Laminating mechanism with recyclable welding die

A welding die and lamination technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the dislocation of the bottom plate and top cover of the welding die, the dislocation of the upper and lower sheets, and the low lamination efficiency, etc. problems, to achieve the effect of reducing the failure rate, reducing the number, and reducing the failure rate
CN108155129APending Publication Date: 2018-06-12SHANDONG CAIJU ELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
SHANDONG CAIJU ELECTRONICS TECH CO LTD
Publication Date
2018-06-12

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Abstract

The invention discloses a laminating mechanism with a recyclable welding die, and belongs to the technical field of automatic devices. The laminating mechanism is characterized by comprising a weldingdie input module (6), a top cover conveying module (9) and a bottom plate conveying module (10), the top cover conveying module (9) and the bottom plate conveying module (10) are arranged on one sideof the welding die input module (6), a die opening mechanical hand (7) is arranged between the input end of the top cover conveying module (9) and the welding die input module (6), a die closing mechanical hand (14) is arranged between the output end of the top cover conveying module (9) and the bottom plate conveying module (10), and a blanked piece transferring mechanical hand (11) is arrangedon one side of the bottom plate conveying module (10). By means of the laminating mechanism, a welding die bottom plate and a welding die top cover are recycled, assembly line type production can be realized without preparing too many welding dies, and production cost is reduced.
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Description

technical field

[0001] The utility model relates to a sheet combining mechanism for cyclic use of welding dies, which belongs to the technical field of automation equipment. Background technique

[0002] During the production of electronic components such as diodes, triodes, thyristors or bridges, chips need to be welded between the upper material and the lower material. This process is called bonding. The specific working process of the assembling is as follows: First, it is necessary to apply solder paste on the upper side of the lower material, and place the chip on the specific position of the lower material, and then stack the upper material with the solder paste on the lower side on the lower material. On the upper side of the sheet, cover the top cover of the welding mold on the bottom plate of the welding mold, and finally send the welding mold into the welding furnace for welding.

[0003] Traditional assembling usually requires manual work, but due to the high req...

Claims

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