Heat insulation structure and notebook computer

Abstract

The utility model provides a heat insulation structure and a notebook computer. The heat insulation structure comprises a heating main body; a thermally conductive body; and the first heat insulation piece is arranged between the heating main body and the heat conduction main body and is used for generating a gap for heat insulation between the heating main body and the heat conduction main body. The heat conduction main body and the heating main body are separated through the second heat insulation part and the first heat insulation part, transfer of heat generated by the heating main body to the heat conduction main body is avoided or improved, and therefore the heat insulation effect between the heat conduction main body and the heating main body is enhanced.

Description

Technical Field

[0001] This application belongs to the field of thermal insulation technology, and more specifically, relates to a thermal insulation structure and a laptop computer. Background Technology

[0002] To enhance heat dissipation, the top cover of a laptop is typically made of metal. The motherboard and the top cover are very close together; when the motherboard is hot, heat is transferred to the top cover via screws and metal studs, causing the area containing the heat-conducting components of the top cover to overheat. Utility Model Content

[0003] The purpose of this application is to provide a heat insulation structure and a laptop computer to enhance the heat insulation effect between the heat-conducting body and the heat-generating body.

[0004] In a first aspect, embodiments of this application provide a thermal insulation structure, including:

[0005] The main body that generates heat;

[0006] Heat-conducting body;

[0007] And a first heat insulation element, disposed between the heating element and the heat-conducting element, for creating a gap for heat insulation between the heating element and the heat-conducting element.

[0008] Furthermore, the thermal insulation structure also includes:

[0009] Second thermal insulation component;

[0010] And fastening components for securing the heating element between the first heat insulation element and the second heat insulation element.

[0011] Furthermore, the fastening assembly includes a screw; the second heat insulation member has a first connecting hole; the first heat insulation member has an internal threaded hole; the stud of the screw passes through the first connecting hole and is threadedly connected to the internal threaded hole; when the stud is screwed into the internal threaded hole, the nut of the screw presses against the second heat insulation member, so that the second heat insulation member presses the heating element against the surface of the first heat insulation member.

[0012] Furthermore, the heating element is provided with a second connecting hole; the stud passes through the first connecting hole and the second connecting hole in sequence and is then screwed into the internal threaded hole; there is a first gap between the stud and the second connecting hole to insulate the stud from the heating element.

[0013] Furthermore, the second heat insulation component is a heat insulation gasket; the first heat insulation component is a hollow heat insulation column; the heat-conducting body is provided with a placement hole for placing the hollow heat insulation column; and there is a second gap between the heating body and the heat-conducting body.

[0014] When the stud is screwed into the internal threaded hole, the nut of the screw presses against the heat insulation washer, causing the heat insulation washer to press the heating element toward the end of the hollow heat insulation column that extends out of the placement hole.

[0015] Furthermore, the heat insulation gasket and the hollow heat insulation column are made of plastic or aerogel.

[0016] Secondly, embodiments of this application provide a laptop computer including the aforementioned heat insulation structure.

[0017] Furthermore, the heat-generating body is the motherboard of the laptop computer; the heat-conducting body is the top cover of the laptop computer.

[0018] Furthermore, the second connection hole is located on the edge of the motherboard, and the second connection hole has a side opening.

[0019] Furthermore, the top cover of the laptop is made of metal.

[0020] The heat insulation structure and laptop computer of this application embodiment separate the heat-conducting body from the heat-generating body through the second heat insulation component and the first heat insulation component, thereby improving the heat transfer of the heat generated by the heat-generating body to the heat-conducting body and enhancing the heat insulation effect between the heat-conducting body and the heat-generating body. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the thermal insulation structure according to an embodiment of this application.

[0023] Figure 2 This is an exploded structural diagram of the heat insulation structure of the laptop computer's main unit cover according to an embodiment of this application.

[0024] Figure 3 for Figure 2 A magnified schematic diagram of part A in the diagram.

[0025] The following are the labeling elements in the figure:

[0026] 1-Heating element, 2-Heat-conducting element, 3-First heat insulation component, 4-Second heat insulation component, 5-Nut, 6-Stud, 7-Internal threaded hole, 8-First gap, 9-Second gap, 10-Main unit top cover screw post, 11-Plastic sleeve, 12-Main board, 13-Heat insulation pad, 14-Screw, 15-Main unit top cover. Detailed Implementation

[0027] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0028] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0029] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0031] A laptop computer is a lightweight and portable computer device, which mainly consists of two parts: external structure and internal structure.

[0032] A laptop's external structure includes the casing, display, and keyboard. The casing is the most important part of a laptop's structure; besides being aesthetically pleasing, it also plays a more crucial role in protecting the internal components compared to desktop computers. Currently popular casing materials include engineering plastics, magnesium-aluminum alloys, and carbon fiber composites (carbon fiber composite plastics). Among these, carbon fiber composite casings combine the low density and high ductility of engineering plastics with the rigidity and shielding properties of magnesium-aluminum alloys, making them a superior casing material.

[0033] To enhance heat dissipation, some laptop casings are often made of thermally conductive materials such as metal.

[0034] The internal structure of a laptop includes components such as CPU (Central Processing Unit), RAM, hard drive / solid-state drive, graphics card, sound card, motherboard, cooling system, and battery.

[0035] CPU (Central Processing Unit): This is the core component of a laptop, controlling the overall efficiency and speed of the computer. Common CPU brands include Intel and AMD, and common models include Intel's i3, i5, i7, and i9.

[0036] RAM (Memory): This refers to the space in a computer that temporarily stores data. Common RAM capacities include 2GB, 4GB, 8GB, 16GB, and 32GB. The larger the RAM capacity, the faster the computer runs.

[0037] Hard disk drives (HDDs) / Solid State Drives (SSDs): These are the spaces on a computer that permanently store data and programs. Common HDD capacities include 250GB, 500GB, 1TB, and 2TB, while SSD capacities are relatively smaller, typically 128GB, 256GB, and 512GB. Currently, SSDs are becoming increasingly common in laptops to address data transfer bottlenecks.

[0038] Graphics card: Also known as a graphics accelerator card, it's a component in a laptop used for processing graphics and video. Common graphics card brands include NVIDIA and AMD, and common models include GTX and RTX. Graphics cards are categorized as integrated graphics, discrete graphics, and integrated graphics, allowing users to choose according to their needs.

[0039] Sound card: Used to process audio signals on a laptop, enabling the laptop to play and record sound. Currently, most laptops use 16-bit sound cards, although 32-bit cards are also available, but the difference in sound quality is generally imperceptible to the average user.

[0040] Motherboard: It is the carrier of various hardware devices inside a laptop and is responsible for connecting and coordinating the operation of these hardware devices.

[0041] Cooling system: Composed of heat-conducting and heat-dissipating devices, it dissipates heat generated inside the laptop to ensure normal operation. Cooling devices typically include heat sinks and fans; some models also use liquid cooling systems.

[0042] Battery: This is the power supply device in a laptop, meeting the user's needs for use anytime, anywhere. Currently, lithium batteries are the mainstream product type, featuring high voltage, low weight, high energy, and no memory effect.

[0043] The motherboard is one of the main components for heat dissipation in laptops. When the laptop is closed, the screen is close to the top cover, so the local temperature of the top cover affects the local temperature of the corresponding area of ​​the screen. In laptops with metal casings, because the motherboard and top cover are so close, when the motherboard is hot, heat from the motherboard is transferred to the top cover through screws and metal studs, causing the area of ​​the top cover with these heat-conducting components to be hotter. This, in turn, affects the laptop's performance.

[0044] To enhance the heat insulation effect between the host cover and the motherboard and prevent the motherboard temperature from affecting the local temperature of the host cover, this application provides a heat insulation structure, including: a heat-generating body 1, a heat-conducting body 2 and a first heat insulation component 3; the first heat insulation component 3 is disposed between the heat-generating body 1 and the heat-conducting body 2, and is used to create a gap for heat insulation between the heat-generating body and the heat-conducting body.

[0045] The heating element 1 can be a motherboard or other heat-generating component; the heat-conducting element can be a metal casing or other heat-conducting component; by creating a gap for heat insulation between the heating element 1 and the heat-conducting element 1, the heat conduction between the heating element 1 and the heat-conducting element 1 is avoided or reduced or eliminated.

[0046] Furthermore, the heat insulation structure also includes a second heat insulation element and a fastening assembly; the fastening assembly is used to fix the heating element between the first heat insulation element and the second heat insulation element.

[0047] It is understandable that there are multiple ways to implement the heat insulation fastening assembly. Various components made of heat insulation material can be used to fix part or all of the heat-generating main component between the first heat insulation component and the second heat insulation component.

[0048] To enhance the insulation effect between the heat-conducting body and the heat-generating body, please refer to... Figure 1 As shown, this application provides a heat insulation structure, including: a first heat insulation component 3, a second heat insulation component 4, a heating body 1, and a heat-conducting body 2; the heating body 1 is disposed between the first heat insulation component 3 and the second heat insulation component 4; the heat-conducting body 2 is separated from the heating body 1 by the first heat insulation component 3, and a gap for heat insulation is formed between the heating body 1 and the heat-conducting body 2.

[0049] Optionally, the second heat insulation element and the first heat insulation element are made of heat insulation material. Optionally, the heat insulation material can be plastic, aerogel, or other heat insulation materials.

[0050] See Figure 1 As shown, the second heat insulation element 4 presses the heating body 1 tightly onto the upper surface of the first heat insulation element 3, and the heat-conducting body 2 is separated from the second heat insulation element 4 through the heating body 1.

[0051] Therefore, the heat insulation structure of this application embodiment separates the heat-conducting body from the heat-generating body through the second heat insulation member and the first heat insulation member, thereby improving the heat transfer of the heat generated by the heat-generating body to the heat-conducting body and enhancing the heat insulation effect between the heat-conducting body and the heat-generating body.

[0052] To facilitate the fixing of the heat-conducting body and the heat-generating body, the heat insulation structure also includes a fastening assembly; the fastening assembly is used to fix the heat-generating body between the second heat insulation component and the first heat insulation component.

[0053] Optionally, the fastening assembly can be a snap-fit ​​connection assembly, a riveting assembly, etc. To facilitate fastening installation, the fastening assembly may optionally include a screw; the second heat insulation member 4 is provided with a first connecting hole; the first heat insulation member has an internal threaded hole 7; the stud of the screw passes through the first connecting hole and is threaded into the internal threaded hole; when the stud 6 is screwed into the internal threaded hole, the nut 5 of the screw presses against the second heat insulation member, so that the second heat insulation member 4 presses the heating body 1 against the surface of the first heat insulation member 3.

[0054] See Figure 1 As shown, when the screw nut 5 rotates downward into the internal threaded hole 7, the lower surface of the nut 5 presses against the upper surface of the second heat insulation 4, giving the second heat insulation 4 downward pressure, thereby causing the heating body 1 to move downward. The lower surface of the heating body 1 presses against the upper surface of the upper end of the first heat insulation 3, thereby achieving stable fastening of the heating body.

[0055] To prevent the heating element from shifting during use, the heating element is provided with a second connecting hole; the stud passes through the first connecting hole and the second connecting hole in sequence and is then screwed into the internal threaded hole; to prevent the stud 6 from transferring the heat of the heating element 1 to the heat-conducting element 2, there is a first gap 8 between the stud 6 and the second connecting hole, so as to insulate the stud from the heating element.

[0056] See Figure 1 As shown, there is a first gap 8 between the right side of the stud 6 and the left end of the heating body 1. The first gap 8 can effectively prevent the heating body 1 from transferring heat to the internal threaded hole through the stud 6, thereby avoiding overheating in the area near the internal threaded hole.

[0057] In some embodiments, the second heat insulation element can be other hollow sheet-like structures, such as a hollow polygonal structure. The first heat insulation element can be a hollow structure with a certain height and openings at the top and bottom, such as a hollow polygonal column structure. Optionally, the second heat insulation element is a heat insulation gasket; the first heat insulation element is a hollow heat insulation column.

[0058] To facilitate the placement of the hollow heat insulation column, the heat-conducting body 4 is provided with a placement hole for placing the hollow heat insulation column; to prevent the heat of the heating body 1 from being transferred to the heat-conducting body 2, the heating body 1 and the heat-conducting body 2 do not come into contact with each other, and there is a second gap 9 between the heating body and the heat-conducting body.

[0059] Specifically, the depth of the placement hole is less than the height of the hollow insulation column, so that when the hollow insulation column is placed in the placement hole, the upper end of the hollow insulation column can extend out of the placement hole, and the upper end of the hollow insulation column can abut against the lower surface of the heating element, thereby avoiding direct contact between the heating element 1 and the heat-conducting element 2, thus enhancing the heat insulation effect.

[0060] Specifically, the height of the hollow insulation column can be less than the depth of the placement hole. Correspondingly, a snap-fit ​​structure is provided at the lower end of the hollow insulation column. This snap-fit ​​structure is used to snap the column into the placement hole so that the upper end of the hollow insulation column extends out from the upper end of the placement hole.

[0061] Specifically, the height of the hollow insulation column can be less than the depth of the placement hole. Correspondingly, the lower end of the hollow insulation column is connected to the placement hole in a tight fit manner. The upper end of the hollow insulation column can be inserted into the placement hole using this snap-fit ​​structure so that the upper end of the hollow insulation column extends out from the upper end of the placement hole.

[0062] When the stud is screwed into the internal threaded hole, the nut of the screw presses against the heat insulation washer, causing the heat insulation washer to press the heating element toward the end of the hollow heat insulation column that extends out of the placement hole.

[0063] Optionally, the heat insulation gasket and the hollow heat insulation column are made of plastic or aerogel.

[0064] Secondly, see Figure 2 and 3 As shown in the figure, this application provides a laptop computer including the aforementioned heat insulation structure.

[0065] The functions and effects of the technical features in this technical solution that are similar to or related to the aforementioned technical solution are similar to those in the aforementioned technical solution, and the inventive concept and beneficial effects of this technical solution are similar to those in the aforementioned technical solution, so they will not be repeated here.

[0066] Considering that heat from the laptop motherboard is transferred to the top cover via screws and studs, causing hot spots and high temperatures on the top cover surface, this application employs a design that uses a material with low thermal conductivity to separate the screws and studs from the motherboard, avoiding direct contact between them and achieving a heat insulation effect.

[0067] Furthermore, the heat-generating body is the motherboard of the laptop computer; the heat-conducting body is the laptop computer's main unit cover 15. Optionally, the laptop computer's main unit cover is made of metal.

[0068] A material with low thermal conductivity is used, which can be plastic but is not limited to plastic. The screws are separated from the motherboard from both the top and bottom sides, thereby preventing heat from being conducted to the top cover of the host through the screws.

[0069] Specifically, in the heat insulation structure of the laptop computer, the heat-generating body 1 is the motherboard 12, the heat-conducting body is the main unit cover 15, the fastening components include screws 14 and main unit cover screw posts 10 located on the main unit cover 15, the hollow heat insulation column is a plastic sleeve 11, and the second heat insulation component is a heat insulation pad 13. For easy and convenient fixing, please refer to... Figure 3 As shown, the second connection hole is located on the edge of the motherboard, and the second connection hole has a side opening.

[0070] See Figure 3 As shown, screw 14, heat insulation pad 13 and plastic sleeve 11 are assembled together by clamping the heat insulation pad 13 onto screw 14. The plastic sleeve 11 is assembled into the placement hole of the main unit cover screw post 10 by a tight fit. The height of the plastic sleeve 2 is higher than the main unit cover screw post 10, so that the upper end of the plastic sleeve 2 abuts against the lower end of the motherboard 12.

[0071] In this way, the motherboard 12 cannot directly contact the screws 14 and the screw posts 10 of the host cover. In addition, the plastic sleeve 11 and the heat insulation pad 13 separate them, which increases the thermal resistance and reduces the heat conduction, avoids the generation of hot spots on the surface of the host cover 1, and reduces the surface temperature of the host cover 10.

[0072] Therefore, in this embodiment, by using a material with low thermal conductivity to separate the screws from the motherboard, a heat insulation pad 13 is placed between the motherboard and the screws, and a plastic sleeve 11 is placed under the motherboard, heat is prevented from being directly transferred to the motherboard cover 15 through the screws 14 and the screw posts 10 of the motherboard cover, thus reducing the surface temperature of the motherboard cover 15. This results in good heat insulation between the motherboard cover 15 and the motherboard 12.

[0073] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heat insulation structure, characterized in that, include: The main body that generates heat; Heat-conducting body; And a first heat insulation element, disposed between the heating body and the heat-conducting body, for creating a gap for heat insulation between the heating body and the heat-conducting body; The thermal insulation structure also includes: Second thermal insulation component; The fastening assembly includes a screw; the second heat insulation member has a first connecting hole; the first heat insulation member has an internal threaded hole; the stud of the screw passes through the first connecting hole and is threaded into the internal threaded hole; when the stud is screwed into the internal threaded hole, the nut of the screw presses against the second heat insulation member, so that the second heat insulation member presses the heating body against the surface of the first heat insulation member.

2. The heat insulation structure according to claim 1, characterized in that, The heating element is provided with a second connecting hole; the stud passes through the first connecting hole and the second connecting hole in sequence and is screwed into the internal threaded hole; there is a first gap between the stud and the second connecting hole to insulate the stud from the heating element.

3. The heat insulation structure according to claim 2, characterized in that, The second heat insulation component is a heat insulation gasket; the first heat insulation component is a hollow heat insulation column; the heat-conducting body is provided with a placement hole for placing the hollow heat insulation column; there is a second gap between the heating body and the heat-conducting body; When the stud is screwed into the internal threaded hole, the nut of the screw presses against the heat insulation washer, causing the heat insulation washer to press the heating element toward the end of the hollow heat insulation column that extends out of the placement hole.

4. The heat insulation structure according to claim 3, characterized in that, The heat insulation gasket and hollow heat insulation column are made of plastic or aerogel.

5. A laptop computer, characterized in that, include: The thermal insulation structure according to any one of claims 2-4.

6. The laptop computer according to claim 5, characterized in that, The heat-generating element is the motherboard of the laptop computer; the heat-conducting element is the top cover of the laptop computer.

7. The laptop computer according to claim 6, characterized in that, The second connection hole is located on the edge of the motherboard, and the second connection hole has a side opening.

8. The laptop computer according to any one of claims 6-7, characterized in that, The laptop's main unit cover is made of metal.

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