1results about How to "Uniform position" patented technology

This invention belongs to the field of grinding disc manufacturing technology, specifically relating to a diamond positioning and implanted grinding disc and its manufacturing method. The grinding disc substrate undergoes a series of processes including degreasing and activation treatments, followed by basic nickel plating to form a base nickel plating layer. Then, using photolithography, a photosensitive dry film pattern with pre-drilled micro-holes is created on the surface of the nickel plating layer. Adhesive is then applied to fill the micro-holes, and diamond abrasive grains are implanted, ensuring the sharp corners remain upwards for initial fixation. Finally, the photosensitive dry film is removed, and a thicker nickel plating reinforcement treatment is performed, ensuring the diamond abrasive grains are firmly encapsulated by the nickel plating layer. This method utilizes photolithography to achieve precise positioning and uniform distribution of the diamond abrasive grains on the substrate surface, and through process control, maintains the abrasive grains in a favorable cutting posture with their sharp corners upwards, significantly enhancing the grain holding strength and effectively preventing loosening, collapse, or detachment. The resulting grinding disc exhibits superior cutting efficiency and stability.