Device with high-temperature pressing comprehensive function

Abstract

The invention belongs to the technical field of strain testing, in particular to a device with a high-temperature pressing comprehensive function, and aims at solving the problem that the requirement for using high-temperature adhesives to paste and install strain gauges on a large-area thin-wall test piece cannot be met in the prior art. The device comprises a cylindrical magnet, a cam sliding rail, a casing, a rolling pin, a transition shaft sleeve, a rotating handle, an aviation plug, a ball bearing and an electric heating piece, wherein the cam sliding rail is fixedly installed in the casing; the transition shaft sleeve is installed in the casing; an bearing outer ring of the ball bearing is installed in the transition shaft sleeve; the rolling pin is installed on a bearing inner ring of the ball bearing; the cylindrical magnet is installed in a through hole in the center of the transition shaft sleeve; the rotating handle is installed on the upper surface of the transition shaft sleeve; the aviation plug is fixed to the upper surface of the transition shaft sleeve; and the electric heating piece is installed on the lower surface of the cylindrical magnet. According to the device with the high-temperature pressing comprehensive function, closing suction is conducted through the magnetic force, reliability and safety are achieved, the pressing force is stable, the device is not affected by the temperature, the electric heating piece is controlled through a temperature controller, and thus the heating temperature can be precisely controlled.

Description

technical field [0001] The invention belongs to the technical field of strain testing, and in particular relates to a device for providing high-temperature pressing and bonding comprehensive functions. Background technique [0002] The strain measurement on the surface of the material is an indispensable measurement method in the mechanical test process at this stage. The commonly used strain sensor is a resistive strain gauge. The change in the resistance value of the strain gauge caused by the deformation of the strain gauge with the surface of the material under test is generated by circuit processing. Electrical signal, thereby displaying and recording the strain value of the measured material. The strain gauge and the surface of the tested material are reliably bonded with various adhesives. The curing effect and bonding quality of the adhesive directly affect the accuracy of the strain measurement. Most of the commonly used adhesives are quickly cured at room temperatu...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the existing technology cannot meet the use requirements of using high-temperature adhesives to mount strain gauges on large-area thin-walled test pieces, and to provide a device that provides comprehensive functions of high-temperature lamination

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