39results about How to "Cooling Applicable" patented technology

The invention discloses an efficient heat dissipation device for an electronic component. The efficient heat dissipation device comprises a heat dissipation box and electronic components, wherein a fan box is installed at the upper end of the heat dissipation box, a fan is installed in the fan box, a third dustproof net is embedded in the upper top wall of the fan box, the heat dissipation box issequentially divided into a condensation cavity, a heat absorption cavity, a reflux cavity, a heating cavity and a heat conduction module cavity from top to bottom, and a condensation and heat dissipation mechanism is installed in the condensation cavity. According to the invention, the device is reasonable in structural design; a condensation and reflux structure is formed by a condensation and heat dissipation pipe, a fan, a heat absorption cavity and a reflux cavity, so that heat dissipation can be circulated; the fan can be fixed on the side surface, so that the thickness of the heat dissipation device is reduced, and the installation difficulty is reduced; a graphite heat conduction sheet and a flexible graphite connecting sheet can be connected and attached to the surface of any electronic component, so that the applicability and pertinence of the device are improved; and a heat conduction module block can select the proper flexible graphite connecting sheets according to the number of electronic components needing heat dissipation, so that energy losses are reduced.

An ultra-thin reticular self-vibration heat pipe heat dissipation film is formed by stacking a reticular groove base and a copper piece layer. The reticular groove base is provided with a bottom face and a groove face, and a reticular groove is formed in the groove face. The copper piece layer is stacked on the groove face on the reticular groove base, the reticular groove base is made of 0.1-0.2 mm metal or non-metal, the depth of the reticular groove is 0.05mm to 0.09 mm, and the thickness of a copper piece is 0.03mm to 0.1 mm. The invention further provides a method for processing the heat dissipation film with an ultra-thin structure. By means of the processing method, the ultra-thin structure difficultly formed by means of an existing press forming or casting forming technology and the like can be obtained, the ultra-thin heat dissipation film with large area can be manufactured, and the ultra-thin reticular self-vibration heat pipe heat dissipation film is especially suitable for heat dissipation of small devices, such as mobile phones.

The invention provides a casting mold for producing high-temperature alloy single crystal blades. The casting mold is applied to a directional solidification device. The casting mold is in a cylindrical shape and comprises an inner-layer ceramic shell and an outer filling interlayer, wherein an inner cavity formed by the ceramic shell is used for pouring high temperature alloy melts to form high-temperature alloy castings, and the periphery of the ceramic shell is filled with heat conduction materials and thermal insulation materials alternately through a barrel-shaped hoarding to form a filling entity provided with a plurality of horizontal heat conduction layers and thermal insulation layers through bonding. According to the entity heat conduction casting mold process, pouring and directional solidification can be performed in the existing directional solidification furnace, all sides of blades can be evenly heated, and therefore the severe shadow effect and organizational defects caused by the shadow effect can be eliminated effectively; and the condition that cold and hot areas in the existing device are almost through is changed, closed isolation between hot areas and cold areas is achieved, reduction of heat losses is facilitated, temperature gradients in castings is increased greatly, and the optimal temperature condition for growth of single crystals is formed.

The invention discloses an LED lamp radiator structure, which comprises radiating fins and a heat-absorbing pipe, wherein, the heat-absorbing pipe is arranged on the radiating fins for rapid absorption of the heat from the radiating fins. The heat-absorbing pipe is provided with at least one open end. A lamp shell, the radiating fins and a circuit board base plate are integrated by the same material, therefore, the amount of thermal resistance is reduced; at the same time an insulating oxide layer is connected with the radiating fins through seamless connectivity, thus greatly reducing the thermal resistance. As the heat-absorbing pipe and the radiating fins are adopted for heat radiation, the thermal conductivity and thermal dissipation performance is greatly improved, and the LED lamp radiator structure is especially applicable to be used for heat radiation of a high-power LED lamphouse.

The invention discloses a fully-automatic energy-saving drip molding method which is characterized by comprising the following steps: positioning, namely placing a mold on a one-cylinder four-claw system; carrying out drip molding, namely pushing the mold into a drip molding system through a telescopic cylinder; heating, namely pushing the mold into a heating system through the telescopic cylinderafter a product is formed on the mold through drip molding; cooling, namely heating the drip molded product on the mold, and pushing the mold into a cooling system through the telescopic cylinder; transferring, namely pushing the cooled mold into a transferring system 5 through the telescopic cylinder; clamping, namely transferring the mold into a clamping system; and demolding, namely pushing the mold into a demolding system through the telescopic cylinder. Through steps of positioning, drip molding, heating, cooling, transferring, clamping and demolding, a spraying molding product is moldedon one production line, fully-automatic production is achieved, and the production efficiency is improved.