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39results about How to "Cooling Applicable" patented technology
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Heat pipe radiating unit and manufacturing method thereof
InactiveCN1705112AEffective absorptionCooling ApplicableSemiconductor/solid-state device detailsSolid-state devicesEvaporationEngineering
A heat pipe radiation device and making method thereof, which contains substrate, at least one heat pipe and a radiation fins assembly, wherein said heat pipe containing evaporation part and at least condensation part, a channel below substrate for holding the evaporation part which has a plane surface contacted with the heating surface of heat source for quick and effectively absorbing heat, the radiation fins are jointed with condensation part.
Owner:HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
Thermal rubber heat sink and its manufacturing method and circuit board and its manufacturing method
InactiveCN1913763AIncrease cooling areaEffect of cooling areaPrinted circuit manufactureCooling/ventilation/heating modificationsSolderingThermal conductivity
The invention discloses a radiator with thermal conductive gum and its producing method, as well as the electric circuit board with this radiator and its producing method. A continuous thermal conductive film, which is produced by the gum with good thermal conductivity and insulation, is formed by covering the electric circuit board. It can increase heat dissipation area of the electrical component or heat dissipating soldering-pan without changing the design of the circuit board with simple structure, convenient production, installation and use, which area of heat dissipation is not influenced by the arrangement of the electrical components on the circuit board. Different methods can be selected to produce the radiator according to the needs. One is to coat this gum on the board directly. Another is to produce the gum radiator first, and then cut the size of board to paste on it.
Owner:HUAWEI TECH CO LTD
LED lamp and heat radiation structure thereof
InactiveCN101363605AReduce the amount formedCooling ApplicablePoint-like light sourceSemiconductor/solid-state device detailsLamp shellHeat sink
The invention discloses an LED lamp and the heat dissipating structure thereof, which comprise a heat dissipating fin and an endothermic tube that is arranged on the heat dissipating fin and is used for absorbing the heat on the heat dissipating fin quickly. The heat dissipating fin is provided with a through hole, and the endothermic tube is arranged in the through hole and is closed circulation reciprocating structure, the tube is provided with liquid. The closed circulation reciprocating structure comprises at least one of the following closed circulation reciprocating structures: the capital letter B font, the capital letter O font and square hole shape. The liquid is used for carrying out the circulation movement in the endothermic tube during the heating. A lamp shell, the heat dissipating fin and the substrate of a circuit board are a whole molded by the integral forming of the same material, which reduces the number of formed thermal resistances, meanwhile, the seamless connection of an insulation oxide layer and the heat dissipating fin can reduce the heat resistance value greatly; by adopting the method of combining the heat dissipation of the endothermic tube and the heat dissipating fin, the heat conducting and dissipating performances can be increased greatly, and the LED lamp and the heat dissipating structure thereof are particularly suitable for the heat dissipation of light sources of high power LEDs.
Owner:BEIJING ZHONGQING MICRO ELECTRIC TECH
Evaporator for loop heat pipe and application of evaporator
ActiveCN102853701AImprove cooling effectCooling ApplicableSemiconductor/solid-state device detailsSolid-state devicesMicro-loop heat pipeCopper
The invention relates to an evaporator for a loop heat pipe, and the evaporator comprises a soleplate and an upper cover plate, wherein the soleplate is in welding connection with the upper cover plate; the evaporator is a flat-type evaporator; a copper and nickel dual-layer sintered liquid absorption core is arranged on the upper part of the soleplate; and the liquid absorption core is a copper and nickel dual-layer sintered liquid absorption core, a finished product is divided into an upper layer and a lower layer, and the upper layer is a nickel layer. The evaporator has characteristics of simplicity in design and manufacturing, compactness in structure, low cost and the like; the cooling capacity of the loop heat pipe is enhanced by strengthening the heat conduction and controlling the heat leakage; and the evaporator is applicable to the cooling of an electronic chip with high wasted power.
Owner:EAST CHINA UNIV OF SCI & TECH
Fully-automatic energy-saving drip molding method
The invention discloses a fully-automatic energy-saving drip molding method which is characterized by comprising the following steps: positioning, namely placing a mold on a one-cylinder four-claw system; carrying out drip molding, namely pushing the mold into a drip molding system through a telescopic cylinder; heating, namely pushing the mold into a heating system through the telescopic cylinderafter a product is formed on the mold through drip molding; cooling, namely heating the drip molded product on the mold, and pushing the mold into a cooling system through the telescopic cylinder; transferring, namely pushing the cooled mold into a transferring system 5 through the telescopic cylinder; clamping, namely transferring the mold into a clamping system; and demolding, namely pushing the mold into a demolding system through the telescopic cylinder. Through steps of positioning, drip molding, heating, cooling, transferring, clamping and demolding, a spraying molding product is moldedon one production line, fully-automatic production is achieved, and the production efficiency is improved.
Owner:遂宁市金虹机械厂
Efficient heat dissipation device for electronic components
InactiveCN111712115AReduce thicknessReduce installation difficultyModifications using liquid coolingModifications by conduction heat transferThermodynamicsEngineering
Owner:郑州威科特电子科技有限公司
Fly wheel energy storage rotor vacuum heat radiation system
PendingCN108900039AAchieve no mechanical contactEliminate frictional lossesCooling/ventillation arrangementSiphonFlywheel energy storage
The invention discloses a fly wheel energy storage rotor vacuum heat radiation system, which mainly consists of an evaporation device, a condensing device and a loop pipeline, wherein each system rotor is of a hollow structure; the evaporation device is arranged in a rotor center shaft hole and corresponds to the position of heat sources of a motor, an electromagnetic bearing and the like; the mechanical contact cannot be generated with the inner wall of the shaft; the heat of the rotor is transferred to the evaporation device in a radiation heat exchange mode. According to the natural circulation two-phase heat siphon loop gravity heat pipe principle, the condensing device is arranged outside a flywheel energy storage system; the sea level elevation is higher than the evaporation device;the gravity potential energy is used for driving work media in a heat radiation system to circularly flow. The special requirements of heat radiation of the flywheel energy storage system in the vacuum state are considered; the natural circulation two-phase heat siphon loop gravity heat pipe is combined; the system is applicable to the heat radiation of the flywheel energy storage system rotor under the vacuum condition.
Owner:INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
High-efficiency electronic component heat dissipation device
ActiveCN110430733AReduce thicknessReduce installation difficultyModifications using liquid coolingModifications by conduction heat transferHeat conductingGraphite
The invention discloses a high-efficiency electronic component heat dissipation device, which comprises a heat dissipation box and an electronic component. A fan box is mounted on an upper end of theheat dissipating box; a fan is installed in the fan box; three anti-dust meshes are embedded in the upper top wall of the fan box; and the heat dissipation box is divided into a condensation chamber,a heat absorption chamber, a return chamber, a heating chamber and a heat conduction module chamber from the top to bottom in sequence, wherein the condensation chamber is internally equipped with a condensing and cooling mechanism. The high-efficiency electronic component heat dissipation device is reasonable in structural design; through a condensation heat dissipation pipe, the fan, the heat absorption chamber and the return chamber, a condensation return structure is formed, and circulating heat dissipation can be realized; the fan can be fixedly arranged on the side surface, thereby reducing the thickness of the heat dissipation device and reducing installation difficulty; graphite heat conducting sheets and flexible graphite connecting sheets can be attached to the surface of any electronic component, thereby increasing applicability and targeted performance of the device; and a heat conduction module can select suitable flexible graphite connecting sheets according to the numberof electronic components needing heat dissipating, thereby reducing energy consumption.
Owner:盐城市钊扬工业设计有限公司
Circulating water feeding system of cooling device of hydropower generation set
InactiveCN102445038AReduce power consumptionAvoid interruptionDomestic cooling apparatusLighting and heating apparatusWater filterWater quality
The invention discloses a circulating water feeding system of a cooling device of a hydropower generation set, which solves the problem of abnormal halt of the set, caused by blockage of a conventional water filter by river floating matters, sand and stone and the like in a hydropower station. The circulating water feeding system of the cooling device of the hydropower generation set comprises a circulating water pool (1), a cooler (2), a mechanical water pump (3) and an automatic water replenishing device, wherein the circulating water pool (1), the cooler (2) and the mechanical water pump (3) are sequentially connected by using a pipeline; water inlets (4) of the cooling device for a bearing seat of the hydropower generation set and an air cooler are connected with a water outlet of the mechanical water pump (3), water outlets (5) of the cooling device for the bearing seat of the hydropower generation set and the air cooler are connected with the circulating water pool (1); the mechanical water pump (3) is driven by a rotor large shaft (6) of a power generator of the hydropower generation set to work; the elevation of the circulating pool (1) is higher than that where the hydropower generation set is in by 3-5m; and internally-circulating water is clean water. The circulating water feeding system is suitable for cooling the hydropower generation set with poor water quality.
Owner:郑周华
Ultra-thin reticular self-vibration heat pipe heat dissipation film and processing method thereof
An ultra-thin reticular self-vibration heat pipe heat dissipation film is formed by stacking a reticular groove base and a copper piece layer. The reticular groove base is provided with a bottom face and a groove face, and a reticular groove is formed in the groove face. The copper piece layer is stacked on the groove face on the reticular groove base, the reticular groove base is made of 0.1-0.2 mm metal or non-metal, the depth of the reticular groove is 0.05mm to 0.09 mm, and the thickness of a copper piece is 0.03mm to 0.1 mm. The invention further provides a method for processing the heat dissipation film with an ultra-thin structure. By means of the processing method, the ultra-thin structure difficultly formed by means of an existing press forming or casting forming technology and the like can be obtained, the ultra-thin heat dissipation film with large area can be manufactured, and the ultra-thin reticular self-vibration heat pipe heat dissipation film is especially suitable for heat dissipation of small devices, such as mobile phones.
Owner:LOVEPAC CONVERTING BEIJING +1
Method and device for evaporating water and liquefied vapor
InactiveCN107504607AFast heat absorptionImprove cooling efficiencyDomestic cooling apparatusLighting and heating apparatusMoistureEnvironmental engineering
The invention discloses a method and device for evaporating water and liquefying water vapor. Water evaporates on the evaporation / liquefaction layer, or when the water vapor in the gas contacting the evaporation / liquefaction layer is saturated, the water vapor evaporates / liquefies Liquefaction on the layer; the evaporation / liquefaction layer is the water-absorbent layer or the water-wettable layer, the water is immersed in the water-absorbent layer or distributed on the surface of the water-wettable layer, the thickness of the water-absorbent layer or the water-wettable layer The thickness of the water layer on the surface is below 2mm. The present invention has various functions such as cooling, heat dissipation, heating, heat absorption, moisturizing, moisture absorption, negative ion generation, pure water production, extraction of soluble matter in water, air filtration, and power generation. Water just works. The water and moisture mentioned in the present invention can be any liquid and gas, as long as it has the characteristics of evaporation and liquefaction.
Owner:杨坤
Heat radiation structure of LED lamp
InactiveCN101377294AReduce the amount formedCooling ApplicablePoint-like light sourceSemiconductor/solid-state device detailsEngineeringHeat sink
The invention discloses an LED lamp radiator structure, which comprises radiating fins and a heat-absorbing pipe, wherein, the heat-absorbing pipe is arranged on the radiating fins for rapid absorption of the heat from the radiating fins. The heat-absorbing pipe is provided with at least one open end. A lamp shell, the radiating fins and a circuit board base plate are integrated by the same material, therefore, the amount of thermal resistance is reduced; at the same time an insulating oxide layer is connected with the radiating fins through seamless connectivity, thus greatly reducing the thermal resistance. As the heat-absorbing pipe and the radiating fins are adopted for heat radiation, the thermal conductivity and thermal dissipation performance is greatly improved, and the LED lamp radiator structure is especially applicable to be used for heat radiation of a high-power LED lamphouse.
Owner:SHANXI SENPU LIGHTING TECH
An integrated circuit thermal management system based on graphene material
ActiveCN108987559AGood coolingReduce volumeThermoelectric device with peltier/seeback effectThermoelectric device manufacture/treatmentCurrent regulatorIntegrated circuit
The invention discloses an integrated circuit thermal management system based on graphene material, which comprises a power supply system, at least one switching device, at least one temperature control unit and at least one current controller. A temperature control unit comprise a positive electrode, a negative electrode, a plurality of P-type graphene materials and an N-type graphene material, wherein that P-type graphene material and the N-type graphene material are arranged alternately between the positive electrode and the negative electrode in turn; the positive electrode of the power supply system is connected to one end of the switching device, the other end of the switching device is connected to the positive electrode of the temperature control unit, the negative electrode of thetemperature control unit is connected to one end of the current controller, and the other end of the current controller is connected to the negative electrode of the power supply system. The invention realizes active controllable heat dissipation based on Peltier effect, realizes spatial modulation distribution of heat field under the action of switching device, and realizes modulation distribution of heat in time domain under the action of current regulator.
Owner:XUZHOU NORMAL UNIVERSITY
Cooling device and electronic equipment
PendingCN107135598AReduce overall thicknessCooling ApplicableMagnetic/electric field screeningPrinted circuit aspectsPrinted circuit boardEngineering
The invention provides a cooling device and electronic equipment. The cooling device is used for being arranged on a printed circuit board so as to cool an electronic component arranged on the printed circuit board, and the cooling device comprises a supporting mechanism, and a first heat transfer part, wherein the supporting mechanism comprises a slablike body and a connecting part arranged at the edge of the body, the body and the connecting part form an internal space for containing the electronic component, the supporting mechanism can be connected with the printed circuit board through the connecting part, the body has a first surface and a second surface, the first surface and the second surface are oppositely arranged, the first surface faces the electronic component when the supporting mechanism is connected to the printed circuit board, the first heat transfer part is arranged on the first surface and is arranged corresponding to the electronic component, the first heat transfer part is in contact with the electronic component when the supporting mechanism is connected to the printed circuit board, and the thickness of the first heat transfer part is 2-15 mils. The cooling device is suitable for cooling the electronic equipment which needs to be light and thin.
Owner:TIANJIN LAIRD TECH LTD
Water evaporating method and device
PendingCN107796070ANo consumptionNo pollution in the processDomestic cooling apparatusLighting and heating apparatusDistilled waterEngineering
The invention discloses a water evaporating method and device. The water evaporator method comprises the following steps: conveying water to an evaporating layer through a capillary structure; and keeping the thickness of a water layer in the evaporating layer below 1mm, wherein water is evaporator on the evaporating layer; the evaporating layer is a water absorbing material layer or a soaking material layer, water permeates the water absorbing material layer or infiltrates the surface of the soaking material layer, and the thickness of the water absorbing material layer or the thickness of the water layer on the surface on the soaking material layer is below 1mm. The method and device provided by the invention have various functions of reducing temperature, dissipating heat, keeping moisture, absorbing moisture, generating negative ions, generating distilled water and the like; the device is simple to arranged and convenient to maintain; the energy consumption cannot be consumed, andthe device can operate if water is available.
Owner:杨坤
Novel bridge type light emitting diode (LED) street lamp
InactiveCN102022676AMeet the illumination requirementsReduce the amount of developmentPoint-like light sourceElectric circuit arrangementsIlluminanceBridge type
The invention relates to a street lamp, in particular to a novel bridge type light emitting diode (LED) street lamp. In the invention, a unitized lamp body component structure is adopted; The purpose of serialization is realized by combining different quantity of units, thus the development cycle and the mold development quantity are greatly reduced, and the development cost and the production cost are lowered on the premise of satisfying different road illuminating value requirements. Since the lamp body component consists of a plurality of standard LED street lamp units, when one LED street lamp unit fails, the normal operations of other LED street lamp units are not influenced, and maintenance and replacement are carried out on the abnormal unit, thereby greatly reducing the maintenance cost and the replacement cost; and simultaneously, in the invention, a mode that heat pipe heat dissipation and metal material heat dissipation are combined is adopted, thus greatly improving the heat conduction and heat dispersion performances and being especially suitable for heat dissipation of large-power LED light sources.
Owner:中置新能源科技发展(上海)有限公司
Fault alarm device for computer information management
InactiveCN109725590ASimple cooling structureCooling ApplicableDigital data processing detailsHardware monitoringElectricitySolenoid valve
The invention discloses a fault alarm device for computer information management, and relates to the field of computer alarm devices. The fault alarm device comprises multiple computer hosts. Temperature sensors are arranged in multiple computer hosts. Alarms are arranged on the host computers. Controllers are arranged on one side of the alarms. The device also comprises a cabinet. The cabinet isfilled with coolant. A hydraulic pump is arranged on one side of the cabinet. A total outlet pipe is arranged on the hydraulic pump. Multiple branch pipes are arranged on a water distribution pipe. Solenoid valves are arranged on multiple branch pipes. Branch pipes are provided with soft pipes away from the end of the water distribution pipe. Cases are arranged in the computer hosts. Motors are arranged in the cases. Fan adjustment devices are arranged on the motors. Fans are arranged on the fan adjustment devices. The hydraulic pump is electrically connected to multiple controllers. The invention has the beneficial effects that: it is suitable for heat dissipation of a large-scale computer host by improving the heat dissipation mode inside the computer host, simplifies the heat dissipation structure, and improves the heat dissipation effect.
Owner:XUCHANG UNIV
Liquid-circulation-based LED array cooling system
InactiveCN102692003AReduce cooling costsCooling ApplicablePoint-like light sourceLighting heating/cooling arrangementsLed arrayEngineering
The invention discloses a liquid-circulation-based LED array cooling system which comprises an LED array composed of a plurality of LEDs. A cooling mechanism of each LED is in a cavity shape. Each cavity shaped cooling mechanism is provided with a liquid inlet end and a liquid outlet end. The liquid inlet ends and the liquid outlet ends of each two adjacent LEDs are connected through liquid pipelines. The liquid inlet end and the liquid outlet end at two ends of the LED array are connected with a liquid circulation drive device through pipelines. Heat is transferred between the whole LED array and liquid inside a drive liquid pipeline of the liquid circulation drive device. The liquid circulation drive device is provided with a heat exchanger used to guide out liquid carrying LED heat. The manner of liquid circulation cooling is adopted, the LED array composed of the LED lamps is serially connected with the pipelines which are used to circulate for cooling, and accordingly cooling cost for each LED is reduced, and the circulating liquid is capable of transferring heat quickly.
Owner:HUIZHOU YOUTECH OPTOELECTRONICS TECH
Bridge radiating device for LED street lamp
InactiveCN101876426ACooling ApplicableIncrease cooling areaPoint-like light sourceSemiconductor/solid-state device detailsHeat conductingEngineering
The invention relates to a radiating device, in particular to a bridge radiating device for an LED street lamp. The radiating main body of the bridge radiating device for an LED street lamp comprises a plurality of heat conducting pipes 4 connected with heat conducting substrates 5 and a plurality of radiating fins 1 sheathed on the heat conducting pipes 4. When the LED lamp array is turned on, large heat is generated; the heat is conducted to the radiating fin through the heat conducting substrates and the heat conducting pipes. The radiating fin 1 is a square thin piece and made of aluminum or copper; and a plurality of radiating fins are distributed in parallel, thus the radiating area is large and the radiating efficiency is high. In the invention, heat pipe heat emission is combined with metal material heat emission, the performances of heat conducting and heat emission are greatly improved; and the invention is specifically suitable for heat emission of high power LED light source.
Owner:中置新能源科技发展(上海)有限公司
Heat dissipation device and heat dissipation module for power device
PendingCN108573938ACooling ApplicableImprove cooling efficiencySemiconductor/solid-state device detailsSolid-state devicesEngineeringCooling fluid
The invention relates to a heat dissipation device and a heat dissipation module for a power device. The heat dissipation device for the power device includes a heat dissipation main body, a first working medium partition plate, a second working medium partition plate, a first cover plate, a second cover plate, a liquid inlet pipe and a liquid outlet pipe. According to the invention, the contact area of the power device and heat pipes and the heat exchange area between working medium flow channels and cooling fluid channels are effectively amplified, the thermal resistance between the workingmedium flow channels and slots is extremely small, the heat dissipation efficiency of the power device is high, and the heat dissipation device and the heat dissipation module are suitable for heat dissipation of a large power device. Laminated arrangement of the slots, the working medium flow channels and the cooling fluid channels are utilized to replace welding of multiple heat dissipation plates, a water inlet main pipe and a water discharge main pipe in the prior art, and therefore, excessive welding points can be avoided, manufacturing process is simple, the cost is low, the thermal resistance can be effectively reduced, the risk of cooling fluid leakage is reduced, and the heat dissipation efficiency is improved.
Owner:深圳市迈安热控科技有限公司
Reaction kettle cooling device
InactiveCN112337413ACooling ApplicableReduce use costChemical/physical/physico-chemical processesThermodynamicsEngineering
The invention discloses a reaction kettle cooling device which comprises a base, a valve, a water pump, a first connecting sleeve and a reaction kettle shell, a water tank is welded to the left side of the lower end of the interior of the base, a three-way pipe is welded to the upper end of the right side of the water tank, and the valve is welded to the upper end of the left side of the water tank and penetrates through the upper end of the left side wall of the base; a plug is arranged at the lower end of the left side of the base, a supporting column is welded to the middle of the top end of the base, a heat dissipation pipe is fixedly connected to the outer portion of the supporting column through a connecting rod, a water pump is arranged on the left side of the outer portion of the base, and a reaction kettle shell is arranged on the left side of the water pump; the surface of the reaction kettle shell is welded with a heat absorption pipe; and the upper end of the three-way pipeis fixedly connected with the lower end of the heat dissipation pipe. According to the reaction kettle cooling device, the heat dissipation pipe and the heat absorption pipe are arranged, cooling water obtained after heat dissipation of the heat dissipation pipe is circularly injected into the heat absorption pipe through the water pump, heat dissipation of the reaction kettle is facilitated, andthe design is low in use cost and suitable for heat dissipation of a small reaction kettle.
Owner:扬州市联合化工机械有限公司
An ultra-thin mesh self-oscillating heat pipe cooling film and its processing method
An ultra-thin reticular self-vibration heat pipe heat dissipation film is formed by stacking a reticular groove base and a copper piece layer. The reticular groove base is provided with a bottom face and a groove face, and a reticular groove is formed in the groove face. The copper piece layer is stacked on the groove face on the reticular groove base, the reticular groove base is made of 0.1-0.2 mm metal or non-metal, the depth of the reticular groove is 0.05mm to 0.09 mm, and the thickness of a copper piece is 0.03mm to 0.1 mm. The invention further provides a method for processing the heat dissipation film with an ultra-thin structure. By means of the processing method, the ultra-thin structure difficultly formed by means of an existing press forming or casting forming technology and the like can be obtained, the ultra-thin heat dissipation film with large area can be manufactured, and the ultra-thin reticular self-vibration heat pipe heat dissipation film is especially suitable for heat dissipation of small devices, such as mobile phones.
Owner:LOVEPAC CONVERTING BEIJING +1
Radiator with water circulating device of heat transfer seat
InactiveCN102135381AImprove cooling effectGet out as soon as possibleElectric heating systemStationary conduit assembliesElectricityWater cycling
The invention relates to a radiator with a water circulating device of a heat transfer seat. The radiator comprises a fin, a medium pipe and a heat transfer seat. The radiator is characterized in that the heat transfer seat is also internally provided with a through hole; two ends of the through hole are provided with openings on the heat transfer seat; a pipeline is arranged in the through hole; two ends of the pipeline are exposed out of the opening of the through hole; alternatively, a section of externally connected pipe mouth is arranged outside the opening; the through hole plays the role of a section of pipeline and forms a whole pipeline with the externally connected pipe mouth; and two sections of the pipe mouth are used for connecting the water pipes that need heat dissipation. The heat transfer seat is also provided with a second hole that is internally provided with an electric heating pipe; therefore, the radiator has the advantages of better radiating effect, is more applicable to dissipating the heat generated by hot water, and also has the advantages of dissipating the heat generated by the electricity as much as possible.
Owner:张学志
A high-efficiency heat dissipation device for electronic components
ActiveCN110430733BReduce thicknessReduce installation difficultyModifications using liquid coolingModifications by conduction heat transferThermodynamicsGraphite
The invention discloses an efficient heat dissipation device for an electronic component. The efficient heat dissipation device comprises a heat dissipation box and electronic components, wherein a fan box is installed at the upper end of the heat dissipation box, a fan is installed in the fan box, a third dustproof net is embedded in the upper top wall of the fan box, the heat dissipation box issequentially divided into a condensation cavity, a heat absorption cavity, a reflux cavity, a heating cavity and a heat conduction module cavity from top to bottom, and a condensation and heat dissipation mechanism is installed in the condensation cavity. According to the invention, the device is reasonable in structural design; a condensation and reflux structure is formed by a condensation and heat dissipation pipe, a fan, a heat absorption cavity and a reflux cavity, so that heat dissipation can be circulated; the fan can be fixed on the side surface, so that the thickness of the heat dissipation device is reduced, and the installation difficulty is reduced; a graphite heat conduction sheet and a flexible graphite connecting sheet can be connected and attached to the surface of any electronic component, so that the applicability and pertinence of the device are improved; and a heat conduction module block can select the proper flexible graphite connecting sheets according to the number of electronic components needing heat dissipation, so that energy losses are reduced.
Owner:CHONGQING JINGBIAO ELECTRONIC TECH CO LTD
Casting mold for producing high-temperature alloy single crystal blades and directional solidification device thereof
ActiveCN103192063BImprove thermal conditionsImprove thermal conductivityThin shellsThermal insulation
The invention provides a casting mold for producing high-temperature alloy single crystal blades. The casting mold is applied to a directional solidification device. The casting mold is in a cylindrical shape and comprises an inner-layer ceramic shell and an outer filling interlayer, wherein an inner cavity formed by the ceramic shell is used for pouring high temperature alloy melts to form high-temperature alloy castings, and the periphery of the ceramic shell is filled with heat conduction materials and thermal insulation materials alternately through a barrel-shaped hoarding to form a filling entity provided with a plurality of horizontal heat conduction layers and thermal insulation layers through bonding. According to the entity heat conduction casting mold process, pouring and directional solidification can be performed in the existing directional solidification furnace, all sides of blades can be evenly heated, and therefore the severe shadow effect and organizational defects caused by the shadow effect can be eliminated effectively; and the condition that cold and hot areas in the existing device are almost through is changed, closed isolation between hot areas and cold areas is achieved, reduction of heat losses is facilitated, temperature gradients in castings is increased greatly, and the optimal temperature condition for growth of single crystals is formed.
Owner:DONGFANG TURBINE CO LTD
Heat radiation structure of LED lamp
InactiveCN101377294BReduce the amount formedCooling ApplicablePoint-like light sourceLighting heating/cooling arrangementsLamp shellHeat sink
The invention discloses an LED lamp radiator structure, which comprises radiating fins and a heat-absorbing pipe, wherein, the heat-absorbing pipe is arranged on the radiating fins for rapid absorption of the heat from the radiating fins. The heat-absorbing pipe is provided with at least one open end. A lamp shell, the radiating fins and a circuit board base plate are integrated by the same material, therefore, the amount of thermal resistance is reduced; at the same time an insulating oxide layer is connected with the radiating fins through seamless connectivity, thus greatly reducing the thermal resistance. As the heat-absorbing pipe and the radiating fins are adopted for heat radiation, the thermal conductivity and thermal dissipation performance is greatly improved, and the LED lamp radiator structure is especially applicable to be used for heat radiation of a high-power LED lamphouse.
Owner:SHANXI SENPU LIGHTING TECH
Evaporator for loop heat pipe and application of evaporator
ActiveCN102853701BImprove cooling effectCooling ApplicableSemiconductor/solid-state device detailsSolid-state devicesMicro-loop heat pipeLoop heat pipe
The invention relates to an evaporator for a loop heat pipe, and the evaporator comprises a soleplate and an upper cover plate, wherein the soleplate is in welding connection with the upper cover plate; the evaporator is a flat-type evaporator; a copper and nickel dual-layer sintered liquid absorption core is arranged on the upper part of the soleplate; and the liquid absorption core is a copper and nickel dual-layer sintered liquid absorption core, a finished product is divided into an upper layer and a lower layer, and the upper layer is a nickel layer. The evaporator has characteristics of simplicity in design and manufacturing, compactness in structure, low cost and the like; the cooling capacity of the loop heat pipe is enhanced by strengthening the heat conduction and controlling the heat leakage; and the evaporator is applicable to the cooling of an electronic chip with high wasted power.
Owner:EAST CHINA UNIV OF SCI & TECH
Heat dissipation structure of LED lamp
InactiveCN103900063AReduce the amount formedCooling ApplicablePoint-like light sourceLighting heating/cooling arrangementsLamp shellHeat sink
A heat dissipation structure of an LED lamp comprises a lamp shell, a circuit board substrate, a heat dissipation piece and an air guiding pipe. The lamp shell, the heat dissipation piece and the circuit board substrate are integrally formed by the same materials, and are hollow and communicated. The end portion of a heat dissipation piece body of the heat dissipation piece is provided with an air inlet, the end portion of a heat dissipation piece body of the heat dissipation piece is provided with an air outlet, and a fan is arranged at an air inlet of an air inlet pipe.
Owner:KUNSHAN DONGDA ZHIHUI TECH CONSULTANT
A fully automatic energy-saving plastic dropping method
The invention discloses a fully-automatic energy-saving drip molding method which is characterized by comprising the following steps: positioning, namely placing a mold on a one-cylinder four-claw system; carrying out drip molding, namely pushing the mold into a drip molding system through a telescopic cylinder; heating, namely pushing the mold into a heating system through the telescopic cylinderafter a product is formed on the mold through drip molding; cooling, namely heating the drip molded product on the mold, and pushing the mold into a cooling system through the telescopic cylinder; transferring, namely pushing the cooled mold into a transferring system 5 through the telescopic cylinder; clamping, namely transferring the mold into a clamping system; and demolding, namely pushing the mold into a demolding system through the telescopic cylinder. Through steps of positioning, drip molding, heating, cooling, transferring, clamping and demolding, a spraying molding product is moldedon one production line, fully-automatic production is achieved, and the production efficiency is improved.
Owner:遂宁市金虹机械厂
Ultrathin heat dissipation device and heat dissipation method
InactiveCN113438868ACooling ApplicableAchieve ultra-thinCooling/ventilation/heating modificationsThermodynamicsCollector device
The invention discloses an ultrathin heat dissipation device and a heat dissipation method, and belongs to the technical field of electronic product heat dissipation. The ultrathin heat dissipation device comprises a heat collector and an electromagnetic pump, the heat collector and the electromagnetic pump are connected end to end through a heat dissipation flow channel to form a closed loop, and the heat collector, the electromagnetic pump and the heat dissipation flow channel are all installed on a bottom plate. And the bottom plate is a first electrode plate of the electromagnetic pump. The heat collector is in direct contact with a heating part to absorb heat of the heating part, and the electromagnetic pump drives the liquid metal to flow through the heat collector to take away the heat absorbed by the heat collector. The bottom plate has multiple purposes, besides the heat dissipation function, the functions of the electromagnetic pump electrode, the heat dissipation flow channel wall and the component supporting plate are further achieved, the system is ultrathin, the liquid metal fluid heat dissipation device is particularly suitable for heat dissipation of narrow spaces such as mobile phones, tablet personal computers and ultrathin laptops, and the liquid metal fluid heat dissipation method is high in heat dissipation efficiency. Compared with a common ultrathin heat pipe, the heat dissipation efficiency is improved by more than 73%.
Owner:YUNAN JINGCHUANG LIQUID METAL THERMAL CONTROL TECH RES & DEV CO LTD
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