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Circuit board structure and manufacturing method thereof

A manufacturing method and circuit board technology, applied in the directions of printed circuit manufacturing, printed circuits, printed circuit components, etc.

Active Publication Date: 2013-05-15
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the sound transmission kit will increase the overall volume of the mobile phone and the cost of the mobile phone, and the sound transmission path is long, so that the energy and clarity of the operator's call voice received by the sound collection element are poor

Method used

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  • Circuit board structure and manufacturing method thereof
  • Circuit board structure and manufacturing method thereof
  • Circuit board structure and manufacturing method thereof

Examples

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Embodiment Construction

[0056] figure 1 A cross-sectional view of a circuit board structure according to an embodiment of the present invention is shown. Figure 2 to Figure 5 draw figure 1 Cross-sectional views of four variations of the circuit board structure.

[0057] Please refer to figure 1 , the circuit board structure 100 of this embodiment includes a circuit board main body 110 and an electro-acoustic transducer 120 . The circuit board main body 110 has a groove 112, the groove 112 has a bottom 112a, and the bottom 112a has a sound transmission through hole 112b. The electro-acoustic transducer 120 is disposed on the bottom 112 a of the groove 112 and can be electrically connected to the circuit board main body 110 through two wires 130 , wherein the electro-acoustic transducer 120 and the circuit board main body 110 are connected by the wires 130 . In this embodiment, the electroacoustic transducer 120 is disposed on the sound transmission hole 112b, and the transducing surface 122 of...

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Abstract

The invention discloses a circuit board structure and a manufacturing method thereof. The circuit board structure comprises a circuit board main body, wherein the circuit board main body is provided with a groove; the groove is provided with a bottom; and the bottom is provided with a sound conducting through hole. According to the circuit board structure, a sound sent out from electroacoustic transducer arranged at the bottom of the groove can directly penetrate through the circuit board main body through the sound conducting through hole.

Description

technical field [0001] The invention relates to a circuit board structure and a manufacturing method thereof, and in particular to a circuit board structure including a circuit board main body with a sound transmission through hole and a manufacturing method thereof. Background technique [0002] Along with the development of mobile communication technology, various mobile communication devices are gradually popularized in daily life, and among them, almost everyone owns a mobile phone. Moreover, with the advancement of technology, most mobile phones have the function of MP3 (MPEG-1 Audio Layer 3), so consumers can play music through their mobile phones. [0003] The loudspeaker of the known mobile phone is configured on the back side of the circuit board of the mobile phone (the front side is the side where the mobile phone screen is placed, and the back side is the side where electronic components such as batteries are placed). Therefore, the speaker hole of the mobile ph...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/18H04R1/00H05K3/00H05K3/32
Inventor 黄瀚霈张振铨
Owner UNIMICRON TECH CORP
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