Three-dimensional adjustable clamp for ultrasonic micro-welding imprinting

An adjustable, ultrasonic technology, applied in the field of clamps, to achieve low density, good fastening effect, stable and reliable clamping force

Active Publication Date: 2018-07-20
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But since ultrasonic vibrations can cause slippage between the mold and the polymer substrate, proper fixture design is critical to the success of ultrasonic imprinting

Method used

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  • Three-dimensional adjustable clamp for ultrasonic micro-welding imprinting
  • Three-dimensional adjustable clamp for ultrasonic micro-welding imprinting
  • Three-dimensional adjustable clamp for ultrasonic micro-welding imprinting

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Embodiment Construction

[0024] The three-dimensional adjustable jig for ultrasonic micro-welding imprinting of the present invention will be described in detail below with reference to the embodiments and the accompanying drawings.

[0025] Such as figure 1 As shown, the three-dimensional adjustable fixture for ultrasonic micro-welding imprinting of the present invention includes a substrate 1 for placing molds and samples, and four symmetrically arranged on the substrate 1 are used to limit the positions of molds and samples in the horizontal direction. The connecting plate 2, the connecting plate 2 can adjust the position on the base plate 1 according to the size of the mold and the sample, and each of the connecting plates 2 is provided with a set for fixing the mold and the sample in the vertical direction. The position of the fastening plate 3 can be adjusted on the connecting plate 2 according to the size of the mold and the sample.

[0026] Such as figure 2 As shown, the substrate 1 is a re...

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Abstract

The invention discloses a three-dimensional adjustable clamp for ultrasonic micro-welding imprinting. The three-dimensional adjustable clamp for ultrasonic micro-welding imprinting comprises a substrate used for placing a die and a sample; the substrate is symmetrically provided with four connection plates used for limiting the positions of the die and the sample in a horizontal direction; the connection plates, each of which is provided with a fastening plate used for fixing the positions of the die and the sample in a vertical direction, can perform position adjustment on the substrate according to the sizes of the die and the sample; and each fastening plate can perform position adjustment on the corresponding connection plate according to the sizes of the die and the sample. The three-dimensional adjustable clamp provided by the invention is compact in structure, small in size, low in manufacturing cost, stable and reliable in clamping force and good in fastening effect and can nearly meet the clamping demands of the dies and the samples in any sizes and arbitrary shapes in the ultrasonic micro-welding imprinting process. By adopting the three-dimensional adjustable clamp, theeffective pretightening pressure is provided by the fastening plates, and tight attachment between the sample and the die in the ultrasonic processing process is ensured; and through movement of connection screws in a length direction of slotted holes of the fastening plates, and the three-dimensional adjustable clamp can be adapted to the fastening demands of the dies and the samples in differentsizes.

Description

technical field [0001] The invention relates to a clamp. In particular, it relates to a three-dimensional adjustable clamp for ultrasonic micro-welding imprinting used in the manufacture of micro-device ultrasonic welding imprinting. Background technique [0002] In recent years, the processing technology of polymer microstructures / devices based on ultrasonic micro-thermocompression welding technology has become a research hotspot among scholars at home and abroad. In the ultrasonic imprinting and welding process, the high-frequency mechanical vibration of the ultrasonic welding joint is transmitted to the surface and interior of the polymer film through close contact with the flexible polymer film, and is converted into the friction between the film and the internal molecules of the film, thereby realizing the mechanical energy to the polymerization. The transformation of the internal energy of the material leads to an increase in the temperature of the local area of ​​the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C65/08
CPCB29C65/08B29C66/81451B29C66/81463
Inventor 杨成娟
Owner TIANJIN UNIV
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