Liquid-state cooling immersion type structure heat dissipation system for computer chip

A cooling system and computer technology, applied in computing, instrumentation, electrical and digital data processing, etc., can solve problems such as bottlenecks, and achieve the effect of low noise of the working medium, improved effect, and tight contact

Active Publication Date: 2014-12-17
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, there have been a large number of research reports and practical application of coolants, mainly water-based coolants and liquid metal coolants, but there are still serious bottlenecks in meeting product application requirements.

Method used

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  • Liquid-state cooling immersion type structure heat dissipation system for computer chip
  • Liquid-state cooling immersion type structure heat dissipation system for computer chip
  • Liquid-state cooling immersion type structure heat dissipation system for computer chip

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Embodiment Construction

[0028] like Figure 1-Figure 3 Shown are schematic diagrams of three different structures of the computer chip liquid cooling immersion structure heat dissipation system of the present invention. The heat dissipation system is placed in the chassis, including the coolant pump 1, the coolant tank 2, and the condenser pipe 3, and the three are connected in sequence through the liquid pipe to form a loop. In this embodiment, the condenser pipe 3 is used as the liquid cooling radiator , can also use heat sink or similar rib structure (which can effectively increase the heat dissipation surface) as a liquid cooling radiator. At the same time, the above structure can further expand the heat dissipation surface by contacting with the chassis wall, and can also be equipped with a fan Air cool the radiator. The insulating heat transfer oil 4 is used as the cooling liquid in the loop of the system, but it is not limited to the use of heat transfer oil, and other cooling liquids with in...

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Abstract

The invention discloses a liquid-state cooling immersion type structure heat dissipation system for a computer chip. The liquid-state cooling immersion structure heat dissipation system comprises a cooling liquid pump, a cooling liquid tank, a liquid-cooled radiator and a liquid pipe, wherein the cooling liquid pump, the cooling liquid tank and the liquid-cooled radiator are communicated in sequence through the liquid pipe, thereby forming a loop; insulating cooling liquid is used in the loop; an object to be cooled is placed into the cooling liquid tank. According to the liquid-state cooling immersion type structure heat dissipation system, the object to be cooled is immersed into the cooling liquid in a direct and tight contact way, so that the heat exchange cooling effect is improved greatly.

Description

technical field [0001] The invention relates to the technical field of computer chip liquid cooling and heat dissipation, in particular to a computer chip liquid cooling immersion structure heat dissipation system. Background technique [0002] In recent years, the key problem of thermal barrier of highly integrated computer chips has become one of the technical bottlenecks restricting its sustainable development. At present, the mainstream technology development direction to solve the heat dissipation of computer chips is to develop liquid cooling methods, and use coolant to enhance the heat dissipation effect of chips. Specifically, a structure such as an interface heat collector (cold head) is added to the heating chip, and the cooling liquid flows through the cold head to take away heat, thereby achieving the purpose of cooling. [0003] At present, there have been a large number of research reports and practical application of cooling fluids, mainly water-based cooling...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 张亚非王楠赵波苏言杰张耀中
Owner SHANGHAI JIAO TONG UNIV
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