Computer heat dissipation device with noise reduction structure
By using noise reduction technologies such as refrigeration mechanism, bonding strips and sound-absorbing cotton in the laptop cooling device, the problem of high noise in the existing heat dissipation device is solved, and the effect of low noise and efficient heat dissipation is achieved.
Patent Information
- Application Number
- CN202421334564.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-12
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-06-12
AI Technical Summary
Existing laptop cooling devices generate large noise during use, affecting the comfort of use.
A computer heat dissipation device with a noise reduction structure is designed, and a refrigeration mechanism composed of a semiconductor refrigeration sheet and a heat exchange rod are combined with rubber bonding strips and sound-absorbing cotton to reduce noise dissipation through the deflector and the air outlet tank.
It effectively reduces the noise of the heat dissipation device, improves the comfort of use, and ensures effective heat dissipation of the laptop.
Smart Images
Figure CN222619030U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of computer heat dissipation, in particular to a computer heat dissipation device with a noise reduction structure. Background Art
[0002] A laptop is a type of computer. Laptops are small and easy to carry. In order to reduce the size of the laptop body, fewer heat dissipation components are installed inside it, resulting in poor heat dissipation of the laptop itself.
[0003] At present, people often place an auxiliary heat dissipation device under the laptop computer when using it. Existing laptop computer heat dissipation devices mostly use fans to dissipate heat when in use. However, the existing heat dissipation devices do not have a noise reduction function. When the fan runs quickly, it will generate a large noise, which will be directly spread out and cause discomfort to people around. Therefore, in view of the above situation, it is urgent to develop a computer heat dissipation device with a noise reduction structure that is convenient for computer heat dissipation, low noise, and more comfortable to use, so as to overcome the shortcomings in current practical applications and meet current needs. Utility Model Content
[0004] The utility model aims to provide a computer heat dissipation device with a noise reduction structure, which is convenient for computer heat dissipation, has low noise and is more comfortable to use.
[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0006] A computer heat dissipation device with a noise reduction structure comprises a supporting shell, a fitting strip, a cooling fan, a refrigeration mechanism, an air inlet pipe, a guide plate and a second sound-absorbing cotton. A fitting strip is installed on the top of the supporting shell, two cooling fans are installed in the supporting shell, a plurality of air inlet pipes pointing to the cooling fans are installed on the supporting shell, a first sound-absorbing cotton is installed in the air inlet pipe, two guide plates are fixed to the inner left half of the supporting shell, a second sound-absorbing cotton is installed on each of the guide plates, and an air outlet slot is arranged on the upper left side of the supporting shell.
[0007] Preferably, the fitting strip is made of rubber.
[0008] Preferably, a refrigeration mechanism extending above the heat dissipation fan is installed on the right side of the support shell.
[0009] Preferably: the refrigeration mechanism includes: a base block, a heat exchange rod, a semiconductor refrigeration sheet and a heat dissipation fin, the base block is installed on the right side of the supporting shell, a plurality of heat exchange rods are fixed on the left side of the base block, a plurality of semiconductor refrigeration sheets are installed on the base block, and a heat dissipation fin is installed on the hot end of the semiconductor refrigeration sheet.
[0010] Preferably, the base block, the heat exchange rods and the heat dissipation fins are all made of copper.
[0011] The beneficial effects of the utility model are as follows: when the computer heat dissipation device with a noise reduction structure is used, the base block and the heat exchange rod are cooled by the semiconductor refrigeration sheet, the support shell is cooled and cooled by the heat exchange rod, and the low-temperature airflow is blown to the laptop by the heat dissipation fan, so as to dissipate the heat of the laptop; because the bonding strip has a certain elastic deformation ability, when the laptop is pressed onto the bonding strip, the laptop and the bonding strip are better fitted under the action of the gravity of the laptop, so as to reduce the gap and reduce the noise from the joint between the support shell and the laptop to spread outward, when the heat dissipation fan blows, the airflow enters from the air inlet pipe, and the first sound-absorbing cotton in the air inlet pipe can absorb the noise, when exhausting, the airflow flows along the two guide plates and is finally discharged from the air outlet slot, and is absorbed by the second sound-absorbing cotton on the guide plate, thereby reducing the noise from spreading outward with the airflow during exhaust, and improving the noise reduction performance. In summary, the utility model is convenient for computer heat dissipation, low noise, and more comfortable to use. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 The three-dimensional structure of the utility model is shown in FIG. Figure 1 .
[0013] Figure 2 The three-dimensional structure of the utility model is shown in FIG. Figure 2 .
[0014] Figure 3 It is an internal sectional view of the present utility model.
[0015] Figure 4 It is a schematic diagram of the use state of the utility model.
[0016] Figure 5 It is a partial structure diagram of the utility model Figure 1 .
[0017] Figure 6 It is a partial structure diagram of the utility model Figure 2 .
[0018] Legend:
[0019] 1. Support shell; 101. Air outlet slot; 2. Fitting strip; 3. Cooling fan; 4. Refrigeration mechanism; 401. Base block; 402. Heat exchange rod; 403. Semiconductor refrigeration sheet; 404. Heat dissipation fin; 5. Air inlet pipe; 501. First sound-absorbing cotton; 6. Guide plate; 7. Second sound-absorbing cotton; 8. Laptop computer. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] Specific examples are given below.
[0022] See also Figure 1 to Figure 6 In the embodiment of the utility model, a computer heat dissipation device with a noise reduction structure includes a supporting shell 1, a bonding strip 2, a cooling fan 3, a refrigeration mechanism 4, an air inlet pipe 5, a guide plate 6, a second sound-absorbing cotton 7 and a laptop computer 8. A bonding strip 2 is installed on the top of the supporting shell 1, and the bonding strip 2 is made of rubber to enable it to have a certain deformation ability. Two cooling fans 3 are installed in the supporting shell 1, and a refrigeration mechanism 4 extending to the top of the cooling fan 3 is installed on the right side of the supporting shell 1. A plurality of air inlet pipes 5 pointing to the cooling fan 3 are installed on the supporting shell 1, and a first sound-absorbing cotton 501 is installed in the air inlet pipe 5. Two guide plates 6 are fixed to the inner left half of the supporting shell 1, and each guide plate 6 is installed with a second sound-absorbing cotton 7. An air outlet slot 101 is arranged on the upper left of the supporting shell 1, and the laptop computer 8 is placed on the top of the supporting shell 1. When in use, the laptop computer 8 is placed on the top of the supporting shell 1. The computer 8 is placed on the supporting shell 1. Since the bonding strip 2 has a certain elastic deformation ability, when the laptop computer 8 is pressed onto the bonding strip 2, the laptop computer 8 and the bonding strip 2 are better fitted under the action of the gravity of the laptop computer 8, so as to reduce the gap and reduce the noise from the joint between the supporting shell 1 and the laptop computer 8. The heat dissipation is blown to the laptop computer 8 by the cooling fan 3, and the air on the upper side of the cooling fan 3 is cooled and cooled by the refrigeration mechanism 4, so as to reduce the temperature of the laptop computer 8. When the cooling fan 3 blows air, the airflow enters from the air inlet pipe 5, and the first sound-absorbing cotton 501 in the air inlet pipe 5 can absorb the noise. When exhausting, the airflow circulates along the two guide plates 6 and is finally discharged from the air outlet slot 101, and is absorbed by the second sound-absorbing cotton 7 on the guide plate 6, thereby reducing the noise from spreading outward with the airflow during exhaust, thereby improving the noise reduction performance.
[0023] The refrigeration mechanism 4 includes: a base block 401, a heat exchange rod 402, a semiconductor refrigeration sheet 403 and a heat dissipation fin 404. The base block 401 is installed on the right side of the supporting shell 1. A plurality of heat exchange rods 402 are fixed on the left side of the base block 401. A plurality of semiconductor refrigeration sheets 403 are installed on the base block 401. The cooling end of the semiconductor refrigeration sheet 403 is in contact with the base block 401. The hot end of the semiconductor refrigeration sheet 403 is installed with a heat dissipation fin 404. The heat at the hot end of the semiconductor refrigeration sheet 403 is dissipated outwardly through the heat dissipation fin 404. The base block 401, the heat exchange rod 402 and the heat dissipation fin 404 are all made of copper, so that they have good thermal conductivity. When in use, the base block 401 and the heat exchange rod 402 are cooled by the semiconductor refrigeration sheet 403, and the inside of the supporting shell 1 is cooled and cooled by the heat exchange rod 402. Then, the low-temperature airflow is blown to the laptop computer 8 by the heat dissipation fan 3, so as to dissipate the heat of the laptop computer 8.
[0024] Working principle: When the computer cooling device with noise reduction structure is used, the semiconductor cooling sheet 403 is used to cool the base block 401 and the heat exchange rod 402, and the heat exchange rod 402 is used to cool the inside of the support shell 1, and then the low-temperature airflow is blown to the laptop computer 8 by the cooling fan 3, so as to dissipate the heat of the laptop computer 8; because the bonding strip 2 has a certain elastic deformation ability, when the laptop computer 8 is pressed onto the bonding strip 2, the laptop computer 8 and the bonding strip 2 are better fitted under the action of the gravity of the laptop computer 8, so as to reduce the gap and reduce the noise from the joint between the support shell 1 and the laptop computer 8. When the cooling fan 3 blows, the airflow enters from the air inlet pipe 5, and the first sound-absorbing cotton 501 in the air inlet pipe 5 can absorb the noise. When exhausting, the airflow circulates along the two guide plates 6 and is finally discharged from the air outlet slot 101, and is absorbed by the second sound-absorbing cotton 7 on the guide plate 6, thereby reducing the noise from spreading outward with the airflow during exhaust, thereby improving the noise reduction performance.
[0025] The above are only preferred specific implementation methods of the utility model, but the protection scope of the utility model is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the utility model, who makes equivalent replacements or changes based on the technical scheme and utility model concept of the utility model, should be covered by the protection scope of the utility model.
Claims
1. A computer heat dissipation device with a noise reduction structure, characterized in that: The invention comprises a supporting shell (1), a fitting strip (2), a heat dissipation fan (3), a refrigeration mechanism (4), an air inlet pipe (5), a guide plate (6) and a second sound-absorbing cotton (7); the top of the supporting shell (1) is provided with a fitting strip (2); two heat dissipation fans (3) are provided in the supporting shell (1); a plurality of air inlet pipes (5) pointing to the heat dissipation fans (3) are provided on the supporting shell (1); a first sound-absorbing cotton (501) is provided in the air inlet pipe (5); two guide plates (6) are fixed to the left inner half of the supporting shell (1); each of the guide plates (6) is provided with a second sound-absorbing cotton (7); and an air outlet slot (101) is provided at the upper left of the supporting shell (1).
2. The computer heat dissipation device with a noise reduction structure according to claim 1, characterized in that: The fitting strip (2) is made of rubber.
3. The computer heat dissipation device with a noise reduction structure according to claim 1, characterized in that: A refrigeration mechanism (4) extending above the heat dissipation fan (3) is installed on the right side of the support shell (1).
4. The computer heat dissipation device with a noise reduction structure according to claim 3, characterized in that: The refrigeration mechanism (4) comprises: a base block (401), a heat exchange rod (402), a semiconductor refrigeration sheet (403) and a heat dissipation fin (404); the base block (401) is installed on the right side of the supporting shell (1); a plurality of heat exchange rods (402) are fixed on the left side of the base block (401); a plurality of semiconductor refrigeration sheets (403) are installed on the base block (401); and a heat dissipation fin (404) is installed on the hot end of the semiconductor refrigeration sheet (403).
5. The computer heat dissipation device with a noise reduction structure according to claim 4, characterized in that: The base block (401), the heat exchange rod (402) and the heat dissipation fins (404) are all made of copper.