Wafer processing system

Abstract

The utility model discloses a wafer processing system. Wafer loading and post-processing equipment of the wafer processing system integrates a function of loading a first wafer to be processed, a function of loading a second wafer subjected to process processing and a function of baking or cooling the second wafer. Besides, after the first wafer is subjected to the process treatment of the process chamber, a second wafer is formed, and the second wafer is directly conveyed to the wafer loading and post-processing equipment through the conveying device for loading and post-processing, so that compared with the prior art that the wafer is firstly baked by the wafer baking equipment and then is conveyed to the wafer loading equipment through the conveying device, the wafer loading and post-processing efficiency is greatly improved. Compared with the prior art, the wafer conveying process is simplified, the transfer time of the wafer between different devices is shortened, the risk that the wafer is polluted is reduced, and the processing quality of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a wafer processing system. Background Art

[0002] Chemical etching is currently a commonly used wafer etching method. It introduces etching gas, such as nitrogen trifluoride, to process the surface of the wafer. After etching is completed, a layer of useless solid compounds that will affect the performance of the chip will still adhere to the surface of the wafer. The prior art is to set a baking chamber in the etching machine, and transfer the wafer from the etching chamber to the baking chamber by a robot, and then through the baking treatment in the baking chamber, the solid compound is decomposed into several gaseous compounds, and the generated gaseous compounds are extracted with the help of a vacuum device, and finally the etched wafer is obtained, and then the etched wafer is placed in a lock chamber by a robot to facilitate the subsequent removal of the wafer. The lock chamber is located between the front-end control module and the transmission chamber, and is used to temporarily place the wafer and switch between the atmospheric environment and the vacuum environment. The above-mentioned robot is arranged in the transmission chamber, and the etching chamber and the baking chamber are arranged around the transmission chamber.

[0003] However, in the above-mentioned arrangement of the etching machine, the baking chamber needs to be set up separately, which reduces the space utilization rate of the semiconductor equipment, makes the wafer transfer process more complicated, and increases the wafer processing time and cost.

[0004] Therefore, the utility model provides a wafer processing system to solve the technical problems in the prior art that the space utilization rate of semiconductor equipment is relatively low and the wafer transfer process is relatively complicated. Utility Model Content

[0005] The problem solved by the embodiment of the utility model is to provide a wafer processing system for transferring wafers, thereby improving the space utilization rate of semiconductor equipment, simplifying the wafer transfer process, and reducing the wafer processing cost.

[0006] To solve the above problems, an embodiment of the utility model provides a wafer processing system, including: a wafer loading and post-processing device, which switches between a negative pressure state and an atmospheric pressure state, and is used to load a first wafer, and is also used to load a second wafer and post-process the second wafer, the first wafer is a wafer to be processed, and the second wafer is a wafer that has been processed; a transfer chamber, which is connected to the wafer loading and post-processing device under a negative pressure state, and is used to transfer the first wafer under a negative pressure state; a process chamber, which is connected to the transfer chamber, and is used to process the first wafer to form a second wafer; the transfer chamber is provided with: a conveying device, which is used to transfer the first wafer in the wafer loading and post-processing device to the process chamber, so that the first wafer is processed in the process chamber, and is also used to transfer the second wafer to the wafer loading and post-processing device for post-processing.

[0007] Compared with the prior art, the technical solution of the embodiment of the utility model has the following advantages:

[0008] The wafer processing system provided by the embodiment of the utility model includes: a wafer loading and post-processing device, which switches between a negative pressure state and an atmospheric pressure state, and is used to load a first wafer, and is also used to load a second wafer and post-process the second wafer, the first wafer is a wafer to be processed, and the second wafer is a wafer that has been processed, and the post-processing may include a baking treatment and a cooling treatment; a transfer chamber, which is connected to the wafer loading and post-processing device under a negative pressure state, and is used to transfer the first wafer under a negative pressure state; a process chamber, which is connected to the transfer chamber, and is used to process the first wafer; the transfer chamber is provided with: a conveying device, which is used to transfer the first wafer in the wafer loading and post-processing device to the process chamber, so that the first wafer is processed in the process chamber to form a second wafer, and is also used to transfer the second wafer to the wafer loading and post-processing device for post-processing. The wafer loading and post-processing equipment of the wafer processing system integrates the functions of loading the first wafer to be processed, loading the second wafer that has been processed, and baking or cooling the second wafer. Compared with the situation in which the wafer loading equipment and the wafer baking equipment are separated in the traditional wafer processing system, the production space utilization rate of the wafer processing system is improved, which is beneficial to increase production capacity and reduce costs; in addition, after the first wafer is processed in the process chamber to form the second wafer, it is directly conveyed to the wafer loading and post-processing equipment through the conveying device for loading and post-processing. After the post-processing is completed, it can be conveyed outward. Compared with the situation in which it is first baked by the wafer baking equipment, then sent to the wafer loading equipment for loading by the conveying device, and finally conveyed outward, the wafer conveying process is simplified, the time for transferring the wafer between different equipment is reduced, the risk of wafer contamination is reduced, and it is beneficial to improve the processing quality of the wafer.

[0009] In an optional solution, the wafer loading and post-processing equipment includes a cavity, the cavity has an upper end face and a lower end face, the upper end face is provided with a first groove, and the lower end face is provided with a second groove; an upper end cover is provided on the upper end face, the first groove is enclosed to form a first chamber, the first chamber is used to load the first wafer; a lower end cover is provided on the lower end face, the second groove is enclosed to form a second chamber, the second chamber is used to load the second wafer. In the embodiment of the utility model, the first groove and the upper end cover of the cavity enclose the first chamber, the second groove and the lower end cover of the cavity enclose the second chamber, the first chamber and the second chamber are arranged up and down, that is, a double-layer chamber structure, the first chamber is used to transfer the first wafer, the second chamber is used to receive the second wafer, and the second wafer in the second chamber is post-processed under the action of the temperature component. Therefore, the first chamber of the wafer loading and post-processing equipment is used to load the first wafer for the first wafer to be transferred to the process chamber, and the second chamber of the wafer loading and post-processing equipment is used to load the second wafer for baking, and transfer it to the outside after baking. During the wafer processing process, the first chamber and the second chamber of the wafer loading and post-processing equipment are managed differentially and perform different functions. The wafer loading and post-processing equipment has the functions of loading the wafer to be processed, loading the second wafer, and baking or cooling the second wafer. This is beneficial to optimizing the process of semiconductor equipment, improving wafer transfer efficiency, significantly improving the utilization efficiency of production space, and reducing costs.

[0010] In an optional solution, the temperature component includes: a base, the base is fixedly arranged on the lower end cover; a heating plate, arranged on the base, used to carry the second wafer and bake the second wafer; a cooling plate, arranged between the base and the heating plate, and the cooling plate is in contact with the heating plate, and the cooling plate cools the second wafer. In the embodiment of the utility model, the second wafer is post-processed by the heating plate and the cooling plate, which plays a role in volatilizing impurities on the surface of the second wafer at a certain temperature, and can also play a role in regulating the temperature in the cavity.

[0011] Optionally, the refrigeration plate comprises: a plate body, with the direction perpendicular to the surface of the plate body as the longitudinal direction; a water cooling channel, which is arranged in the plate body, and the water cooling channel is located in the middle of the plate body along the longitudinal direction.

[0012] Optionally, the water cooling channel is annular and evenly distributed in the disk body.

[0013] Optionally, the temperature component includes: a base, which is fixedly disposed on the lower end cover; a temperature disk, which is disposed on the base and is used to support the second wafer, and the temperature disk is also provided with a water cooling channel and a heating wire, and the water cooling channel is used to cool the second wafer; the heating wire is used to bake the second wafer; or, the temperature component includes: a base, which is fixedly disposed on the lower end cover and is used to support the second wafer, and a water cooling channel is disposed in the base and is used to cool the second wafer.

[0014] Optionally, the wafer loading and post-processing equipment also includes: a lifting mechanism, which is arranged at the bottom of the lower end cover, the lifting mechanism includes an output end, and the lifting mechanism drives the output end to move in a direction close to or away from the lower end cover; a connecting block, which is connected to the output end; a plurality of circumferentially distributed bellows, which are arranged on the top of the connecting block; and a ejector pin, which is connected to the top of the bellows, the ejector pin is slidably arranged in the cooling plate and the heating plate, and the ejector pin can protrude from the top surface of the heating plate.

[0015] Optionally, the upper end cover is provided with a through process slot and a window detachably connected to the process slot.

[0016] Optionally, a first air extraction hole and a second air extraction hole are provided on the side wall of the cavity, the first air extraction hole is communicated with the first chamber, and the second air extraction hole is communicated with the second chamber.

[0017] Optionally, one or more first openings communicating with the first chamber are provided on the side wall of the cavity, and the first openings are used for transferring the first wafer from the first chamber to the process chamber; one or more second openings communicating with the second chamber are provided on the side wall of the cavity, and the second openings are used for transferring the second wafer into the second chamber.

[0018] Optionally, the first chamber includes one or more first accommodating chambers; and the second chamber includes one or more second accommodating chambers.

[0019] Optionally, the transfer chamber is a pentagon with five side walls; the wafer loading and post-processing equipment is connected to a side wall of the transfer chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the wafer processing system of the utility model;

[0021] Figure 2 It is a schematic diagram of the structure of the wafer loading and post-processing equipment of the wafer processing system of the utility model;

[0022] Figure 3 It is a schematic diagram of the structure of the cavity in the wafer loading and post-processing equipment of the wafer processing system of the utility model;

[0023] Figure 4 It is a cross-sectional schematic diagram of a cavity in a wafer loading and post-processing device of a wafer processing system of the utility model;

[0024] Figure 5 It is a schematic diagram of the structure of the temperature component in the wafer loading and post-processing equipment of the wafer processing system of the utility model;

[0025] Figure 6 It is a cross-sectional schematic diagram of a cooling plate in a wafer loading and post-processing device of a wafer processing system of the utility model;

[0026] Figure 7 It is a cross-sectional schematic diagram of the combination of a temperature component and a lifting mechanism in a wafer loading and post-processing device of a wafer processing system of the utility model. DETAILED DESCRIPTION

[0027] As can be seen from the background technology, the baking chamber needs to be set up separately, which reduces the space utilization rate of the semiconductor equipment, makes the wafer transfer process more complicated, and increases the wafer processing time and cost.

[0028] In order to solve the above technical problems, an embodiment of the utility model provides a wafer processing system, including: a wafer loading and post-processing device, which switches between a negative pressure state and an atmospheric pressure state, and is used to load a first wafer to be processed, and is also used to load a second wafer that has been processed and post-process the second wafer; a transfer chamber, which is connected to the wafer loading and post-processing device under a negative pressure state, and is used to transfer the first wafer under a negative pressure state; a process chamber, which is connected to the transfer chamber, and is used to process the first wafer; the transfer chamber is provided with: a conveying device, which is used to transfer the first wafer in the wafer loading and post-processing device to the process chamber, so that the first wafer is processed in the process chamber, and is also used to transfer the second wafer to the wafer loading and post-processing device for post-processing.

[0029] The wafer processing system provided by the embodiment of the utility model is suitable for semiconductor etching equipment and semiconductor coating equipment.

[0030] The wafer loading and post-processing equipment of the wafer processing system provided by the embodiment of the utility model integrates the functions of loading the first wafer to be processed, loading the second wafer that has been processed, and performing post-processing such as baking and cooling on the second wafer. Compared with the situation in which the wafer loading equipment and the wafer baking equipment are separated in the traditional wafer processing system, the production space utilization rate of the wafer processing system is improved, which is beneficial to increase production capacity and reduce costs; in addition, after the first wafer is processed in the process chamber to form the second wafer, it is directly conveyed to the wafer loading and post-processing equipment through the conveying device for loading and post-processing, and can be conveyed outward after the post-processing is completed. Compared with the situation in which the first wafer is baked by the wafer baking equipment, then sent to the wafer loading equipment for loading by the conveying device, and finally conveyed outward, the wafer conveying process is simplified, the time for transferring the wafer between different equipment is reduced, the risk of wafer contamination is reduced, and it is beneficial to improve the processing quality of the wafer.

[0031] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present utility model more obvious and easy to understand, the specific embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0032] refer to Figure 1 , Figure 1 The schematic diagram of the structure of the wafer processing system of the present invention is shown.

[0033] The wafer processing system includes: a front-end control module 13, a wafer loading and post-processing device 10, a transfer chamber 11 and a process chamber 12. Figure 1 exemplifies a pentagonal transfer chamber 11 and four process chambers 12 arranged around the transfer chamber 11. Figure 1The wafer processing system shown is only used as an example and does not limit the actual protection content of the utility model. The wafer loading and post-processing equipment 10 switches between a negative pressure state and an atmospheric pressure state, and is used to load a first wafer, and is also used to load a second wafer and post-process it. The first wafer is a wafer to be processed, and the second wafer is a wafer that has been processed. The post-processing includes baking and cooling; the transfer chamber 11 is connected to the wafer loading and post-processing equipment 10 in a negative pressure state, and is used to transfer the first wafer in a negative pressure state; the process chamber 12 is connected to the transfer chamber 11, and is used to process the first wafer to obtain a second wafer. In this embodiment, four process chambers arranged around the transfer chamber 11 are exemplified. In fact, the number of process chambers can be set according to actual conditions. The transfer chamber 11 is provided with: a conveying device (not shown in the figure), which is used to convey the first wafer in the wafer loading and post-processing equipment 10 to the process chamber 12, so that the first wafer is processed in the process chamber 12 to obtain a second wafer, and is also used to convey the second wafer to the wafer loading and post-processing equipment 10 for post-processing operations such as baking or cooling. The wafer after the post-processing operation is taken out through the front-end control module 13.

[0034] The wafer loading and post-processing equipment 10 of the wafer processing system provided by the embodiment of the utility model integrates the functions of loading the first wafer to be processed, loading the second wafer after the process, and post-processing the second wafer. Compared with the situation in which the wafer loading equipment and the wafer baking equipment are separated in the traditional wafer processing system, the production space utilization rate of the wafer processing system is improved, which is conducive to increasing production capacity and reducing costs.

[0035] refer to Figures 2 to 7 , wafer loading and post-processing equipment, including: a chamber 100 (such as Figure 2 As shown), the cavity 100 has an upper end surface 100a (as shown Figure 4 ) and the lower end surface 100b (as shown Figure 4 As shown), the upper end surface 100a is provided with a first groove 101 (as shown Figure 4 As shown), the lower end surface 100b is provided with a second groove 102 (as shown Figure 4 As shown); upper end cover 103 (as Figure 2 ), arranged on the upper end surface 100a, the first groove 101 is surrounded by a first chamber 104 (as shown Figure 2 As shown), the first chamber 104 is used to load the first wafer; the lower end cover 106 (as shown Figure 2 ), arranged on the lower end surface 100b, the second groove 102 is surrounded by a second chamber 105 (as shown Figure 2As shown), the second chamber 105 is used to load the second wafer; the temperature component 107 (as shown Figure 2 As shown), it is arranged on a side of the lower end cover 106 facing the second groove 102, and the temperature component 107 is used to carry the second wafer and perform post-processing.

[0036] The first chamber 104 of the wafer loading and post-processing device 10 provided in the embodiment of the utility model is used to load the first wafer, so that the first wafer can be transferred to the process chamber, and the second chamber 105 of the wafer loading and post-processing device 10 is used to load the second wafer for post-processing such as baking, and is sent out through the front-end control module 13 after the processing is completed. Before the first wafer waits for process processing, because the post-processing function is temporarily not enabled, the wafer can be loaded through the first chamber 104 or through the second chamber 105; after the wafer completes the process processing, the second wafer is obtained, and the second wafer is transferred to the second chamber 105, and the temperature of the temperature component 107 is adjusted to perform post-processing operations such as baking or cooling on the second wafer.

[0037] In this embodiment, the first chamber 104 and the second chamber 105 are respectively located at the upper and lower ends of the cavity 100. The first chamber 104 and the second chamber 105 are isolated from each other, so that the first chamber 104 will not affect each other when loading the wafer to be processed and the second chamber 105 loads the second wafer, and the second wafer is post-processed.

[0038] It should be noted that a positioning block 110 (such as Figure 4 ), which is used to position the wafer placed in the first chamber 104.

[0039] For high-end wafer manufacturing processes, even a small positioning deviation may lead to wafer processing defects, affecting the performance and reliability of the final product. By setting the positioning block 110, the wafer can be accurately positioned, which helps to reduce the deviation and error of the wafer during the transfer process and ensure the accuracy and consistency of wafer processing.

[0040] In this embodiment, the cavity 100 is a rectangular parallelepiped structure, and the upper end surface 100a and the lower end surface 100b of the cavity 100 are respectively the top surface and the bottom surface of the rectangular parallelepiped structure, that is, the first groove 101 and the second groove 102 are respectively located on the top surface and the bottom surface of the rectangular parallelepiped structure.

[0041] It should be noted that the side wall of the cavity 100 includes 100c (such as Figure 3 ), and 100d (as shown) opposite to 100c Figure 3 shown).

[0042] In this embodiment, the side wall of the cavity 100 is provided with one or more first openings 109 (such as Figure 3 As shown in the figure, the first opening is used for transferring the first wafer from the first chamber 104 to the process chamber 12; one or more second openings 108 connected to the second chamber 105 are provided on the side wall of the cavity 100, and the second openings 108 are used for transferring the second wafer into the second chamber 105.

[0043] As an example, the first opening 109 and the second opening 108 are both located at 100d (eg, Figure 3 shown).

[0044] It should be noted that one or more third openings (not shown in the figure) are also provided on the side wall of the first chamber 104, and the third openings are used for loading the first wafer from the outside into the wafer loading and post-processing equipment 10; one or more fourth openings (not shown in the figure) are also provided on the side wall of the second chamber 105, and the fourth openings are used for taking the second wafer out of the wafer loading and post-processing equipment 10.

[0045] As an example, the third opening and the fourth opening are both located at 100c of the cavity 100 (eg Figure 3 shown).

[0046] In this embodiment, a first air extraction hole 111 and a second air extraction hole 112 are provided on the side wall of the cavity 100 . The first air extraction hole 111 is communicated with the first chamber 104 , and the second air extraction hole 112 is communicated with the second chamber 105 .

[0047] After the wafer loading and post-processing equipment 10 loads the first wafer in the first chamber 104, the first exhaust hole 111 is used to extract the gas in the first chamber 104, so that the first chamber 104 is in a vacuum state, so that the first wafer can be transferred to the process chamber for process treatment in a vacuum state to obtain a second wafer. After the wafer loading and post-processing equipment 10 loads the second wafer in the second chamber 105, the temperature component 107 is used to bake the second wafer, and the second exhaust hole 112 is used to extract the gas volatilized by the processed wafer during the baking process, so that the second chamber 105 remains in a vacuum state.

[0048] In this embodiment, refer to Figure 2 The first chamber 104 includes one or more first accommodating chambers 104a; the second chamber 105 includes one or more second accommodating chambers (not shown in the figure).

[0049] When the wafer loading and post-processing device 10 is working, the first accommodating cavity 104a is used to accommodate the first wafer, and the second accommodating cavity 105 is used to accommodate the second wafer. In other words, the number of the first accommodating cavities 104a determines the maximum number of the first wafers that can be loaded at the same time when the wafer loading and post-processing device 10 is transferring the first wafer; the number of the second accommodating cavities 105 determines the maximum number of the second wafers that can be received at the same time when the wafer loading and post-processing device 10 is receiving the second wafer.

[0050] In this embodiment, refer to Figure 2 The wafer loading and post-processing equipment 10 also includes: a plurality of gate valves 118, which correspond to the first opening 108, the second opening 109, the third opening and the fourth opening, respectively, and are used to close or open the first opening 108, the second opening 109, the third opening and the fourth opening.

[0051] It should be noted that when the gate valve 118 corresponding to the first opening 108 and the second opening 109 is opened, the first chamber 104 and the second chamber 105 are in a vacuum state; when the gate valve 118 corresponding to the third opening and the fourth opening is opened, the first chamber 104 and the second chamber 105 are in a normal pressure state.

[0052] In this embodiment, Figure 5 As shown, the temperature component 107 includes: a base 1071, which is fixedly disposed on the lower end cover 106; and a heating plate 1072, which is disposed on the base 1071 and is used to heat the second wafer.

[0053] The base 1071 provides a supporting platform and is fixedly disposed on the lower end cover 106 so that the temperature component 107 is fixed on the cavity 100 . The heating plate 1072 is disposed on the base 1071 for supporting the second wafer and heating the wafer at the same time.

[0054] In this embodiment, the heating plate 1072 can provide stable and uniform heat to meet the strict temperature control during wafer processing. The layout design of the heating wire in the heating plate 1072 is crucial, which affects the uniformity and efficiency of heating. The heating wire can be designed in a spiral, ring or other shape, evenly distributed on the bottom or side of the heating plate 1072 to provide uniform heat distribution.

[0055] It should be noted that the temperature component 107 includes a cooling plate 1073 , which is located between the base 1071 and the heating plate 1072 and contacts the heating plate 1072 .

[0056] During the process of wafer loading and post-processing equipment operation, the heating plate 1072 heats up the second wafer, the cooling plate 1073 contacts the heating plate 1072, and the cooling plate 1073 absorbs the heat of the heating plate 1072, which is conducive to ensuring the uniformity of heating the second wafer by the heating plate 1072, and also plays a role in regulating the temperature in the second chamber 105, avoiding the negative impact caused by the excessive temperature in the second chamber 105. In addition, it is also helpful to quickly cool the second wafer, reduce the thermal stress of the wafer, and improve the structural stability and quality of the processed wafer.

[0057] It should be noted that, in this embodiment, the cooling plate 1073 and the base 1071 are an integrated structure. The cooling plate 1073 and the base 1071 are an integrated structure, which is conducive to improving assembly efficiency and increasing product integration. In other embodiments, the cooling plate and the base can also be separate and different structures.

[0058] like Figure 6 As shown, the refrigeration plate 1073 includes: a plate body 1073a, with the direction perpendicular to the surface of the plate body 1073a as the longitudinal direction; a water cooling channel 1073b, which is arranged in the plate body 1073a, and the water cooling channel 1073b is located in the middle position of the plate body 1073a along the longitudinal direction.

[0059] In the embodiment of the utility model, the cooling plate 1073 is in contact with the heating plate 1072, specifically, the plate body 1073a of the cooling plate 1073 is in contact with the heating plate 1072, the plate body 1073a absorbs the heat of the heating plate 1072, and water continuously flows through the water-cooling channel 1073b in the plate body 1073a, taking away the heat of the plate body 1073a, so that the temperature of the plate body 1073a is not easy to increase. The water-cooling channel 1073b provides an efficient and stable cooling mechanism, which helps to quickly reduce the temperature of the plate body 1073a, so that the wafer is at an appropriate baking temperature, which is beneficial to improving the reliability of the wafer. Moreover, the water cooling channel 1073b is located in the longitudinal middle of the plate body 1073a, which can achieve a more uniform cooling effect, ensure the temperature uniformity of the entire plate body 1073a, avoid local thermal stress of the wafer caused by temperature difference, thereby ensuring the quality and consistency of the wafer during the baking process, and also prevent the water cooling channel 1073b from being too close to the heating plate 1072, so that the heat of the heating plate 1072 will not be lost too quickly, which is conducive to allowing the heating plate 1072 to reach a higher temperature and making it easier to control the temperature of the heating plate 1072. In summary, the cooling plate 1073 ensures the uniformity of the wafer temperature rise during the wafer baking process, and through precise temperature control, significantly improves the quality and reliability of the wafer processing process.

[0060] In other embodiments, the temperature component includes: a base, which is fixedly disposed on the lower end cover; a temperature plate, which is disposed on the base and is used to support the second wafer, and the temperature plate is also provided with a water cooling channel and a heating wire, the water cooling channel is used to cool the second wafer during a cooling process; the heating wire is used to heat the second wafer during a heating process.

[0061] In some other embodiments, the temperature component includes: a base, which is fixedly disposed on the lower end cover and is used to support the second wafer, and a water cooling channel, which is disposed in the base and is used to cool the second wafer.

[0062] It should be noted that the water cooling channel 1073b is annular and evenly distributed in the disk body 1073a. The annular and evenly distributed water cooling channel 1073b can stabilize the overall temperature of the disk body 1073a and prevent local overheating, thereby providing a uniform cooling effect for the heating disk 1072, effectively managing and dispersing the heat generated by the heating disk 1072, improving the thermal efficiency and temperature control accuracy of the baking process, and reducing the thermal stress of the wafer caused by temperature fluctuations, thereby improving the stability of the wafer during baking and the reliability of the final product.

[0063] As an example, the water inlet and the water outlet of the water cooling pipe are located at the bottom of the disk, and such an arrangement reduces the difficulty of arranging the water path of the water cooling pipe.

[0064] like Figure 7 As shown, the wafer loading and post-processing equipment also includes: a lifting mechanism 113, which is arranged at the bottom of the lower end cover 106, and the lifting mechanism 113 includes an output end, and the lifting mechanism 113 drives the output end to move in a direction close to or away from the lower end cover 106; a connecting block 114, which is connected to the output end; a plurality of circumferentially distributed bellows 115, which are arranged on the top of the connecting block 114; an ejector pin 116, which is connected to the top of the bellows 115, and the ejector pin 116 is slidably arranged in the cooling plate 1073 and the heating plate 1072, and the ejector pin 116 can protrude from the top surface of the heating plate 1072.

[0065] Before placing the second wafer into the second chamber 105, the output end of the lifting mechanism 113 moves in a direction close to the cavity 100, so that the connecting block 114 and the bellows 115 move in a direction close to the cavity 100, and then the ejector pin 116 connected to the bellows 115 penetrates the cooling plate 1073 and the heating plate 1072, and protrudes from the top surface of the heating plate 1072, so that the ejector pin 116 can receive the processed wafer sent from the second opening 109; then the output end of the lifting mechanism 113 moves in a direction away from the cavity 100, so that the ejector pin 116 is lower than the surface of the heating plate 1072, so that the processed wafer falls on the heating plate 1072, and prepares for wafer baking; after the wafer baking is completed, the output end of the lifting mechanism 113 moves in a direction close to the cavity 100, so that the ejector pin 116 lifts the wafer from the surface of the heating plate 1072, so that the wafer can be taken away from the heater.

[0066] In this embodiment, the bellows 115 and the ejector pin 116 are fixed by welding, and the bellows 115 and the connecting block 114 are fixed by bolts. It should be noted that the fixing method of the bellows 115 and the ejector pin 116 is not limited to welding, but can also be other fixing methods, and the fixing method of the bellows 115 and the connecting block 114 is not limited to bolt fixing, but can also be other fixing methods.

[0067] It should also be noted that the function of the bellows 115 is to maintain good sealing performance during the expansion and contraction process. When the lifting mechanism 113 drives the output end to move, the bellows 115 will expand and contract accordingly. Since the bellows has good flexibility and elasticity, it can maintain a sealed connection with the connecting block 114 and the ejector pin 116 during the movement, preventing the gas in the cavity 100 from leaking or external contaminants from entering the cavity.

[0068] As an example, the lifting mechanism 113 is a cylinder. In other embodiments, the lifting mechanism can also be a hydraulic cylinder, or a spiral lifting platform, etc.

[0069] In this embodiment, the upper end cover 103 is provided with a through process slot 117 (such as Figure 2 The process slot 117 is used to adjust the positioning block 110 in the first chamber 104 to ensure the positioning accuracy of the positioning block 110.

[0070] When the position of the positioning block 110 in the first chamber 104 deviates, the operator does not need to remove the upper end cover 103, but can directly remove the window and adjust the position of the positioning block 110 in the first chamber 104 through the process slot 117, which is easy and convenient to operate.

[0071] Specifically, there are two process through grooves 117, and the two process through grooves 117 are dispersedly arranged at positions corresponding to the positioning blocks 110 in the upper end cover 103. As an example, the two grooves are arranged in an "eight-shaped" shape.

[0072] In this embodiment, the transmission chamber 11 is a pentagon (such as Figure 1 As shown), it has five side walls; the wafer loading and post-processing equipment 10 is connected to a side wall of the transfer chamber 11; there are four process chambers 12, which are respectively connected to the remaining four side walls of the wafer loading and post-processing equipment 10.

[0073] In other embodiments, the transfer chamber can also be a hexagon with six side walls, and the process chamber has five side walls, which are respectively connected to the remaining five side walls of the wafer loading and post-processing equipment; or the transfer chamber can also be a heptagon with seven side walls, and the process chamber has six side walls, which are respectively connected to the remaining six side walls of the wafer loading and post-processing equipment.

[0074] In this embodiment, the wafer processing system also includes: a conveying module (not shown in the figure), located between the wafer loading and post-processing equipment 10 and the front-end control module 13, used to transport the first wafer from the front-end control module 13 to the wafer loading and post-processing equipment 10, and used to convey the second wafer from the wafer loading and post-processing equipment 10 to the front-end control module 13.

[0075] The transfer chamber 11 is used for wafer transfer. From the perspective of the wafer transfer path, the transfer chamber 11 is located between the wafer loading and post-processing equipment 10 and the process chamber 12. Specifically, the transfer chamber 11 provides a transfer channel between the wafer loading and post-processing equipment 10 and each process chamber 12. Moreover, the transfer chamber 11 needs to have good sealing and negative pressure resistance structure to provide an operating space under negative pressure for the transfer device.

[0076] In this embodiment, the conveying device 11 in the transmission chamber has the function of rising and falling in the direction of the center of gravity and rotating in the horizontal plane.

[0077] In this embodiment, the conveying device is a robot arm. Specifically, the conveying device includes two robot arms. When working, the two robot arms can simultaneously perform the operation of taking or placing the wafer, and this parallel working mode can significantly improve efficiency. In other embodiments, the conveying device includes one robot arm, which has the advantages of simple structure and easy maintenance.

[0078] The process chamber 12 is used to perform etching or coating on the first wafer.

[0079] Although the utility model is disclosed as above, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the utility model shall be subject to the scope defined by the claims.

Claims

1. A wafer processing system, characterized in that: include: Wafer loading and post-processing equipment, switching between a negative pressure state and an atmospheric pressure state, for loading a first wafer, and also for loading a second wafer and post-processing the second wafer, the first wafer is a wafer to be processed, and the second wafer is a wafer that has been processed; a transfer chamber, connected to the wafer loading and post-processing equipment under negative pressure, for transferring the first wafer under negative pressure; A process chamber, connected to the transfer chamber, for performing a process on the first wafer to form a second wafer; The transfer chamber is provided with: a conveying device for conveying the first wafer in the wafer loading and post-processing equipment to the process chamber so that the first wafer is processed in the process chamber, and also for conveying the second wafer to the wafer loading and post-processing equipment for post-processing.

2. The wafer processing system according to claim 1, wherein: The wafer loading and post-processing equipment includes: A cavity, the cavity having an upper end surface and a lower end surface, the upper end surface is provided with a first groove, and the lower end surface is provided with a second groove; An upper end cover, disposed on the upper end surface, enclosing the first groove into a first chamber, wherein the first chamber is used for loading the first wafer; A lower end cover, disposed on the lower end surface, enclosing the second groove into a second chamber, wherein the second chamber is used for loading the second wafer; A temperature component is arranged on a side of the lower end cover facing the second groove, and the temperature component is used to carry the second wafer and perform post-processing.

3. The wafer processing system according to claim 2, characterized in that: The temperature component includes: A base, the base being fixedly disposed on the lower end cover; A heating plate, disposed on the base, for carrying the second wafer and performing a baking process on the second wafer; A cooling plate is located between the base and the heating plate, and the cooling plate is in contact with the heating plate, and the cooling plate performs cooling treatment on the second wafer.

4. The wafer processing system according to claim 3, characterized in that: The refrigeration plate comprises: The disk body has a longitudinal direction perpendicular to the surface of the disk body; A water cooling channel is arranged in the disk body, and the water cooling channel is located in the middle of the disk body along the longitudinal direction.

5. The wafer processing system according to claim 4, characterized in that: The water cooling channel is annular and evenly distributed in the disk body.

6. The wafer processing system according to claim 2, wherein: The temperature component includes: A base, the base is fixedly arranged on the lower end cover; a temperature plate is arranged on the base and used to carry the second wafer, the temperature plate is provided with a water cooling channel and a heating wire, the water cooling channel is used to cool the second wafer; the heating wire is used to bake the second wafer; Alternatively, the temperature component includes: a base, which is fixedly disposed on the lower end cover and is used to support the second wafer; and a water cooling channel, which is disposed in the base and is used to cool the second wafer.

7. The wafer processing system according to claim 3, characterized in that: The wafer loading and post-processing equipment also includes: A lifting mechanism is arranged at the bottom of the lower end cover, the lifting mechanism comprises an output end, and the lifting mechanism drives the output end to move in a direction close to or away from the lower end cover; A connection block connected to the output terminal; A plurality of circumferentially distributed bellows are arranged on the top of the connection block; An ejector pin is connected to the top of the corrugated tube, and the ejector pin is slidably arranged in the cooling plate and the heating plate, and the ejector pin can protrude from the top surface of the heating plate.

8. The wafer processing system according to claim 2, wherein: The upper end cover is provided with a through process slot and a window detachably connected to the process slot.

9. The wafer processing system according to claim 2, wherein: A first air extraction hole and a second air extraction hole are provided on the side wall of the cavity, wherein the first air extraction hole is communicated with the first chamber, and the second air extraction hole is communicated with the second chamber.

10. The wafer processing system according to claim 2, wherein: One or more first openings communicating with the first chamber are provided on the side wall of the chamber, and the first openings are used for transferring the first wafer from the first chamber to the process chamber; One or more second openings communicating with the second chamber are arranged on the side wall of the cavity, and the second openings are used for transferring the second wafer into the second chamber.

11. The wafer processing system according to claim 2, wherein: The first chamber includes one or more first accommodating chambers; The second chamber includes one or more second accommodating cavities.

12. The wafer processing system according to claim 1, wherein: The transmission chamber is a pentagon with five side walls; The wafer loading and post-processing equipment is connected to a side wall of the transfer chamber.

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