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A roughening treatment process and equipment for lead-free soldering electrolytic copper foil

A technology of roughening and electrolytic copper foil, which is applied in electrolytic process, electrolytic components, etc., can solve environmental hazards and other problems, and achieve the effect of uniform appearance color, permeability and strong adhesion

Active Publication Date: 2018-06-12
建滔(连州)铜箔有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the prior art, the method of improving the adhesion is to introduce arsenic during the roughening process, inhibit the formation of dendritic copper, and form loose nodules on the isolated nodes of the raw foil, thereby increasing the roughness of the rough surface. Enhance the adhesion and fitting force of resin infiltration; however, arsenic is a highly toxic substance, which has great harm to the human body and the environment. At the same time, the export of copper foil with highly toxic additives is also prohibited, thus adding new opportunities to the export of copper foil in my country trade barriers

Method used

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  • A roughening treatment process and equipment for lead-free soldering electrolytic copper foil
  • A roughening treatment process and equipment for lead-free soldering electrolytic copper foil
  • A roughening treatment process and equipment for lead-free soldering electrolytic copper foil

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Embodiment Construction

[0036] In order to fully understand the technical content of the present invention, the technical solutions of the present invention will be further introduced and illustrated below in conjunction with specific examples, but not limited thereto.

[0037] This example is a specific description of a certain combination of additives used in the roughening treatment process of electrolytic copper foil. It is a roughening treatment process for lead-free soldering electrolytic copper foil. In the treatment process, sodium tungstate, A combined additive composed of at least three compounds of sodium molybdate, sodium nitrite, stannous sulfate, hydrochloric acid, cerium sulfate, and ceric sulfate. Specifically, the combined additives include components at the following concentrations: 10-100 ppm of sodium tungstate, 5-50 ppm of stannous sulfate, 10-100 ppm of hydrochloric acid, and 20-150 ppm of cerium sulfate.

[0038] In other embodiments, a roughening treatment process for lead-fre...

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Abstract

The invention discloses a roughening treatment process for lead-free soldering electrolytic copper foils. According to the treatment process, a combined additive which is composed of at least three compounds of sodium tungstate, sodium molybdate, sodium nitrite, stannous sulfate, hydrochloric acid, cerous sulfate and ceric sulfate is used; the combined additive is used for replacing a high-toxic additive arsenic, and harm to the environment and human bodies is prevented; in addition, the combined additive can enable a series of isolated nodes on the copper foils to form loose tumor bodies, high-spread rough surfaces are achieved, permeability and adhesive force with base materials are higher, and appearance chroma is more uniform. In addition, the invention discloses equipment adopted by the treatment process. The equipment comprises a roughening tank used for containing a roughening treatment solution, multiple rollers used for conveying the copper foils are fixedly connected in the roughening tank, and the rollers are arranged at intervals in an up-and-down manner, so that the copper foils surround the peripheries of the rollers to form a corrugation shape, and the time of the copper foils in the roughening treatment solution can be prolonged or shortened according to practical requirements.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil, in particular to a roughening process and equipment for electrolytic copper foil for lead-free soldering. Background technique [0002] The surface treatment of electrolytic copper foil usually includes the treatment of roughening layer, heat-resistant barrier layer and anti-oxidation layer; the purpose of roughening treatment layer is to make the adhesion between copper foil and substrate stronger. [0003] In the prior art, the method of improving the adhesion is to introduce arsenic during the roughening process, inhibit the formation of dendritic copper, and form loose nodules on the isolated nodes of the raw foil, thereby increasing the roughness of the rough surface. Enhance the adhesion and fitting force of resin infiltration; however, arsenic is a highly toxic substance, which has great harm to the human body and the environment. At the same time, the export of copper foil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25F1/04C25F3/02C25F7/00
CPCC25F1/04C25F3/02C25F7/00
Inventor 林家宝
Owner 建滔(连州)铜箔有限公司
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