Top plate of liquid-cooling radiator

A radiator and roof technology, applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc. Excellent performance

Inactive Publication Date: 2017-10-20
镇江巍华电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its structure is relatively simple, and the heat dissipation effect is poor

Method used

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  • Top plate of liquid-cooling radiator
  • Top plate of liquid-cooling radiator
  • Top plate of liquid-cooling radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0012] As shown in the figure, a top plate of a liquid cooling radiator includes a top plate, the opening of the top plate is downward, and the top plate includes a main body of the top plate, a first side plate, a second side plate, and the first side plate and the second side plate respectively Located on both sides of the main body of the top plate, the upper surface of the main body of the top plate is provided with a first cooling fin, a plurality of second cooling fins, and a third cooling fin, and the first cooling fins and the third cooling fins are located at both ends of the plurality of second cooling fins. The first heat sink and the third heat sink are symmetrically arranged, and the distance between adjacent second heat sinks is equal. The middle parts of both sides of the first heat sink, the second heat sink, and the third heat s...

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Abstract

The present invention provides a top plate of a liquid-cooling radiator. The opening of the top plate faces downwards; the top plate comprises a top plate main body, a first side plate and a second side plate, wherein the first side plate and the second side plate are vertically located at two sides of the top plate main body respectively. According to the top plate of the liquid-cooling radiator of the invention, heat dissipation sheets are arranged on the top plate, and the heat dissipation sheets are provided with wavy sawteeth, and therefore, the heat dissipation performance of the radiator can be effectively improved; a first connecting groove and a second connecting groove are formed in the first side plate and the second side plate respectively, so that a connection mode is reliable; a first liquid-cooling pipe and a second liquid-cooling pipe are arranged in the top plate main body; the interior of the first liquid-cooling pipe is communicated with the interior of the second liquid-cooling pipe; a cooling liquid is arranged in the liquid-cooling pipes; the heat dissipation effect of the radiator can be further improved through a liquid-cooling mode; and the top plate is made of aluminum alloy, and therefore, the weight of the top plate is small, and the thermal conductivity of the top plate is high. The top plate of the liquid-cooling radiator of the present invention has the advantages of reasonable structure, excellent heat dissipation effect and high practicability.

Description

technical field [0001] The invention relates to the field of radiators, in particular to a top plate of a liquid-cooled radiator. Background technique [0002] Most of the electronic devices emit a lot of heat when they are running, and the heat dissipation performance has a great influence on the stable operation of the electronic devices. Set some vents on the chassis of the power supply to form an air duct to dissipate heat. Its structure is relatively simple, and its heat dissipation effect is relatively poor. Liquid cooling radiator is to provide a more effective solution for electrical cooling, which is divided into contact type and non-contact type. The contact type is in direct contact with the electronic device to eliminate heat, and the non-contact type is to install the device inside the liquid cooling radiator. , so that the internal fluid circulation system removes heat. Contents of the invention [0003] In order to solve the problems in the prior art, the...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20218H05K7/20409
Inventor易文巍
Owner镇江巍华电子有限公司