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Heating panel with anti-EMI function

A heat dissipation plate and functional technology, applied in the field of heat dissipation plate with anti-EMI function, can solve the problems of inconvenient production and assembly, high cost, etc., and achieve the effects of reducing EMI, enhancing anti-EMI, and increasing heat dissipation area

Inactive Publication Date: 2008-11-26
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the addition of an external support structure, the above-mentioned technology uses additional materials, which increases the cost and makes it inconvenient to manufacture and assemble.

Method used

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  • Heating panel with anti-EMI function
  • Heating panel with anti-EMI function
  • Heating panel with anti-EMI function

Examples

Experimental program
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Effect test

Embodiment Construction

[0018] see Figure 2 to Figure 4 , the heat sink 10 with anti-EMI function of the present invention is mounted on an electronic device housing 100 .

[0019] The heat dissipation plate 10 defines a plurality of rectangular first heat dissipation holes 12 and a plurality of rectangular second heat dissipation holes 14 . A group of opposite sides of the first heat dissipation hole 12 respectively extend a flap 120 vertically outward, and a group of opposite sides of the second heat dissipation hole 14 adjacent to the first heat dissipation hole 12 respectively extend vertically outward. 140 pieces. The first heat dissipation holes 12 and the second heat dissipation holes 14 are alternately distributed and arranged regularly to form a heat dissipation hole array, and the folded pieces 120 and the folded pieces 140 are perpendicular to each other, so that the first heat dissipation holes distributed in the array Four edges of the first cooling hole 12 and the second cooling hole...

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Abstract

It is a heat radiation plate with anti-EMI function, which is located lot of heat radiation holes locating orderly into heat radiation array. Each heat radiation hole edge stretches into one side of the heat radiation to form a projection structure. The projection structure is a vertical stretching plate of one-group edges of the heat radiation holes and the each folded plate of each heat radiation hole is vertical to the near heat radiation hole. The heat radiation plate punching outside into a prismatic stage structure or a pipe structure can form the heat radiation hole projection. Through the above steps, the said heat radiation plate can realize both the heat radiation function and the lower EMI function.

Description

【Technical field】 [0001] The invention relates to a cooling plate, especially a cooling plate with anti-EMI function. 【Background technique】 [0002] Electronic equipment generates electromagnetic radiation during operation, which may reduce the performance of the overall system, or may have adverse effects on external organisms or substances. The above phenomenon is called EMI (Electro Magnetic Interference: Electromagnetic Interference) phenomenon. The general way to prevent EMI is to add appropriate shielding body outside the electronic equipment. Specifically, in the field of computer applications, the airtight structure of the computer case has the effect of preventing EMI. [0003] With the continuous improvement of computer performance, its internal CPU frequency increases, causing the computer to emit a lot of heat and electromagnetic waves when it is working, affecting the overall performance of the computer. Such as figure 1 As shown, in order to assist heat diss...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20H05K9/00
Inventor 林有旭叶尚苍李伟李晓伟
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD