Embedded multilayer circuit board with high heat dissipation
By designing a heat dissipation mechanism including mounting side panels, mounting rods, heat dissipation fins, first heat conduction sheets and second heat conduction sheets on the multi-layer circuit board, the problem of heat accumulation in the multi-layer circuit boards is solved, efficient heat dissipation effect is achieved, and the reliability and performance of the equipment are improved.
Patent Information
- Application Number
- CN202420667347.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-04-02
AI Technical Summary
When existing multi-layer circuit boards are densely arranged or high-heat components are present, the heat is difficult to quickly take away through the fan, resulting in temperature increases, performance degradation and even equipment failures.
A high-heat dissipation embedded multi-layer circuit board is designed, and a heat dissipation mechanism including mounting side panels, mounting rods, heat dissipation fins, first heat conduction sheets and second heat conduction sheets are used to adjust the position of the heat conduction sheets through the matching of the heat dissipation fins and mounting rods. The height adjustment and clamping structure of the heat conduction sheets are targeted and connected to components with high heat generation to quickly export heat.
It effectively improves the heat dissipation effect of some electronic components, can quickly export heat from high-heat generation components, reduces the risk of temperature increase, and improves the reliability and performance of the equipment.
Smart Images
Figure CN222621262U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to an embedded multi-layer circuit board with high heat dissipation. Background Art
[0002] Multilayer circuit board, also known as multilayer printed circuit board, is an important electronic component carrier in the modern electronic industry. It uses advanced production technology to stack and tightly combine multiple conductive layers and insulating layers to form a circuit board with a complex circuit structure.
[0003] When a multi-layer circuit board is in use, its heat mainly comes from the various types of electronic components installed on it. These components consume electrical energy during normal operation and convert part of the electrical energy into heat energy. Different types of electronic components have different power consumption and heat dissipation performance, so the heat generated will also be different. If the components are too dense or the heat dissipation design is unreasonable, it may cause heat to accumulate on the multi-layer circuit board, causing temperature rise, performance degradation and even equipment failure. When the existing multi-layer circuit board uses the fan of an external device for heat dissipation, the layout and density of the electronic components will affect the heat dissipation effect. If the component layout is too dense, or there are certain high-heat components, then the heat will accumulate inside the multi-layer circuit board and it will be difficult to be quickly removed by the fan. Utility Model Content
[0004] The embodiment of the utility model provides an embedded multi-layer circuit board with high heat dissipation, aiming to solve the existing problem that if the layout of components on the circuit board is too dense, or there are certain high-heat components, then the heat will accumulate inside the multi-layer circuit board and it will be difficult to be quickly removed by a fan.
[0005] The utility model embodiment provides an embedded multi-layer circuit board with high heat dissipation, including a circuit board body, a plurality of electronic components are fixedly installed on the upper end of the circuit board body, two mounting holes are provided on both sides of the circuit board body, a heat dissipation mechanism is also provided on the circuit board body, the heat dissipation mechanism includes two mounting side plates, the two mounting side plates are respectively fixedly installed on one end of the circuit board body, mounting rods are respectively fixedly installed on the two mounting side plates, a plurality of heat dissipation fins are movably installed between the two mounting rods, a first heat conductive sheet is movably installed on the outer side of the heat dissipation fin, and a second heat conductive sheet is movably installed on the lower end of the first heat conductive sheet.
[0006] As a further optimization solution of the utility model, a bottom plate is fixedly installed on the lower end of the mounting side plate, and support frames are fixedly connected to the lower ends of the mounting rods on both sides of the mounting side plate.
[0007] As a further optimization solution of the present invention, slide grooves are provided on both sides of the mounting rod. The heat dissipation fins can slide and adjust their positions between the two mounting rods through the slide grooves provided on both sides of the mounting rod.
[0008] As a further optimization solution of the utility model, screws are inserted and installed in the through holes in the base plate, and the screws pass through the base plate and are threadedly connected in the corresponding installation holes.
[0009] As a further optimization scheme of the utility model, connecting blocks are fixedly installed on both sides of the heat dissipation fins, and the connecting blocks are in an inverted C-shaped structure. Sliders are fixedly installed on both sides of the connecting blocks, and the connecting blocks are slidably installed on the mounting rods through the sliders. That is, the heat dissipation fins are slidably installed between the two mounting rods through the connecting blocks on both sides. By arranging a slidable and adjustable heat dissipation fin between the two mounting rods, the installation positions of the first heat conductive plate and the second heat conductive plate can be adjusted.
[0010] As a further optimization scheme of the utility model, a slot is provided at the upper end of the first heat conductive plate, an adjustment slot is provided at the lower end of the first heat conductive plate, pressure plates are movably connected on both sides of the adjustment slot, and the first heat conductive plate is installed on the outside of the heat dissipation fin through the slot.
[0011] As a further optimization scheme of the utility model, a third heat conducting sheet is fixedly installed at the center position of the upper end of the second heat conducting sheet, and a plurality of supporting fins are fixedly connected between the second heat conducting sheet and both sides of the third heat conducting sheet, and the upper end of the third heat conducting sheet is inserted and installed in the adjustment groove, and the two pressing sheets are respectively pressed and bent toward one side of the third heat conducting sheet. The third heat conducting sheet is inserted and installed in the adjustment groove, and the height of the second heat conducting sheet can be adjusted according to the thickness of the electronic components, and the pressing sheet can clamp and fix the third heat conducting sheet in the adjusted position.
[0012] Compared with the prior art, in the utility model, a heat dissipation mechanism is arranged on the circuit board body, and the heat dissipation mechanism is composed of components such as a mounting side plate, a mounting rod, a heat dissipation fin, a first heat conductive sheet and a second heat conductive sheet. The positions of the first heat conductive sheet and the second heat conductive sheet can be adjusted by means of the cooperation between the heat dissipation fin and the mounting rod. At the same time, the height of the second heat conductive sheet can be adjusted through the third heat conductive sheet, so that it can be connected to electronic components with high heat generation in a targeted manner, so as to quickly conduct the heat thereof and improve the heat dissipation effect of some electronic components. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of the main structure of the utility model;
[0014] Figure 2 This is a schematic diagram of the heat dissipation mechanism structure of the utility model;
[0015] Figure 3 for Figure 2 The enlarged view of point A in the middle;
[0016] Figure 4 It is a schematic diagram of the disassembly of the first heat conducting plate and the second heat conducting plate structure of the utility model.
[0017] Among them, 1. circuit board body; 2. electronic components; 3. mounting holes; 4. heat dissipation mechanism; 5. mounting side panels; 6. mounting rods; 7. heat dissipation fins; 8. first heat conductive sheet; 9. second heat conductive sheet; 10. bottom plate; 11. support frame; 12. slide groove; 13. connecting block; 14. slider; 15. adjustment groove; 16. pressing sheet; 17. third heat conductive sheet; 18. supporting fins; 19. slot. DETAILED DESCRIPTION
[0018] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.
[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0020] When used herein, it should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, components, parts or combinations thereof. At the same time, the terms used in this specification include any and all combinations of the relevant listed items.
[0021] The utility model embodiment provides a high heat dissipation embedded multi-layer circuit board, such as Figure 1-Figure 4 As shown, it includes a circuit board body 1, a plurality of electronic components 2 are fixedly mounted on the upper end of the circuit board body 1, two mounting holes 3 are provided on both sides of the circuit board body 1, a heat dissipation mechanism 4 is also provided on the circuit board body 1, and the heat dissipation mechanism 4 includes two mounting side plates 5, the two mounting side plates 5 are respectively fixedly mounted on one end of the circuit board body 1, mounting rods 6 are respectively fixedly mounted on the two mounting side plates 5, a plurality of heat dissipation fins 7 are movably mounted between the two mounting rods 6, a first heat conductive sheet 8 is movably mounted on the outer side of the heat dissipation fin 7, and a second heat conductive sheet 9 is movably mounted on the lower end of the first heat conductive sheet 8.
[0022] like Figure 2-Figure 3As shown, a bottom plate 10 is fixedly installed at the lower end of the mounting side plate 5, and support frames 11 are fixedly connected to the lower ends of the mounting rods 6 on both sides of the mounting side plate 5, and slide grooves 12 are provided on both sides of the mounting rods 6. Through the slide grooves 12 provided on both sides of the mounting rods 6, the heat dissipation fins 7 can be slidably adjusted between the two mounting rods 6. Screws are inserted and installed in the through holes in the bottom plate 10, and the screws pass through the bottom plate 10 and are threadedly connected to the corresponding mounting holes 3;
[0023] like Figure 3 As shown, connecting blocks 13 are fixedly installed on both sides of the heat dissipation fin 7, and the connecting blocks 13 are in an inverted C-shaped structure. Slide blocks 14 are fixedly installed on both sides of the connecting block 13. The connecting block 13 is slidably installed on the mounting rod 6 through the slide blocks 14, that is, the heat dissipation fin 7 is slidably installed between the two mounting rods 6 through the connecting blocks 13 on both sides. By arranging the heat dissipation fin 7 that can be slidably adjusted between the two mounting rods 6, the installation positions of the first heat conductive sheet 8 and the second heat conductive sheet 9 can be adjusted;
[0024] like Figure 2-Figure 4 As shown, a slot 19 is provided at the upper end of the first heat conducting sheet 8, an adjusting slot 15 is provided at the lower end of the first heat conducting sheet 8, and pressing sheets 16 are movably connected on both sides of the adjusting slot 15. The first heat conducting sheet 8 is inserted and installed on the outer side of the heat dissipation fin 7 through the slot 19, and a third heat conducting sheet 17 is fixedly installed at the center position of the upper end of the second heat conducting sheet 9, and a plurality of supporting fins 18 are fixedly connected between the two sides of the third heat conducting sheet 17 and the second heat conducting sheet 9, and the upper end of the third heat conducting sheet 17 is inserted and installed in the adjusting slot 15, and two pressing sheets 16 are respectively pressed and bent toward one side of the third heat conducting sheet 17, and the third heat conducting sheet 17 is inserted and installed in the adjusting slot 15, and the height of the second heat conducting sheet 9 can be adjusted according to the thickness of the electronic component 2, and the pressing sheet 16 can clamp and fix the third heat conducting sheet 17 in the adjusted position.
[0025] It should be noted that the utility model is a high heat dissipation embedded multilayer circuit board. When the heat dissipation effect of some electronic components 2 is improved, the connection blocks 13 on both sides of the heat dissipation fins 7 can be respectively inserted and installed on the corresponding mounting rods 6, and the sliders 14 on the inner sides of the connection blocks 13 are inserted into the corresponding slide grooves 12 to realize the sliding adjustment of the heat dissipation fins 7. Then, the first heat conductive sheet 8 is inserted and installed on the heat dissipation fins 7 from the lower ends of the heat dissipation fins 7 by using the slots 19, and the first heat conductive sheet 8 is adjusted on the heat dissipation fins 7 in the Y direction through the slots 19, and the heat dissipation fins 7 use the connection blocks 13 on both sides to adjust the X direction position of the second heat conductive sheet 9 between the two mounting rods 6, so that the second heat conductive sheet 9 can be placed above the electronic components 2 that need heat dissipation;
[0026] Subsequently, the second thermally conductive sheet 9 is pulled down so that the second thermally conductive sheet 9 drives the third thermally conductive sheet 17 to move downward in the adjustment groove 15, and the lower end surface of the second thermally conductive sheet 9 is coated with thermal grease and fits with the corresponding upper surface of the electronic component 2. Subsequently, the two pressing sheets 16 are synchronously clamped to one side of the third thermally conductive sheet 17 using tools such as pliers, so that the pressing sheet 16 is deformed and the third thermally conductive sheet 17 is clamped in the adjustment groove 15 with the help of the two pressing sheets 16. The installation of the second thermally conductive sheet 9 can be completed, so that the heat of the electronic component 2 can be transferred to the first thermally conductive sheet 8 through the second thermally conductive sheet 9 and the supporting fins 18 and the third thermally conductive sheet 17, and then transferred to the heat dissipation fins 7 through the first thermally conductive sheet 8 for removal.
[0027] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
[0028] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0029] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.
Claims
1. A high heat dissipation embedded multilayer circuit board, characterized in that: It includes a circuit board body, a plurality of electronic components are fixedly mounted on the upper end of the circuit board body, two mounting holes are provided on both sides of the circuit board body, and a heat dissipation mechanism is also provided on the circuit board body; The heat dissipation mechanism includes two mounting side plates, the two mounting side plates are respectively fixedly mounted on one end of the circuit board body, mounting rods are respectively fixedly mounted on the two mounting side plates, a plurality of heat dissipation fins are movably mounted between the two mounting rods, a first heat conductive sheet is movably mounted on the outer side of the heat dissipation fins, and a second heat conductive sheet is movably mounted on the lower end of the first heat conductive sheet.
2. The high heat dissipation embedded multi-layer circuit board according to claim 1, characterized in that: A bottom plate is fixedly mounted on the lower end of the mounting side plate, and support frames are fixedly connected to the lower ends of the mounting rods on both sides of the mounting side plate.
3. The high heat dissipation embedded multi-layer circuit board according to claim 2, characterized in that: Slide grooves are provided on both sides of the installation rod.
4. The high heat dissipation embedded multi-layer circuit board according to claim 3, characterized in that: Screws are inserted and installed in the through holes in the bottom plate, and the screws pass through the bottom plate and are threadedly connected in the corresponding installation holes.
5. The high heat dissipation embedded multi-layer circuit board according to claim 4, characterized in that: Connecting blocks are fixedly installed on both sides of the heat dissipation fin, and the connecting blocks are in an inverted C-shaped structure. Sliders are fixedly installed on both sides of the connecting block, and the connecting blocks are slidably installed on the mounting rods through the sliders, that is, the heat dissipation fins are slidably installed between the two mounting rods through the connecting blocks on both sides.
6. The high heat dissipation embedded multi-layer circuit board according to claim 1, characterized in that: A slot is provided at the upper end of the first heat conducting plate, an adjustment slot is provided at the lower end of the first heat conducting plate, pressing plates are movably connected to both sides of the adjustment slot, and the first heat conducting plate is installed on the outer side of the heat dissipation fin through the slot.
7. The high heat dissipation embedded multi-layer circuit board according to claim 6, characterized in that: A third heat conducting plate is fixedly installed at the center position of the upper end of the second heat conducting plate, and a plurality of supporting fins are fixedly connected between the second heat conducting plate and both sides of the third heat conducting plate. The upper end of the third heat conducting plate is inserted and installed in the adjustment groove, and the two pressing plates are pressed and bent toward one side of the third heat conducting plate respectively.