Heat dissipation structure

Abstract

A heat dissipation structure mounted onto an electronic element to dissipate heat. The heat dissipation structure includes a heat absorber connected with the electronic element and a heat sink. The heat absorber has a hollow first chamber to hold a working fluid. The heat absorber and heat sink are interposed by a plurality of first conduits. When the heat absorber absorbs heat generated by the electronic element through a contact surface, the working fluid held therein is vaporized into vapor. The vapor enters a second chamber of the heat sink through the first conduits and performs heat exchange with a cooling surface of the heat sink to be converted into the working fluid again. The working fluid is conveyed via a capillary structure in the second conduit to the first chamber to form a thermal cycle. The structure of the invention is simpler and can rapidly absorb and dissipate heat.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a heat dissipation structure and particularly to an improved heat dissipation structure having a capillary structure.BACKGROUND OF THE INVENTION[0002]Advance of technology brings great benefits to people's life and constantly enhances functionality and performance of electric appliances. For instance, high-level electronic products stressed on processing speed and reliability such as server and workstation, and even personal computer and notebook computer, have promoted higher performance and speed requirement for CPU. In such developing trends, one of the biggest obstacles is heat generation. At present, the most common cause of malfunction or damage of electronic elements is poor heat dissipation that results in overheating. Heat is mainly generated by active elements such as transistors in IC during processing. The more transistors included in chips, the greater heat generated. However, the size of electronic products i...

AI Technical Summary

Benefits of technology

[0008]By means of the second conduit having the capillary structure, the working fluid can quickly flow back to the first chamber to form a thermal cycle. The heat absorber and heat sink have respectively the first chamber and second chamber that have greater volume to hold more working fluid. The heat dissipation structure of the invention thus formed is simpler and can dissipate heat quickly.

Problems solved by technology

In such developing trends, one of the biggest obstacles is heat generation.

At present, the most common cause of malfunction or damage of electronic elements is poor heat dissipation that results in overheating.

However, the size of electronic products is shrunk constantly.

Conventional heat dissipation modules cannot meet this requirement.

Overheated problem has become a bottleneck of electronic element technology development.

This not only enhances the reliability of an electronic product, but also prolongs the lifespan thereof.

But the air fan employs compulsory convection for cooling and creates many problems, such as power consumption, noise generation and shorter lifespan.

The aforesaid conventional technique has a drawback that the cooling capability thereof is restricted by the volume in the heat pipe.

Moreover, if the heat pipe is applied to electronic elements with super high speed, it will generate a greater amount of heat during operation and cannot achieve the cooling requirement.

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