LED chandelier based on lampshade conduction heat dissipation

Abstract

The invention discloses a light-emitting diode (LED) ceiling lamp capable of transferring and dissipating heat based on a lampshade. The LED ceiling lamp comprises a lamp base, a top cover and the lampshade, wherein the lamp base, the top cover and the lampshade are assembled together. An electric control board is installed on the top cover. A plurality of printed circuit boards (PCB) are installed inside the lampshade. A plurality of LEDs are installed on the PCBs. A base pin of each LED is provided with a bent part. The LED ceiling lamp further comprises supporting rings. The PCBs are fixed to the peripheries of the supporting rings. Under the action of the supporting rings and the lampshade, each LED luminous body is made to be attached to the inner surface of the lampshade tightly through the elastic force generated by the bent parts of the LEDs. Heat of the LED luminous bodies is transferred and dissipated through the lampshade. The electric control board is electrically connected with the lamp base and the LEDs. The two supporting rings are installed at the top and the bottom of the PCBs respectively. The space between the top face of each LED luminous body and the inner wall of the lampshade is filled with transparent heat-conducting silicone grease. The lampshade is made of glass. A fixing column is arranged on the top cover. The electric control board is fixed to the fixing column. The LED ceiling lamp capable of transferring and dissipating heat based on the lampshade has the beneficial effects that the structure is simple, the cost is low, the temperature of the LEDs is lowered, and the service life of the LEDs is prolonged.

Description

technical field [0001] The invention relates to an LED chandelier based on the conduction and heat dissipation of the lampshade. Background technique [0002] LED lamps are usually assembled by many LEDs on the same PCB board. In order to improve the brightness and luminous efficiency, the working mode of high brightness and high current is adopted, which leads to an increase in temperature. If the maximum temperature of the LED cannot be effectively controlled, it will directly affect the The service life of the LED reduces the luminous efficiency. [0003] The methods of heat dissipation usually include heat conduction, heat radiation and air convection. Relatively speaking, the cost of air convection is lower, but air is a better thermal insulation material, and the effect of heat dissipation through air is poor. For this reason, the application number is 201010139375.8 The Chinese patent disclosed in China discloses an LED lamp, which includes an LED chip, a heat dissip...

AI Technical Summary

Problems solved by technology

[0002] LED lamps are usually assembled on the same PCB board by many LEDs. In order to improve the brightness and luminous efficiency, the working mode of high brightness and high current is adopted, which causes the temperature to rise. If the maximum temperature of the LED cannot be effectively controlled, it will directly affect the LED life, reduce luminous efficiency

[0003] The way of heat dissipation usually includes heat conduction, heat radiation and air convection. Relatively speaking, the cost of air convection is relatively low, but air is a better heat insulation material, and the heat dissipation effect through air is poor. Therefore, the application number is 201010139375.8 The Chinese patent disclosed an LED lamp. The LED lamp includes an LED chip, a heat dissipation base and a lampshade. The lampshade is fixed on the heat dissipation base, the LED chip is located in the lampshade, and the lampshade is filled with Heat conduction gas, the heat dissipation performance of the LED lamp in this invention has been greatly improved, and it can work better at lower temperatures, but the structure is complex and costly, and it is not easy to maintain

[0004] The effect of heat conduction is better, and the common heat dissipation method is to add heat sinks, etc., but the existing problems are high cost, complex structure, and large volume

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