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Device for wave welding

A wave soldering and soldering technology, applied in the direction of tin feeding device, auxiliary device, welding equipment, etc., can solve problems such as difficult to control relative speed, measure molten solder, etc.

Inactive Publication Date: 2013-09-11
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high temperature and opacity of molten solder, there is no method to easily measure the flow rate of molten solder, so it is difficult to control this relative velocity in practice

Method used

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  • Device for wave welding
  • Device for wave welding
  • Device for wave welding

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Embodiment Construction

[0021] Features and advantages of the present invention will become apparent from the following drawings and descriptions.

[0022] figure 1 is a cross-sectional view of a wave soldering apparatus according to an embodiment of the present invention.

[0023] A wave soldering device according to an embodiment of the present invention performs a soldering process by making an object 5 (such as a substrate) contact molten solder 2 , and includes a soldering nozzle 10 , a depth measurement unit 50 , and a computing unit 60 .

[0024] The soldering nozzle 10 is used to direct the molten solder 2 to a certain direction so that an object 5 (ie, a substrate) can contact the flowing solder 2 . For this, as figure 1 As shown, the welding nozzle 10 of this embodiment has a solder storage part 11 and an open channel 20, wherein the solder storage part is filled with molten solder 2, the open channel is connected to the solder storage part 11, and a flat bottom is formed on the open chan...

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PUM

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Abstract

The invention discloses a device for wave welding, which comprises a welding nozzle, a deep measurement unit and a calculation unit. The welding nozzle comprises a solder storage part, an open channel and an overflow weir. The deep measurement unit measures the depth of the molten solder in the open channel.The flow velocity of the solder in the open channel is calculated by the calculation unit based on the height of the overflow weir and the depth of the molten solder in the open channel.In addition, the molten solder is stored in the solder storage part.The open channel is connected with the solder storage part and a flat bottom surface is formed in the open channel.The overflow weir is arranged at one end of the open channel.The molten solder overflows out of the overflow weir.

Description

[0001] Related Application Cross Reference [0002] This application claims the benefit of Korean Patent Application No. 10-2009-0131099 filed with the Korean Intellectual Property Office on December 24, 2009, the entire disclosure of which is hereby incorporated by reference. technical field [0003] The invention relates to a device for wave soldering. Background technique [0004] Wave soldering is a well-known thermal soldering method used to solder electronic components to substrates. Wave soldering is a method in which a substrate is passed through a stream of molten solder and direct contact is made between a component and the molten solder to perform soldering. [0005] In wave soldering, the relative velocity of the substrate and the flow rate of the molten solder greatly affect the number of soldering defects. This is because the relative velocity of the substrate away from the solder wave determines the final shape and size of the solder joint. However, due to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K3/00B23K3/06B23K3/08H05K3/34
CPCH01L24/75H01L2224/759H01L2924/40
Inventor 权容一张修逢金东振
Owner SAMSUNG ELECTRO MECHANICS CO LTD