Switching power supply and electronic equipment
By setting a hot wire on the circuit board of the miniaturized switching power supply, thermally coupling the transformer or filter inductor with the synchronous rectifier switch tube, the problem of poor heat dissipation performance caused by small heat dissipation area of the synchronous rectifier switch tube is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202421150027.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-24
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-05-24
AI Technical Summary
In the miniaturized switching power supply, the heat dissipation area of the synchronous rectifier switch tube is small, resulting in poor heat dissipation performance and affecting the service life of the equipment.
By setting up a heat conductor on the circuit board, the transformer or filter inductor with a large heat dissipation area is thermally coupled with the synchronous rectifier switch tube to achieve heat transfer and heat dissipation.
It improves the heat dissipation efficiency of the synchronous rectifier switch tube, improves the heat dissipation effect of the miniaturized switching power supply, and extends the service life of the equipment.
Smart Images

Figure CN222621284U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic products, and in particular to a switching power supply and electronic equipment. Background Art
[0002] With the increasingly diverse application scenarios, switching power supplies are constantly updated, and the demand for miniaturization of power supplies is increasing. However, miniaturization of power supplies will bring challenges in heat dissipation. In particular, the heat dissipation problem is particularly serious for synchronous rectifier switch tubes with small heat dissipation areas in miniaturized switching power supplies. Utility Model Content
[0003] In view of this, the present application provides a switching power supply and an electronic device to improve the problem of poor heat dissipation performance of a synchronous rectifier switch tube with a small heat dissipation area in the switching power supply.
[0004] The technical solution adopted by this application to solve the above technical problems is:
[0005] In a first aspect, an embodiment of the present application provides a switching power supply, comprising:
[0006] Circuit boards;
[0007] A first component and a second component are both mounted on the circuit board, and a heat dissipation area of the first component is larger than a heat dissipation area of the second component;
[0008] A heat conducting wire is disposed on the circuit board and is located between the first component and the second component, and the heat conducting wire is thermally coupled with the first component and the second component respectively;
[0009] Among them, the first component includes a transformer and / or a filter inductor, and the second component is a synchronous rectification switch tube.
[0010] In some embodiments of the present application, the heat-conducting wire is a conductor, and the first component and the second component are also electrically connected via the heat-conducting wire.
[0011] In some embodiments of the present application, a third component is also installed on the circuit board, and the third component includes any one of all remaining components on the circuit board except the first component and the second component, and the distance between the second component and the first component is smaller than the distance between the second component and the third component.
[0012] In some embodiments of the present application, the synchronous rectification switch tube includes a first MOS tube and a second MOS tube.
[0013] In some embodiments of the present application, both the first MOS tube and the second MOS tube are surface-mount MOS tubes.
[0014] In some embodiments of the present application, a metal column is further provided on the circuit board, and the heat conductive wire is further provided between the metal column and the second component, and is thermally coupled to the metal column and the second component respectively.
[0015] In some embodiments of the present application, the distance between the second component and the metal pillar is less than or equal to the minimum distance between the second component and each component on the circuit board except the second component.
[0016] In some embodiments of the present application, a heat conducting member is also provided on the circuit board;
[0017] The heat conducting member is located between the first component and the second component, and is thermally coupled to the first component and the second component respectively; and / or,
[0018] The heat conducting member is located between the metal column and the second component, and is thermally coupled to the metal column and the second component respectively.
[0019] In some embodiments of the present application, a first bending connecting portion and a second bending connecting portion are respectively provided at both ends of the heat conductor, the first connecting portion is connected to the second component, the second connecting portion is connected to the first component and / or the metal column, and the middle portion of the heat conductor is suspended relative to the circuit board.
[0020] In a second aspect, an embodiment of the present application further provides an electronic device, comprising a switching power supply as described in any one of the above items.
[0021] In summary, due to the adoption of the above technical solution, this application has at least the following beneficial effects:
[0022] The switching power supply and electronic device provided in the present application achieves heat transfer from the synchronous rectification switch tube to the transformer or the filter inductor through the thermal wire by thermally coupling the synchronous rectification switch tube with a small heat dissipation area on the circuit board with the transformer or the filter inductor with a large heat dissipation area through the thermal wire, so that the heat is dissipated through the transformer or the filter inductor, thereby improving the heat dissipation efficiency of the synchronous rectification switch tube with a small heat dissipation area in the miniaturized switching power supply, thereby improving the problem of the miniaturized switching power supply being difficult to dissipate heat to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments are briefly introduced below. Obviously, the drawings described below only relate to some embodiments of the present application, but are not intended to limit the present application, wherein:
[0024] Figure 1 A schematic diagram of the structure of a switching power supply provided in an embodiment of the present application;
[0025] Figure 2 Another structural schematic diagram of the switching power supply provided in the embodiment of the present application;
[0026] Figure 3 A schematic diagram of a structure in which a filter inductor and a transformer in a switching power supply provided in an embodiment of the present application are connected to a second component through a heat conducting wire and a heat conducting member respectively;
[0027] Figure 4 A schematic diagram of a structure in which a metal column, a filter inductor, and a transformer in a switching power supply provided in an embodiment of the present application are connected to a second component via a heat-conducting wire and a heat-conducting member;
[0028] Figure 5 A schematic diagram of the structure of a heat conducting member provided in an embodiment of the present application;
[0029] Figure 6 A schematic diagram of the circuit structure of the switching power supply provided in an embodiment of the present application.
[0030] The accompanying drawings are as follows:
[0031] 1. Circuit board; 2. First component; 21. Transformer; 22. Filter inductor; 3. Second component; 31. Synchronous rectifier switch tube; 4. Heat conducting wire; 5. Heat conducting member; 51. First connecting part; 52. Second connecting part; 6. Metal column. DETAILED DESCRIPTION
[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.
[0033] In the description of this application, it should be understood that the words "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0034] In this application, the word "exemplary" is used to mean "used as an example, illustration, or description". Any embodiment described in this application as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is given to enable any technician in the field to implement and use the present application. In the following description, details are listed for the purpose of explanation. It should be understood that a person of ordinary skill in the art can recognize that the present application can be implemented without using these specific details. In other instances, known structures and processes are not elaborated in detail to avoid obscuring the description of the present application with unnecessary details. Therefore, the present application is not intended to be limited to the embodiments shown, but is consistent with the widest scope consistent with the principles disclosed in this application.
[0035] In the related art, the MOS tubes in the switching power supply, for example, the two MOS tubes of synchronous rectification, generate a lot of heat, which causes the entire switching power supply to heat up seriously, thereby easily reducing the service life of the switching power supply. Specifically, in the switching power supply in the related art, the selection of the internal MOS tubes needs to take into account both the rapid assembly and the volume of the switching power supply. Therefore, the MOS tubes are usually selected as surface-mount MOS tubes. However, surface-mount MOS tubes are relatively flat and usually do not contact the housing of the switching power supply. As a result, the heat generated by the MOS tube is not easy to dissipate through the housing of the switching power supply, which leads to poor heat dissipation effect of the miniaturized switching power supply.
[0036] Based on the above prior art, see Figure 1 and Figure 2 As shown, Figure 1 A schematic diagram of the structure of a switching power supply provided in an embodiment of the present application is shown in FIG. Figure 2 Another structural schematic diagram of a switching power supply provided in an embodiment of the present application is provided in an embodiment of the present application. The present application provides a switching power supply, including:
[0037] Circuit board 1;
[0038] The first component 2 and the second component 3 are both mounted on the circuit board 1, and the heat dissipation area of the first component 2 is larger than the heat dissipation area of the second component 3;
[0039] The heat conducting wire 4 is disposed on the circuit board 1 and is located between the first component 2 and the second component 3. The heat conducting wire 4 is thermally coupled with the first component 2 and the second component 3 respectively.
[0040] The first component 2 includes a transformer 21 and / or a filter inductor 22 , and the second component 3 is a synchronous rectification switch tube 31 .
[0041] It is understood that the material of the heat conducting wire 4 includes but is not limited to metal copper, metal silver, metal aluminum, etc. In some embodiments of the present application, the heat conducting wire can be made simultaneously with the conductive circuit on the circuit board. Further, the heat conducting wire can be made of copper foil used to make the conductive circuit on the circuit board.
[0042] The embodiments of the present application include but are not limited to being applicable to narrow power supplies with a width of less than 54.5 mm, for example, a power supply with a width of 50.5 mm, a power supply with a width of 54.5 mm, etc.
[0043] Understandably, see Figure 6 As shown, Figure 6 This is a schematic diagram of the circuit structure of the switching power supply provided in the embodiment of the present application. The synchronous rectification switching power supply generally includes key components such as a transformer 21, a synchronous rectification switch tube 31, a capacitor, a control circuit and a filter inductor 22.
[0044] Transformer 21: Transformer 21 plays a role in voltage conversion in the synchronous rectification switching power supply. Specifically, transformer 21 is used to convert the input voltage into the required output voltage through the principle of electromagnetic induction, and transmit it to the subsequent circuit for rectification and filtering.
[0045] Synchronous rectifier switch tube 31: The synchronous rectifier switch tube 31 (usually a power semiconductor device such as MOSFET or IGBT) is the core control element in the synchronous rectifier switching power supply, and is used to rectify the output voltage of the transformer 21. Compared with other rectifier circuit structures in the related art, the synchronous rectifier switch tube 31 can reduce the voltage drop during the rectification process, reduce energy loss, thereby improving the efficiency of the entire switching power supply, and can more accurately control the current and voltage, so that the performance of the switching power supply is further optimized.
[0046] Capacitor at the output end: The capacitor plays a role of filtering and energy storage in the synchronous rectification switching power supply. When the synchronous rectification switch tube 31 is turned on, the capacitor will store electrical energy; when the synchronous rectification switch tube 31 is turned off, the capacitor will release electrical energy to maintain the stability of the output voltage. By reasonably selecting the capacitance and type of the capacitor, the ripple and noise of the output voltage can be effectively reduced.
[0047] Control circuit: The control circuit is the brain of the synchronous rectifier switching power supply, responsible for monitoring and adjusting the working state of the power supply. It controls the on and off time of the synchronous rectifier switch tube 31 according to the feedback signals of the input / output voltage and input / output current to achieve precise regulation of the output voltage and output current. In addition, the control circuit also has protection functions such as over-current, over-voltage and over-temperature protection to ensure the safe and stable operation of the power supply.
[0048] Filter inductor 22: The filter inductor 22 is mainly used for filtering and energy storage in the synchronous rectification switching power supply. It can store part of the energy through its own magnetic energy when the synchronous rectification switch tube 31 is turned off, and release this part of the energy when the synchronous rectification switch tube 31 is turned on again, thereby smoothing the fluctuation of the output voltage. In addition, the filter inductor 22 can also form an LC filter together with the capacitor to further reduce the ripple of the output voltage.
[0049] Figure 5 In the figure, diode D10, diode D11 and capacitor C15 are used to provide a stable voltage to the control circuit.
[0050] Q21 and Q8 are used to provide a stable voltage to the first synchronous rectification switch tube; Q16 and Q22 are used to provide a stable voltage to the second synchronous rectification switch tube.
[0051] Since the transformer 21 or the filter inductor 22 has a large heat dissipation area and is easy to dissipate heat, the transformer 21 or the filter inductor 22 has a good heat dissipation effect compared to other components on the circuit board 1, while the synchronous rectifier switch tube 31 has a small heat dissipation area and is not easy to dissipate heat, and the heating of the synchronous rectifier switch tube 31 is relatively serious. In the embodiment of the present application, the transformer 21 or the filter inductor 22 is thermally coupled with the synchronous rectifier switch tube 31 through the heat conductor 4, and the heat in the synchronous rectifier switch tube 31 can be transferred to the transformer 21 or the filter inductor 22 through the heat conductor 4 and dissipated through the transformer 21 or the filter inductor 22, thereby helping the synchronous rectifier switch tube 31 to achieve a better heat dissipation effect.
[0052] Beneficial effects of the embodiments of the present application: The embodiments of the present application thermally couple the synchronous rectifier switch tube 31 with a small heat dissipation area on the circuit board 1 with the transformer 21 and the filter inductor 22 with a large heat dissipation area through the heat conductor 4, so that the heat in the synchronous rectifier switch tube 31 is transferred to the transformer 21 or the filter inductor 22 through the heat conductor, and the heat is dissipated through the transformer 21 or the filter inductor 22, thereby improving the heat dissipation efficiency of the synchronous rectifier switch tube 31 with a small heat dissipation area in the miniaturized switching power supply, thereby improving the problem of the miniaturized switching power supply being difficult to dissipate heat to a certain extent.
[0053] In some embodiments of the present application, the heat conducting wire 4 is a conductor, and the first component 2 and the second component 3 are also electrically connected via the heat conducting wire 4 .
[0054] It can be understood that the width of the heat conducting wire 4 can be set according to the power of each component on the circuit board 1, and the present application does not limit its specific value.
[0055] In the embodiment of the present application, the heat conducting wire 4 is set as a conductor, so that the heat conducting wire 4 can not only transfer the heat on the synchronous rectification switch tube 31 to the transformer 21 and / or the filter inductor 22 with a larger heat dissipation area for heat dissipation, but also enable the heat conducting wire 4 to serve as an electrical connection function on the circuit board as a conductor, thereby helping to simplify the structure of the switching power supply and reduce the difficulty of production.
[0056] In some embodiments of the present application, a third component is also installed on the circuit board 1, and the third component includes any one of all remaining components on the circuit board 1 except the first component 2 and the second component 3, and the distance between the second component 3 and the first component 2 is smaller than the distance between the second component 3 and the third component.
[0057] It can be understood that the circuit board 1 can have a first surface and a second surface that are arranged opposite to each other. In order to facilitate the miniaturization of the switching power supply, the larger components (for example, transformers and filter inductors) and the second components 3 on the circuit board 1 are generally arranged on the same surface of the circuit board 1, while the smaller components (for example, synchronous rectifier switches) can be selectively arranged on the same side or on the opposite side with the larger components according to the available installation space on the circuit board 1.
[0058] In some embodiments of the present application, the first component 2 and the second component 3 are arranged on the same surface of the circuit board 1, and the third component includes: the remaining components except the first component 2 and the second component 3 arranged on the same side as the first component 2 and the second component 3, and the components arranged on the opposite side as the first component 2 and the second component 3.
[0059] It should be noted that the distance between the second component 3 and the first component 2 refers to the minimum distance between the orthographic projection of the second component 3 and the orthographic projection of the first component 2 in the projection plane perpendicular to the thickness direction of the circuit board 1. Correspondingly, the distance between the second component 3 and the third component refers to the minimum distance between the orthographic projection of the second component 3 and the orthographic projection of the third component in the projection plane perpendicular to the thickness direction of the circuit board 1.
[0060] It can be understood that the closer the distance between the transformer 21 and / or the filter inductor 22 and the synchronous rectifier switch tube 31 is, the shorter the heat conductor 4 required between the transformer 21 and / or the filter inductor 22 and the synchronous rectifier switch tube 31 is, so that the efficiency of heat transfer in the second component 3 through the heat conductor 4 is higher. Therefore, arranging the synchronous rectifier switch tube 31 and the transformer 21 and / or the filter inductor 22 adjacent to each other can make the efficiency of heat transfer from the synchronous rectifier switch tube 31 to the transformer 21 and / or the filter inductor 22 higher. In addition, the shorter the heat conductor 4 between the transformer 21 and / or the filter inductor 22 and the synchronous rectifier switch tube 31 is, the lower the material cost of the heat conductor 4 is, and the smaller the resistance when the electrical signal is transmitted between the transformer 21 and / or the filter inductor 22 and the synchronous rectifier switch tube 31 is.
[0061] Preferably, the wider the copper foil is and the thicker it is, the more conducive it is to improving the thermal conductivity. When laying out and routing the PCB, increase the copper foil routing (marked by red lines) and place Q13, Q10, T2, and L3 close together. In this way, the copper foil conducts heat to T2 / L3 to help Q10 / Q13 dissipate heat. For example, set the copper foil thickness to 2.5OZ and the width to 1mm / 2A (the copper foil width is related to the output power, and the copper foil width can be set according to the circuit output power). The greater the power, the wider the copper foil required.
[0062] In some embodiments of the present application, the synchronous rectification switch tube 31 includes a first MOS tube and a second MOS tube, and the first MOS tube and the second MOS tube are synchronous rectification MOS tubes.
[0063] It can be understood that, generally, in the technology related to the switching power supply, the first component 2 (transformer, filter inductor, etc.) in the switching power supply is relatively large in size and easy to dissipate heat, while the first MOS tube and the second MOS tube in the switching power supply are relatively small in size and not easy to dissipate heat. Therefore, the heat on the first MOS tube and the second MOS tube is transferred to the first component 2, so that the heat on the first MOS tube and the second MOS tube can be transferred to the first component 2 through the heat conductor 4, and the heat is dissipated through the surface of the first component 2, thereby improving the heat dissipation performance of the first MOS tube and the second MOS tube with a smaller heat dissipation area.
[0064] In some embodiments of the present application, the first MOS tube and the second MOS tube are both surface-mount MOS tubes.
[0065] It can be understood that in the related art, in the field of miniaturized switching power supplies, in order to improve the internal space utilization of the switching power supply, the first MOS tube and the second MOS tube are usually surface mount MOS tubes. When the first MOS tube and the second MOS tube are surface mount MOS tubes, the first MOS tube and the second MOS tube are bonded to the circuit board 1 and are too thin, so the first MOS tube and the second MOS tube themselves are difficult to dissipate heat through contact with the wind flow, which is not conducive to the long service life of the switching power supply. The above means can solve the problem of low heat dissipation efficiency of surface mount MOS tubes.
[0066] In some embodiments of the present application, a metal column 6 is further provided on the circuit board 1, and the heat conducting wire 4 is further provided between the metal column 6 and the second component 3, and is thermally coupled to the metal column 6 and the second component 3 respectively.
[0067] It can be understood that when there is no filter inductor 22 at the output end in the circuit, the metal column 6 is connected to the synchronous rectifier switch tube 31. When there is a filter inductor 22 at the output end in the circuit, the metal column 6 can also be connected to the synchronous rectifier switch tube 31 to achieve further heat dissipation effect.
[0068] It can be understood that by arranging the metal column 6 on the circuit board 1 and thermally coupling the second component 3 with the metal column 6 through the heat conducting wire 4, the second component 3 can further dissipate heat with the help of the metal column 6, thereby helping to further improve the heat dissipation of the second component 3.
[0069] In some embodiments of the present application, the metal pillar 6 can be integrally provided with the conductive circuit structure on the circuit board 1. The distance between the second component 3 and the metal pillar 6 is less than or equal to the minimum distance between the second component 3 and each component on the circuit board 1 except the second component.
[0070] It can be understood that by making the distance between the second component 3 and the metal pillar 6 less than or equal to the minimum distance between the second component and each component on the circuit board 1 except the second component, the transfer efficiency of the heat conductor 5 can be improved, thereby further achieving the effect of quickly dissipating the heat in the second component 3. In addition, arranging the transformer 21, the filter inductor 22, the synchronous rectification switch tube 31 and the metal pillar 6 in close proximity is also conducive to the miniaturization of the switching power supply.
[0071] In some embodiments of this application, see Figure 3 and Figure 4 As shown, Figure 3 This is a schematic diagram of a structure in which a filter inductor and a transformer in a switching power supply provided in an embodiment of the present application are connected to a second component through a heat conducting wire and a heat conducting member respectively. Figure 4A schematic diagram of a structure in which a metal column, a filter inductor, and a transformer in a switching power supply provided in an embodiment of the present application are connected to a second component through a heat conducting wire and a heat conducting member, and the switching power supply further includes a heat conducting member 5;
[0072] The heat conducting member 5 may be disposed between the first component 2 and the second component 3 and thermally coupled to the first component 2 and the second component 3 respectively; and / or,
[0073] The heat conducting member 5 is disposed between the second component 3 and the metal column 6 , and is thermally coupled to the second component 3 and the metal column 6 , respectively. Figure 4 In the example shown, the heat conductor 5 is disposed between the first component 2 and the second component 3 , and is thermally coupled to the first component 2 and the second component 3 , respectively.
[0074] It can be understood that the heat conducting member 5 can be in the shape of a connecting sheet or a connecting strip, and can be made of metals such as copper or silver, alloys such as aluminum alloy, metal oxides and other materials that are easy to conduct heat.
[0075] In the embodiment of the present application, the first component 2 and the second component 3 are electrically connected and thermally coupled via the heat conducting wire 4, and the first component 2 and the second component 3 are also connected and thermally coupled via the heat conducting member 5, so that the heat of the second component 3 can be transferred to the first component 2 via the heat conducting wire 4 and the heat conducting member 5, respectively, thereby further improving the effect of quickly dissipating the heat in the second component 3. By thermally coupling the metal column 6 and the second component 3 via the heat conducting wire 4 and the heat conducting member 5, respectively, it is helpful to further improve the heat dissipation efficiency of the second component 3.
[0076] In some embodiments of this application, see Figure 5 As shown, Figure 5 This is a structural schematic diagram of a heat conductor provided in an embodiment of the present application, wherein a first bending connection portion 51 and a second bending connection portion 52 are respectively provided at both ends of the heat conductor 5, the first connection portion 51 is connected to the second component 3, the second connection portion 52 is connected to the first component 2 and / or the metal column 6, and the middle portion of the heat conductor 5 is suspended relative to the circuit board 1.
[0077] It can be understood that the middle part of the heat conductor 5 is suspended relative to the circuit board 1, so that the heat dissipation surface of the heat conductor 5 is not limited to the top surface of the heat conductor 5, but also includes the bottom surface of the heat conductor 5, so that the heat conductor 5 can dissipate heat on both sides simultaneously during the process of heat conduction, thereby increasing the heat dissipation area and heat dissipation effect of the heat conductor 5 to a certain extent, thereby improving the effect of quickly dissipating the heat in the second component 3.
[0078] Based on the same inventive concept, an embodiment of the present application further provides an electronic device, comprising a switching power supply as described above.
[0079] It can be understood that since the switching power supply in the embodiment of the present application has the function of improving the poor heat dissipation performance of the synchronous rectifier switch tube 31 with a relatively small heat dissipation area in the switching power supply, the electronic device provided in the embodiment of the present application also has this effect, which will not be repeated here.
[0080] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements and amendments to the present application. Such modifications, improvements and amendments are suggested in the present application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present application.
[0081] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.
[0082] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more application embodiments, in the above description of the embodiments of this application, multiple features are sometimes merged into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.
[0083] Each patent, patent application, patent application publication, and other materials, such as articles, books, specifications, publications, documents, etc., cited in this application is hereby incorporated by reference in its entirety, except for application history documents that are inconsistent with or conflicting with the content of this application, and documents that limit the broadest scope of the claims of this application (currently or later attached to this application). It should be noted that if the descriptions, definitions, and / or use of terms in the attached materials of this application are inconsistent or conflicting with the content of this application, the descriptions, definitions, and / or use of terms in this application shall prevail.
Claims
1. A switching power supply, characterized in that: include: Circuit boards; A first component and a second component are both mounted on the circuit board, and a heat dissipation area of the first component is larger than a heat dissipation area of the second component; A heat conducting wire is disposed on the circuit board and is located between the first component and the second component, and the heat conducting wire is thermally coupled with the first component and the second component respectively; Among them, the first component includes a transformer and / or a filter inductor, and the second component is a synchronous rectification switch tube.
2. The switching power supply according to claim 1, characterized in that: The heat-conducting wire is a conductor, and the first component and the second component are also electrically connected via the heat-conducting wire.
3. The switching power supply according to claim 1, characterized in that: A third component is also installed on the circuit board. The third component includes any one of all the remaining components on the circuit board except the first component and the second component. The distance between the second component and the first component is smaller than the distance between the second component and the third component.
4. The switching power supply according to claim 1, characterized in that: The synchronous rectification switch tube includes a first MOS tube and a second MOS tube.
5. The switching power supply according to claim 4, characterized in that: The first MOS tube and the second MOS tube are both surface-mount MOS tubes.
6. The switching power supply according to any one of claims 1 to 5, characterized in that: A metal column is also arranged on the circuit board, and the heat conducting wire is also arranged between the metal column and the second component, and is thermally coupled with the metal column and the second component respectively.
7. The switching power supply according to claim 6, characterized in that: The distance between the second component and the metal column is less than or equal to the minimum distance between the second component and each component on the circuit board except the second component.
8. The switching power supply according to claim 6, characterized in that: The circuit board is also provided with a heat conducting member; The heat conducting member is located between the first component and the second component, and is thermally coupled to the first component and the second component respectively; and / or, The heat conducting member is located between the metal column and the second component, and is thermally coupled to the metal column and the second component respectively.
9. The switching power supply according to claim 8, characterized in that: The heat conductor has a first bending connection portion and a second bending connection portion at both ends, the first connection portion is connected to the second component, the second connection portion is connected to the first component and / or the metal column, and the middle portion of the heat conductor is suspended relative to the circuit board.
10. An electronic device, characterized in that: A switching power supply comprising a switching power supply as claimed in any one of claims 1 to 9.