Heat pipe radiating unit and manufacturing method thereof

A technology of a heat dissipation device and a manufacturing method, which is applied to tubular elements, heat exchange equipment, indirect heat exchangers, etc., can solve the problems of large thermal resistance, inability to achieve heat dissipation effect, and inability to give full play to the performance of rapid heat conduction of heat pipes. Small size, fast and effective absorption of heat
CN1705112AInactive Publication Date: 2005-12-07HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
Publication Date
2005-12-07
Estimated Expiration
Not applicable · inactive patent

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Abstract

A heat pipe radiation device and making method thereof, which contains substrate, at least one heat pipe and a radiation fins assembly, wherein said heat pipe containing evaporation part and at least condensation part, a channel below substrate for holding the evaporation part which has a plane surface contacted with the heating surface of heat source for quick and effectively absorbing heat, the radiation fins are jointed with condensation part.
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Description

【Technical field】

[0001] The invention relates to a heat dissipation device and a manufacturing method thereof, in particular to a heat dissipation device utilizing a heat pipe and a manufacturing method thereof. 【Background technique】

[0002] With the continuous advancement and wide application of large-scale integrated circuit technology, the development of the information industry has advanced by leaps and bounds, and high-frequency and high-speed processors have been continuously introduced. Due to the high-frequency and high-speed operation, the processor generates a lot of heat per unit time. If the heat is not removed in time, the temperature of the processor itself will rise, which will have a great impact on the safety and performance of the system. At present, the problem of heat dissipation has become a problem for every A problem that must be solved when a new generation of high-speed processors is launched. Generally, the industry all installs radiators on chi...

Claims

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