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Heat dissipation device and heat dissipation module for power device

A technology of power devices and heat sinks, which is applied to semiconductor/solid-state device parts, electric solid-state devices, semiconductor devices, etc., can solve the problems of complex manufacturing process, many welding positions, and high cost, and achieve high heat dissipation efficiency and small thermal resistance , the effect of enlarging the contact area

Pending Publication Date: 2018-09-25
深圳市迈安热控科技有限公司
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  • Abstract
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  • Claims
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Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a power device heat dissipation device and a power device heat dissipation module in view of the existing IGBT heat dissipation device with many welding positions, complicated manufacturing process, and high cost defects

Method used

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  • Heat dissipation device and heat dissipation module for power device
  • Heat dissipation device and heat dissipation module for power device
  • Heat dissipation device and heat dissipation module for power device

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Embodiment Construction

[0042] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0043] Such as Figure 2-8 As shown, the power device cooling module provided by this embodiment of the present invention includes a plurality of power devices 1 and a power device cooling device 2 .

[0044] In this embodiment, the power device 1 is an IGBT. However, in other embodiments, other power devices that generate heat during operation may also be used.

[0045] Such as Figure 2-8 As shown, the power device cooling device 2 includes a heat dissipation main body 21, a first working fluid separator 22, a second working fluid separator 23, a first cover plate 2...

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Abstract

The invention relates to a heat dissipation device and a heat dissipation module for a power device. The heat dissipation device for the power device includes a heat dissipation main body, a first working medium partition plate, a second working medium partition plate, a first cover plate, a second cover plate, a liquid inlet pipe and a liquid outlet pipe. According to the invention, the contact area of the power device and heat pipes and the heat exchange area between working medium flow channels and cooling fluid channels are effectively amplified, the thermal resistance between the workingmedium flow channels and slots is extremely small, the heat dissipation efficiency of the power device is high, and the heat dissipation device and the heat dissipation module are suitable for heat dissipation of a large power device. Laminated arrangement of the slots, the working medium flow channels and the cooling fluid channels are utilized to replace welding of multiple heat dissipation plates, a water inlet main pipe and a water discharge main pipe in the prior art, and therefore, excessive welding points can be avoided, manufacturing process is simple, the cost is low, the thermal resistance can be effectively reduced, the risk of cooling fluid leakage is reduced, and the heat dissipation efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of power device heat dissipation, and in particular relates to a power device heat dissipation device and a power device heat dissipation module. Background technique [0002] Power devices (such as IGBTs) have certain losses during operation, and most of the losses turn into heat. In the actual application process, IGBT, as a power device, is widely used in frequency converters, inverters, electric vehicles and other fields. IGBTs will generate large losses during operation, and these losses are usually manifested as heat. In order for the IGBT to work normally, it is necessary to add a cooling device. The most commonly used is to install the IGBT in the middle of the radiator, and use the radiator to dissipate the heat to the surrounding space. If necessary, add a cooling fan or water cooling to increase the cooling efficiency. In addition, in order to reduce the temperature of the IGBT during operation, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/473
CPCH01L23/367H01L23/3672H01L23/473
Inventor 肖立峰田雪涛
Owner 深圳市迈安热控科技有限公司
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