The invention discloses a 
loop heat pipe cooling device with a 
pool boiling function. The 
loop heat pipe cooling device comprises a flat plate type 
evaporator, a first condenser, a 
pool boiling 
evaporator and a second condenser, wherein a compensator is arranged on the top most portion of a 
metal cavity of the flat plate type 
evaporator, and an outlet of the flat plate type evaporator is connected to an outlet of the 
pool boiling evaporator through a first connecting pipeline. The first condenser is a casing 
pipe type condenser and is mounted on the first connecting pipeline in a sleeved mode. The outlet of the pool boiling evaporator is connected with the compensator through a second connecting pipeline. The second condenser is also a casing 
pipe type condenser and is mounted on the second connecting pipeline in a sleeved mode. A condensate outlet of the first condenser is connected with a condensate inlet of the second condenser through a pipeline. The 
loop heat pipe cooling device with the pool boiling function fully combines the advantages of a square column microstructural pool boiling device, wherein the advantages includes that the heat dissipation efficiency is high, the temperature fluctuation is small, the occupied space is small, and a loop 
heat pipe can be used for long-distance transmission; capillary 
suction force generated by a capillary core is used for providing 
motive power for a 
system; and the effect that electronic parts and components can be cooled high efficiently is guaranteed.