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Thermoplastic resin composition, molded article, and method for producing molded article

A thermoplastic resin, manufacturing method technology, applied in other household appliances, household components, household appliances, etc., can solve the problems of heat resistance, flame retardancy, dimensional stability, low mechanical strength, etc., and achieve excellent heat resistance and appearance. Good, satisfying performance

Active Publication Date: 2020-08-14
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of polyamide alone, heat resistance, flame retardancy, dimensional stability, mechanical strength, etc. are low, and in order to impart properties in a balanced manner, the technology of alloying with other resins is being studied

Method used

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  • Thermoplastic resin composition, molded article, and method for producing molded article
  • Thermoplastic resin composition, molded article, and method for producing molded article
  • Thermoplastic resin composition, molded article, and method for producing molded article

Examples

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Embodiment

[0229] Hereinafter, although an Example and a comparative example are used and this invention is demonstrated more concretely, this invention is not limited to an Example etc. at all.

[0230] First, the raw materials of the thermoplastic resin compositions used in Examples and Comparative Examples will be described below.

[0231] (A) Polyamide (PA)

[0232] Poly(hexamethylene adipamide) (PA66) (viscosity value = 120mL / g, terminal amino group concentration = 30μmol / g, terminal carboxyl group concentration = 110μmol / g, when PA66 is polymerized, it is polymerized under the coexistence of copper iodide and potassium iodide , containing 100 mass ppm of copper and 4000 mass ppm of iodine in PA66.)

[0233] (B) Polyphenylene ether (PPE)

[0234] Poly(2,6-dimethyl-1,4-phenylene ether) (reduced viscosity=0.42dL / g (0.5g / dL chloroform solution, 30°C, measured by Ubbelohde viscosity tube))

[0235] (C) Compatibilizer

[0236] MAH (trade name "maleic anhydride", manufactured by Mitsu...

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Abstract

The thermoplastic resin composition contains (A) a polyamide, (B) a polyphenylene ether, and (C) a compatibilizer. When the thermoplastic resin composition is molded into a specimen, a continuous phase containing the polyamide (A) and a dispersed phase containing the polyphenylene ether (B) are formed in the specimen, and E-20 represents a mean ellipticity of the dispersed phase in region I extending from a surface of the hinge portion to a depth of 20 microns in the thickness direction, and E-mid represents a mean ellipticity of the dispersed phase in region II extending from a distance, measured along the thickness direction from the surface, equal to 48% of the thickness to a distance, measured along the thickness direction from the surface, equal to 52% of the thickness, the following formula (1) is satisfied: 4.0<=(E-20) / (E-mid) (1).

Description

technical field [0001] The present invention relates to a thermoplastic resin composition, a molded article, and a method for producing the molded article. Background technique [0002] Most resin molded products used in electrical and electronic parts, automobile parts, etc. have a hinged structure. In recent years, the electrification of automobiles has been greatly promoted, and the number of electrical components in automobiles has tended to increase. In particular, the densification of the engine room requires miniaturization of various electrical components, and molded products with hinged structures such as relay boxes and connectors used in these components also have finer and more complex structures. It has high hinge properties (hinge properties) that do not break even after repeated bending. [0003] Conventionally, polyamide has been known as a resin capable of producing molded articles excellent in hinge properties. However, in the case of polyamide alone, he...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/06C08L71/12C08L53/02C08K5/14C08K5/1539
CPCC08L77/06C08L2205/03C08L71/12C08L53/025C08K5/14C08K5/1539B29C45/0001B29C45/0081B29C45/2708B29K2071/12B29K2077/00B29K2105/0088B29K2105/251B29L2031/30B29L2031/34C08L53/02C08L2205/06C08L2205/08
Inventor 前田千裕梅井勇雄山本美穗子
Owner ASAHI KASEI KK
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