Drug supply circulation system of pcb electroplating line

A technology of circulation system and electroplating line, applied in circuits, electrolysis components, electrolysis process, etc., can solve the problems of pressure backflow, shorten the service life of pump motor, damage the pump, etc., achieve long service life, strong applicability, avoidance of damage effect

Active Publication Date: 2018-02-06
竞陆电子(昆山)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As we all know, when the board thickness of the PCB board is inconsistent, the required spray flow will inevitably change. For example, when electroplating ultra-thin copper-clad laminates, the required spray flow will be reduced by 50% compared with the conventional board thickness. Above, this means that when electroplating ultra-thin copper clad laminates, the liquid pressure sprayed by the pump motor will be reduced by 50%, which will inevitably lead to pressure backflow and damage the pump, greatly shortening the service life of the pump motor

Method used

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  • Drug supply circulation system of pcb electroplating line

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Embodiment 1

[0021] Please refer to the attached figure 1 As shown, it is a schematic structural view of the PCB electroplating line drug supply circulation system of the present invention. The PCB electroplating line includes a tank body 1 for containing the electroplating solution and accommodating the PCB board to be plated. The medicine supply circulation system is used to spray the electroplating solution onto the PCB board to be plated; the medicine supply circulation system includes a jet pipeline 20 and a pump motor 22, wherein the spray pipeline 20 is positioned in the tank body 1, and the spray pipeline 20 is also connected with a plurality of nozzles 21 communicated with its interior, and each of the The injection directions of the nozzles 21 are respectively directed towards the corresponding PCB board to be plated; the pump motor 22 is positioned outside the tank body 1, and the liquid outlet of the pump motor 22 passes through a delivery pipeline 23 It is communicated with t...

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Abstract

The invention discloses an agent supply circulating system of a PCB electroplating line. The PCB electroplating line comprises a tank body. The agent supply circulating system is used for spraying electroplating liquid onto to-be-plated PCB pieces. The agent supply circulating system comprises a jet-flow pipeline and a pumping motor. The jet-flow pipeline is arranged in the tank body and connected with a plurality of nozzles each communicating with the interior of the jet-flow pipeline. The spraying direction of each nozzle faces the to-be-plated PCB piece corresponding to the nozzle. The pumping motor is arranged outside the tank body. A liquid outlet of the pumping motor communicates with the jet-flow pipeline through a conveying pipeline. A flow valve and a flowmeter are further arranged on the conveying pipeline in sequence in the liquid flowing direction. A pressure relief pipeline is further arranged, one end of the pressure relief pipeline communicates with the flow valve, and the other end of the pressure relief pipeline communicates with the interior of the tank body. The opening size of a valve outlet of the flow valve is controlled, and therefore the pressure relief pipeline achieves division pressure relief, the situation that pumping is damaged due to pressure backflow is effectively avoided, and the service life of the pumping motor is greatly prolonged.

Description

technical field [0001] The invention relates to the technical field of PCB circuit boards, and specifically provides a drug supply circulation system for a PCB electroplating line. Background technique [0002] At present, in the electroplating process of PCB circuit boards, a pump motor is usually used to supply pressure for the normal circulation of the liquid in the electroplating tank, and then the liquid is sprayed out through the nozzle. [0003] As we all know, when the board thickness of the PCB board is inconsistent, the required spray flow will inevitably change. For example, when electroplating ultra-thin copper-clad laminates, the required spray flow will be reduced by 50% compared with the conventional board thickness. Above, this means that when electroplating ultra-thin copper clad laminates, the liquid pressure sprayed by the pump motor will be reduced by 50%, which will inevitably lead to pressure backflow and damage the pump, greatly shortening the service ...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): C25D7/12C25D17/00C25D5/08
CPCC25D5/08C25D7/12C25D17/00
Inventor李泽清
Owner竞陆电子(昆山)有限公司