both connected to the PCB board 1 by means of silver glue, and the electrode pads of the transimpedance amplifier 42 and the electrode pads of the photodiode chip 41, and the electrode pads of the transimpedance amplifier 42 and the electrode pads of the capacitor 43 are connected by bonding gold wires; using this technical scheme, after the photodiode chip 41 receives the second wavelength light signal, it converts it into a photogenerated current signal; after the photogenerated current signal is amplified by the transimpedance amplifier 42, it is converted into a differential voltage signal output; as an implementation mode of the present application, the transimpedance amplifier 42 is connected to two capacitors 43, and the capacitor 43 is designed as a power supply filter or a signal bypass, which plays the role of bypass, decoupling and filtering.

[0064] Specifically, see Figure 4, the circuit wiring on the PCB board 1 also includes: a transimpedance amplifier power supply positive electrode 14 (VCC), a photocurrent output electrode 15 (RSS I / PD-), a common ground electrode 16 (RGND), a signal output positive electrode 17 (OUT+), a signal output negative electrode 18 (OUT-) and a number of electrode pads matching the above electrodes; wherein the transimpedance amplifier 42 is connected to the common ground electrode 16, the signal output positive electrode 17, and the signal output negative electrode 18, any capacitor 43 is connected to the transimpedance amplifier power supply positive electrode 14, and another capacitor 43 is connected to the photocurrent output electrode 15, thereby realizing power supply and electrical signal transmission to the photodiode chip 41; it can be understood that the electrode pads on the transimpedance amplifier 42 and the capacitor 43 are connected to the electrode pads on the circuit wiring of the PCB board 1 through bonding gold wires; in the above technical scheme, the electrodes other than the common ground electrode 16 can be freely switched to facilitate better matching with other circuits.

[0065] In order to change the transmission direction of the first wavelength optical signal and the second wavelength optical signal in the optical plastic part 2 so that the optical port 21 and the optical receiver 4 receive the optical signals of the corresponding wavelengths respectively, a 45° mirror frame and a 0° mirror frame located below the 45° mirror frame are provided in the second chamber 23 for fixing the optical element 5; see Figure 2 and Figure 6 , the optical element 5 includes: a first filter 51, a second filter 52, a first lens 53, a second lens 54, and a third lens 55;

[0066] The first filter 51 is fixed on a 45° frame, and the mounting angle between it and the PCB board 1 is 45°, and is used to transmit the first wavelength optical signal and reflect the second wavelength optical signal; the second filter 52 is fixed on a 0° frame, and the mounting angle between it and the PCB board 1 is 0°, and is used to transmit the second wavelength optical signal and filter out other stray optical signals;

[0067] The first lens 53 is located in the first light hole, and is used to collimate the first wavelength optical signal emitted by the optical transmitter 3 into the second chamber 23; the second lens 54 is located in the optical port 21 near one end of the second chamber 23, and is used to converge the first wavelength optical signal emitted from the second chamber 23 into the optical port 21, and collimate the second wavelength optical signal emitted from the optical port 21 into the second chamber 23; the third lens 55 is located in the second light hole, and is used to converge the second wavelength optical signal emitted from the second chamber 23 into the optical receiver 4; it can be understood that the first lens 53, the second lens 54, the third lens 55 and the optical plastic part 2 can adopt an integral molding structure, or can be connected and fixed by gluing;

[0068] As an implementation mode of the present application, the first filter 51 is located between the first lens 53 and the second lens 54, and is located on the optical path of the first wavelength optical signal and the second wavelength optical signal at the same time. The 0° mirror frame is arranged between the first filter 51 and the third lens 55, so that the second filter 52 is located on the optical path of the second wavelength optical signal. With this technical solution, the first wavelength optical signal emitted by the optical transmitter 3 is collimated by the first lens 53 and then emitted to the first filter 51, and then transmitted through the first filter 51 and then emitted to the second lens 54, and then converged by the second lens 54 and enters the optical port 21. The second wavelength optical signal emitted by the optical port 21 is converted into parallel light after being collimated by the second lens 54 and emitted to the first filter 51, and then reflected by the first filter 51 and emitted to the second filter 52, and then transmitted through the second filter 52 and enters the third lens 55, and then converged by the third lens 55 and received by the optical receiver 4; thereby realizing the integrated transceiver function of the optical signal on a single optical component; in the above technical solution, the design of the first lens 53, the second lens 54, and the third lens 55 can convert the converged optical signal into a parallel light beam to extend the optical path and improve the coupling efficiency.

[0069] The optical transceiver assembly provided in the present application omits the metal structural parts such as the tube seat and tube cap of the optical transmitter and the optical receiver in the TO coaxial packaging technology by packaging the optical transmitter 3 and the optical receiver 4 on the same PCB board 1, and also reduces the processes such as the coaxial sealing cap, receiver coupling and laser welding. On the basis of realizing single-fiber bidirectional optical signal transmission, the optical assembly cost is lower, the production process is simpler, and the production efficiency is higher.

[0070] As an embodiment of the present application, a filter film is plated on the photosensitive surface of the photodiode chip 41; the filter film plays the same role as the second filter 52. The use of this technical solution can eliminate the setting of the second filter 52, thereby reducing the size of the second chamber 23, so as to further achieve the technical effect of reducing the volume of the optical component and reducing the production cost.

[0071] See also Figure 2 and Figure 3Since the first light hole is located on one side of the optical transmitter 3, as a preferred embodiment of the present application, the laser diode chip 32 adopts an edge-emitting laser diode chip. The resonant cavity of the edge-emitting laser diode core is located on the side. After the photons are amplified by the resonant cavity mode selection, they will form lasers in a direction parallel to the substrate surface; compared with the surface-emitting laser diode chip, the edge-emitting laser diode chip has higher output power and electro-optical conversion efficiency, and its light emitting direction is more suitable for the technical solution of the present application; the photodiode chip 41 adopts a PIN photodiode chip or an APD avalanche photodiode chip; they all have the characteristics of photosensitivity, low noise, wide linear range, good reliability and stability, and are suitable as photoelectric signal conversion elements in the technical solution of the present application.

[0072] As a preferred embodiment of the present application, the optical plastic part 2 is made of polyetherimide (PE I) material; this technical solution enables the optical plastic part 2 to have a low thermal expansion coefficient, a low dielectric constant and a low dissipation factor, and can maintain dimensional stability under short-term high temperature conditions, reduce signal loss, and improve the working efficiency and performance of its internal components;

[0073] The heat sink substrate 31 preferably adopts an aluminum nitride ceramic heat sink substrate; the aluminum nitride ceramic heat sink substrate has higher thermal conductivity than an alumina ceramic substrate, better thermal stability and insulation performance than a beryllium oxide substrate, and is non-toxic, and is more suitable as an electronic substrate for the laser diode chip 32 in the technical solution of the present application.

[0074] As an embodiment of the present application, the laser diode chip 32 emits a first wavelength optical signal of 1310 nm or 1270 nm, and the photodiode chip 41 receives a second wavelength optical signal of 1490 nm or 1577 nm.

[0075] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An optical transceiver assembly, characterized in that: include: PCB board (1); An optical plastic part (2), the optical plastic part (2) being arranged on a wiring side of the PCB board (1), and one side of the optical plastic part (2) being provided with an optical port (21) for connecting an optical fiber; An optical transmitter (3), the optical transmitter (3) being connected to the PCB board (1) and being located in the optical plastic part (2), and being used for transmitting an optical signal to the optical port (21); An optical receiver (4), the optical receiver (4) being connected to the PCB board (1) and being located in the optical plastic part (2), and being used for receiving an optical signal incident from the optical port (21); The optical plastic part (2) is provided with an optical element (5), and the optical element is located simultaneously on the optical path between the optical receiver (4) and the optical port (21), and on the optical path between the optical transmitter (3) and the optical port (21); the optical element is used to transmit the optical signal emitted by the optical transmitter (3) into the optical port (21), and to reflect the optical signal incident in the optical port (21) into the optical receiver (4).

2. The optical transceiver assembly according to claim 1, characterized in that: The optical plastic part (2) is provided with: a first chamber (22) for accommodating an optical transmitter (3), a second chamber (23) for accommodating an optical element (5), and a third chamber (24) for accommodating an optical receiver (4); The optical port (21) is connected to the second chamber (23), and the second chamber (23) is provided with a first light-through hole for connecting to the first chamber (22) and a second light-through hole for connecting to the third chamber (24).

3. The optical transceiver assembly according to claim 2, characterized in that: The optical transmitter (3) is located in the first chamber (22), and comprises: A heat sink substrate (31), the heat sink substrate (31) being fixed on the PCB board (1), and the heat sink substrate (31) being provided with a plurality of electrode pads for being electrically connected to the PCB board (1); A laser diode chip (32), the laser diode chip (32) being electrically connected to the heat sink substrate (31), and a light outlet of the laser diode chip (32) corresponding to the position of the first light through hole.

4. The optical transceiver assembly according to claim 2, characterized in that: The optical receiver (4) is located in the third chamber (24), and comprises: A photodiode chip (41), the photodiode chip (41) being fixed on the PCB board (1) and corresponding to the position of the second light-through hole; A transimpedance amplifier (42), the transimpedance amplifier (42) being fixed on the PCB board (1) and being electrically connected to the photodiode chip (41) and the PCB board (1); A plurality of capacitors (43), wherein the capacitors (43) are electrically connected to the transimpedance amplifier (42) and the PCB board (1).

5. The optical transceiver assembly according to claim 4, characterized in that: The optical transmitter (3), the optical receiver (4) and the electrodes on the PCB board (1) are all connected via bonding gold wires; the photodiode chip (41) and the transimpedance amplifier (42), and the transimpedance amplifier (42) and the capacitor (43) are all connected via bonding gold wires.

6. The optical transceiver assembly according to claim 2, characterized in that: The optical element (5) comprises: a first lens (53), the first lens (53) being located in the first light-through hole and being used for collimating the optical signal emitted by the optical transmitter (3) into the second chamber (23); a second lens (54), the second lens (54) being located in the optical port (21) at one end close to the second chamber (23); a third lens (55), the third lens (55) being located in the second light-through hole and used for converging the optical signal incident from the second chamber (23) into the optical receiver (4); A first filter (51), the first filter (51) being fixed in an inclined manner in the second chamber (23) and being located between the first lens (53) and the second lens (54); A second filter (52), the second filter (52) being fixed between the second filter (52) and the third lens (55), and being used for filtering out stray light signals directed toward the optical receiver (4).

7. The optical transceiver assembly according to claim 3, characterized in that: The laser diode chip (32) is an edge-emitting laser diode chip.

8. The optical transceiver assembly according to claim 4, characterized in that: The photodiode chip (41) is a PIN type photodiode chip or an APD type avalanche photodiode chip.

9. The optical transceiver assembly according to claim 3, characterized in that: The heat sink substrate (31) is an aluminum nitride ceramic heat sink substrate (31).

10. The optical transceiver assembly according to claim 1, characterized in that: The optical plastic part (2) is made of polyetherimide material.

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