LED substrate structure and manufacturing method thereof

A technology of a substrate structure and a manufacturing method, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of easy cracking, high cost, insufficient luminous brightness, etc., and achieves low cost, accelerated industrialization process, and improved luminous efficiency. Effect

Active Publication Date: 2017-05-10
HANGZHOU SILAN AZURE
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide an LED substrate structure and its manufacturing method to solve the problems of the existing LEDs, such as insufficient luminous brightness, or easy splitting during the manufacturing process, and high cost.

Method used

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  • LED substrate structure and manufacturing method thereof
  • LED substrate structure and manufacturing method thereof
  • LED substrate structure and manufacturing method thereof

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Embodiment Construction

[0034] The structure of the LED substrate proposed by the present invention and its manufacturing method will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0035] Please refer to figure 1 , which is a schematic flowchart of a method for manufacturing an LED substrate structure according to an embodiment of the present invention. Such as figure 1 As shown, the manufacturing method of the LED substrate structure includes:

[0036] Step S10: providing a substrate;

[0037] Step S11: etching the substrate to form convex structures arranged in a periodic array on the substrate;

[0038] Step ...

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Abstract

The invention discloses an LED (light-emitting diode) substrate structure and a manufacturing method thereof, wherein luminous efficiency, brightness and axial brightness of the LED are simultaneously improved by the way that a convex structure is surrounded with a first reflective body and a second reflective body is formed into a bowl-shaped pattern, and the crystalline quality of the LED isn't reduced; besides the manufacturing method of the LED substrate structure has has the characteristics of simple technology and low cost, thus the method is applied to the large-scale commercialized production, besides the luminous efficiency, brightness and axial brightness of the LED can be more effectively through the LED substrate structure, thereby quickening the industrialization process that the LED enters into the high-end illumination field and ordinary families and satisfying the sustainable development strategy of the LED.

Description

technical field [0001] The invention relates to the technical field of semiconductor optoelectronic chip manufacturing, in particular to an LED substrate structure and a manufacturing method thereof. Background technique [0002] With the improvement of people's living standards, the enhancement of environmental awareness, and the continuous improvement of the pursuit of home environment, leisure and comfort, lamps and lanterns have gradually shifted from simple lighting functions to the coexistence of lighting and decoration. It is inevitable that solid-state cold light source LED will replace traditional light source and enter people's daily life. [0003] Since the commercialization of GaN-based LEDs in the early 1990s, after more than 20 years of development, its structure has become mature and perfect, and it has been able to meet people's current needs for lighting decoration; but it must completely replace traditional light sources and enter the lighting industry. fi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/10H01L33/02H01L33/00
CPCH01L33/0075H01L33/0093H01L33/02H01L33/10
Inventor 马新刚丁海生李芳芳李东昇江忠永
Owner HANGZHOU SILAN AZURE
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