Encapsulating technique for electronic components

A technology of electronic components and process, which is applied in the field of potting and sealing technology of electronic components, can solve the problems such as the difficulty of cleaning the release agent, and achieve the effects of convenient demoulding, easy preparation and safe operation

Active Publication Date: 2011-09-14
中国航空工业第一集团公司第六三一研究所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a potting process of electronic components, which solves the technical problem of difficult cleaning of the release agent in the potting process in the background art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] A potting process for electronic components, the potting process comprises the following steps:

[0025] 1) preparing the hydrolyzed protein rubber powder with deionized water at a temperature of 30-40° C. to prepare an aqueous solution of hydrolyzed protein rubber powder with a mass percentage of 25%, 30% or 35%;

[0026] 2) Brush the above-mentioned hydrolyzed protein rubber powder aqueous solution on the inner surface of the mold component, or completely immerse the mold component in the solution and take it out; then dry it at room temperature or let it stand for 30-60 minutes at a temperature of 50-60°C , until dry;

[0027] 3) mold the mold components; when loading the mold, coat the above-mentioned hydrolyzed protein rubber powder aqueous solution on the bonding surface of each mold component, and bond the mold components, and then use the above-mentioned hydrolyzed protein rubber powder aqueous solution to seal the gap on the mold ; Then let it stand for 60-120...

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Abstract

An encapsulating technique for electronic components comprises the steps of preparing aqueous protein hydrolysate adhesive powder solution, coating a mold, filling the mold, injecting sealing compound and curing, de-molding the mold and cleaning. With water-soluble protein adhesive adopted as de-molding agent, the technique is environment-friendly and causes no pollution; a split mold is adopted,each component of the mold is adhered by the aqueous protein hydrolysate adhesive powder solution, and de-molding is easy due to lower adhesive strength; de-molding can also be carried out by soakingin water; or special de-molding bolts are designed on the mold, which are screwed during de-molding disassemble the mold components, the assembly and disassembly are easy, and repeated utilization rate is high. The technique is suitable for encapsulating various electronic components.

Description

technical field [0001] The invention relates to a potting process, in particular to a potting process for electronic components. Background technique [0002] Potting and encapsulation are indispensable for electronic components in electronic products, including inductance coils, cable connectors, power modules, etc. In order to facilitate the demoulding of castings, a mold release agent is applied to the surface of the mold before pouring. Since the mold release agent currently used in the mold is usually a silane or paraffin type mold release agent, it is widely used, easy to use, and has a good mold release effect. The disadvantage is that it will pollute the surface potting parts and affect the surface paint. This kind of pollution requires the product to be cleaned after potting, but there will still be mold release agent residue after cleaning, which will affect the bonding strength or paint adhesion quality of the product in the later stage. In addition, currently us...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H05K7/02C09J189/00B29C33/58B29C33/60B29C33/30B29K75/00B29K83/00B29K63/00
Inventor石红曲亮孙越
Owner中国航空工业第一集团公司第六三一研究所