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31results about How to "Applicable cooling" patented technology
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Double-component low-hardness high-heat-conductivity room-temperature-curing organosilicon heat conducting adhesive
InactiveCN102936484AApplicable coolingReduce hardnessNon-macromolecular adhesive additivesAdhesiveHeat conducting
The invention relates to a double-component low-hardness high-heat-conductivity room-temperature-curing organosilicon heat conducting adhesive, belonging to the technical field of electric insulation adhesives for binding and packaging electronic and electric appliance elements. The double-component low-hardness high-heat-conductivity room-temperature-curing organosilicon heat conducting adhesive comprises a component A and a component B, wherein the component A is prepared by mixing the following components in parts by weight: 100 parts of base material and 0.1-0.5 part of platinum catalyst; the component B is prepared by mixing the following components in parts by weight: 100 parts of base material, 0.1-10 parts of terminal-hydrogen-containing silicone oil, 0.1-10 parts of side-hydrogen-containing silicone oil and 0.01-1 part of inhibitor; and the base material is prepared by the following steps: mixing 100 parts by weight of divinyl silicone oil and 800-1500 parts by weight of aluminum oxide, treating with hexamethyldisilazane at 115-125 DEG C, and cooling to room temperature to obtain the base material. The adhesive has the advantages of high heat conductivity (up to 2.5-3.6 W / (m.k)), low hardness and ideal mechanical properties; and the adhesive can be closely combined with the electronic element, and therefore, can be ideally used for heat dissipation of high-power elements.
Owner:西卡(江苏)工业材料有限公司
Liquid-state cooling immersion type structure heat dissipation system for computer chip
ActiveCN104216492AClose contactImprove the cooling effect of heat exchangeDigital data processing detailsNuclear engineeringLiquid state
The invention discloses a liquid-state cooling immersion type structure heat dissipation system for a computer chip. The liquid-state cooling immersion structure heat dissipation system comprises a cooling liquid pump, a cooling liquid tank, a liquid-cooled radiator and a liquid pipe, wherein the cooling liquid pump, the cooling liquid tank and the liquid-cooled radiator are communicated in sequence through the liquid pipe, thereby forming a loop; insulating cooling liquid is used in the loop; an object to be cooled is placed into the cooling liquid tank. According to the liquid-state cooling immersion type structure heat dissipation system, the object to be cooled is immersed into the cooling liquid in a direct and tight contact way, so that the heat exchange cooling effect is improved greatly.
Owner:SHANGHAI JIAO TONG UNIV
Pulsating heat pipe heat-transfer device for low grade heat energy utilization
InactiveCN101818999ALow costImprove heat transfer performanceIndirect heat exchangersTubular elementsThermal energyLower grade
The invention discloses a pulsating heat pipe heat-transfer device for low-grade heat energy utilization. A single-row multi-port flat tube with a plurality of channels is bent into a plurality of layers and after both ends of the flat tube are processed further, different connecting modes can be formed, so that the device works according to the mechanism of an open ended or loop pulsating heat pipe. Moreover, wavy fins can be additionally arranged between two adjacent layers of flat tubes of a cooling section and a heating section of the heat-transfer device as required to reduce the heat transfer resistances of the cooling section and the heating section. When the pulsating heat pipe heat-transfer device is used, heating fluid passes through one end of the device, and cooling fluid passes through the other end of the device, so that utilization of low-grade heat or cooling and heat dissipation is realized. The pulsating heat pipe heat-transfer device provided by the invention has the advantages of compact structure, light weight, low cost, simple manufacturing, good heat-transfer effect and the like.
Owner:CENT SOUTH UNIV
Paraffin-based air-cooled and water-cooled combined cooling device
InactiveCN105097733AGuaranteed to workExtend your lifeSemiconductor/solid-state device detailsSolid-state devicesParaffin oilsLiquid storage tank
The invention belongs to the technical field of micro-channel cooling, and discloses a paraffin-based air-cooled and water-cooled combined cooling device. The paraffin-based air-cooled and water-cooled combined cooling device comprises a cooling cover board and a cooling cold plate, wherein cooling fins are arranged on the cooling cover board; a fan is arranged above the cooling fins; the cooling cold plate is arranged under the cooling cover board; a plurality of channel groove gates are arranged on the cooling cold plate; a bump is arranged at one side of each channel groove gate; a groove is formed in the other side of each channel groove gate; a plurality of holes are formed in the channel groove gates; the holes are filled with foam metal and paraffin; the holes and the cooling fins on the cooling cover board are matched with each other and are connected with each other to form an airtight space; a cooling liquid inlet and a cooling liquid outlet are formed in the cooling cold plate, and are communicated with a liquid storage tank through pipelines; and water pumps are arranged on the pipelines.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA
Preparation method of enhanced cooling carbon based composite film
InactiveCN110225691AApplicable coolingImprove cooling effectModifications by conduction heat transferComposite filmHexafluoropropylene
The invention discloses a preparation method of an enhanced cooling carbon based composite film. The method comprises the specific steps of preparing a polyvinylidene fluoride-hexafluoropropylene precursor solution; fixing a graphite film to a flat plate; and applying the precursor solution to the graphite film. The prepared carbon based composite film can be suitable for cooling of a system and equipment, and is particularly suitable for a cooling technology of spacecrafts and cooling of outdoor electronic devices; and the applied polyvinylidene fluoride-hexafluoropropylene precursor solutioncan be combined with the graphite film more easily, and the performances of the precursor solution and the graphite film are not affected.
Owner:NANJING UNIV OF SCI & TECH
Multi-dimensional phase change radiator and manufacturing method thereof
PendingCN111031748AImprove cooling efficiencyImprove heat dissipation uniformityModifications using liquid coolingModifications by conduction heat transferPhysicsCommunications-electronics
Owner:上海合辰科新材料有限公司
Device and method for increasing washing efficiency of catalyst in reactant gas
InactiveCN104548818AImprove washing efficiencyImprove cooling effectUsing liquid separation agentFluidized bedSpray nozzle
The invention relates to a device and a method for increasing the washing efficiency of a catalyst in reactant gas, which are mainly used for solving the problems that the washing efficiency of the catalyst in the reactant gas at the outlet of a fluidized bed reactor for preparing low-carbon olefin with methyl alcohol is low, and catalyst fine powder flows along with the reactant into a follow-up system to block equipment such as a follow-up tower and a heat exchanger and pipelines and shorten the operating cycle of a device. The problems are well solved through the adoption of the technical scheme that the device comprises a housing, a reactant gas inlet, a reactant gas outlet, a reactant gas washing liquid inlet and a catalyst washing liquid outlet, wherein a washing liquid spraying layer, which is formed in such a way that spray nozzles are arranged in a geometrical shape, is arranged at the reactant gas washing liquid inlet and located in the device and above the reactant gas inlet, and reactant gas washing liquid and reactant gas are in countercurrent contact for washing. The device and the method can be used in an industrial device for preparing low-carbon olefin with methyl alcohol.
Owner:CHINA PETROLEUM & CHEM CORP +1
Liquid cooling system for computer chip
ActiveCN104216490AReduce volumeIncrease heat dissipation surfaceDigital data processing detailsNuclear engineeringCooling fluid
The invention discloses a liquid cooling system for a computer chip. Conduction oil with high heat conductivity and low viscosity coefficients is used as cooling liquid; the liquid cooling system comprises a cooling liquid pump, an interface heat collector (cold head), a liquid cooling radiator, a cooling liquid tank, a liquid pipe and the like. According to the liquid cooling system for the computer chip, the conduction oil with high heat conductivity and low viscosity coefficients is used as the cooling liquid, and a novel cooling system is adopted; the cooling performance of the chip is better than the water cooling effect, so that the liquid cooling system can meet the technical requirements on cooling of known high-power and high-integration computer chips and has the application performance which is more practical and reliable than that of a existing model machine adopting the water-based cooling liquid technology and the liquid metal cooling technology.
Owner:SHANGHAI JIAO TONG UNIV
Heat-conducting wave-absorbing patch
ActiveCN112118720AHigh thermal conductivityImprove absorbing performanceMagnetic/electric field screeningAntennasElectro conductivityChemistry
The invention discloses a heat-conducting wave-absorbing patch, and the patch comprises an aluminum honeycomb skeleton and a wave-absorbing medium; the aluminum honeycomb skeleton is provided with a plurality of cavity structures which are periodically arranged, and the cavity structures of the aluminum honeycomb skeleton are filled with the wave-absorbing medium; the aluminum honeycomb skeleton is used for constructing a heat conduction network for heat flow propagation in the heat conduction and wave absorption patch, the wave absorption medium filled in the aluminum honeycomb skeleton is used for absorbing electromagnetic waves, and the propagation constant of the wave absorption medium is regulated and controlled through the size of the cavity structure; in addition, the aluminum honeycomb skeleton has high conductivity, and can absorb electromagnetic waves due to conductivity loss under the action of the electromagnetic waves; the aluminum honeycomb skeleton capable of forming a heat conduction network is embedded into the wave absorbing medium, and the heat conductivity of the composite material is greatly improved through phonon-electron synergistic heat transfer; the wave-absorbing performance of the wave-absorbing medium is further improved by utilizing the regulation and control of the aluminum honeycomb core wall on the propagation constant and reflectivity of the wave-absorbing medium and an electric conduction loss mechanism, and the mechanical property of the heat-conducting wave-absorbing patch is enhanced.
Owner:HUAZHONG UNIV OF SCI & TECH
Sintering heat tube and semiconductor refrigeration refrigerator with same
ActiveCN104654655AImprove cooling effectImprove efficiencyDomestic refrigeratorsEvaporators/condensersEngineeringRefrigeration
The invention relates to a sintering heat tube and a semiconductor refrigeration refrigerator with the same. The sintering heat tube provided by the invention comprises a main tube section, wherein both ends of which are closed. A branch tube section extends from one or each of more parts of one side of the main tube section; the working cavity of each branch tube section communicates with the working cavity of the man tube section. In addition, the invention also provides the semiconductor refrigeration refrigerator with the sintering heat tube. Since the sintering heat tube in the sintering heat tube and a semiconductor refrigeration refrigerator with the same disclosed by the invention is provided with the branch tube sections, compared with the structure of a conventional sintering heat tube extending along a unique route, the structure of the sintering heat tube has remarkable difference, moreover, the heat dissipation or cold transfer efficiency of the sintering heat tube in the invention is increased remarkably, and the sintering heat tube is particularly applicable to the heat dissipation of high-heat flux heat sources such as semiconductor refrigeration plates.
Owner:HAIER SMART HOME CO LTD
Sintered heat pipe and semiconductor refrigeration refrigerator provided with same
ActiveCN104676949AImprove cooling effectImprove efficiencyEvaporators/condensersDomestic refrigeratorsEngineeringSignificant difference
The invention relates to a sintered heat pipe and a semiconductor refrigeration refrigerator provided with the same. The sintered heat pipe comprises a main pipe section with two ends enclosed; a branched pipe section extends from one portion of two sides opposite to the main pipe section or branched pipe sections respectively extend form a plurality of portions of two sides opposite to the main pipe section; the working cavity of each branched pipe section is communicated with the working cavity of the main pipe section. In addition, the invention further provides a semiconductor refrigeration refrigerator provided with the sintered heat pipe. Provided with the branched pipe sections, the sintered heat pipe and the semiconductor refrigeration refrigerator provided with the same have significant differences as compared with a traditional sintered heat pipe extending along a single path, heat dissipation or chill transferring efficiency is obviously improved for the sintered heat pipe, and the sintered heat pipe is especially suitable for heat dissipation of high heat flux of a semiconductor chilling plate and the like.
Owner:HAIER SMART HOME CO LTD
Apparatus and method for removing ammonia in ammoxidation gas
InactiveCN105983313AEfficient removalEven contactDispersed particle separationAir quality improvementFluidized bedProduct gas
The invention relates to an apparatus and method for removing ammonia in ammoxidation gas. The apparatus and method mainly overcome the problem of low removal efficiency of ammonia in reaction gas from an outlet of an ammoxidation fluidized bed reactor in the prior art and the problems of increase of polymerization loss of organic matter, blockage of towers and pipelines and shortening of the operation cycle of equipment after ammonia enters a subsequent system in the prior art. The apparatus provided by the invention comprises a shell, a reaction gas inlet, a reaction gas outlet, a reaction gas neutralizing liquid inlet and a reaction gas neutralizing liquid outlet, wherein the reaction gas neutralizing liquid inlet is provided with spraying layers formed by geometrically arranged nozzles at positions above the reaction gas inlet in the apparatus, distances among the spraying layers gradually increase from bottom to top, an upper inter-spraying layer distance is 1 to 1.5 times of the lower adjacent inter-spraying layer distance, and the reaction gas inlet is provided with a gas distributor. According to the invention, neutralizing liquid and reaction gas are in countercurrent contact, so problems in the prior art are overcome; and the apparatus and method can be applied to an industrial apparatus used for ammoxidation.
Owner:CHINA PETROLEUM & CHEM CORP +1
T-shaped longitudinal micro-channel cold plate with inclined channels
InactiveCN111132521AImprove temperature uniformityWell mixedCooling/ventilation/heating modificationsThermodynamicsEngineering
The invention discloses a T-shaped longitudinal micro-channel cold plate with inclined channels. The micro-channel cold plate comprises a cold plate base plate and a cold plate cover plate. A micro-channel flow channel on the cold plate base plate is longitudinally arranged, a unitization design is achieved, cooling of heat sources of different areas can be achieved by increasing or decreasing thenumber of micro-channel flow channel units, and meanwhile a defect that micro-channels arranged in a conventional transverse series flow mode are poor in temperature uniformity can be overcome. Eachmicro-channel unit is formed by integrating a plurality of single micro-channels, meanwhile, inclined channels with certain angles are arranged on rib walls of the micro-channels to achieve stirring and mixing in different channels, and a boundary layer is broken to strengthen stirring and mixing so as to strengthen heat exchange. The micro-channel cold plate is simple in structure and convenientto machine while achieving a more uniform and efficient micro-channel cold plate heat dissipation function, and can be applied to heat dissipation of high-power electronic devices.
Owner:THE 724TH RES INST OF CHINA SHIPBUILDING IND
Jet flow heat radiationmechanism and jet flow heat radiator
ActiveCN104501646AReduce energy consumptionGood effectHeat transfer modificationMagnetic polesEngineering
The invention discloses a jet flow heat radiation mechanism and a jet flow heat radiator. The jet flow heat radiation mechanism comprises a cavity consisting of an outer shell and a diaphragm, wherein two magnets are fixedly arranged in the cavity at an interval; two magnetic poles with the same magnetism, of the two magnets, are arranged oppositely; an electromagnetic mechanism is arranged between the two magnets; the electromagnetic mechanism can move towards any magnet under the action of the magnetism of the two magnets; a tympanic membrane is fixedly arranged on the electromagnetic mechanism; a first air outlet and a second air outlet for connecting the cavity with the outside are formed in the cavity. The jet flow heat radiation mechanism is simple in structure, low in energy consumption, good in heat radiation effect and low in noise, and is applicable to heat radiators or heat resources of which the heat needs to be radiated. The jet flow heat radiation mechanism is applicable to heat radiation of heat radiators or heat sources of any shape or any size.
Owner:李达
Variable density metal foam radiator
InactiveCN107706161ALarge specific surface areaStrong turbulenceSemiconductor/solid-state device detailsSolid-state devicesEvaporationElectronic chip
A variable density metal foam radiator comprises a heat transfer substrate and through-hole metal foams of different sizes respectively sintered on the heat transfer substrate. The square through-holemetal foams are located in the middle part of the heat transfer substrate, and the annular through-hole metal foams are located in the outer periphery of the square through-hole metal foams and havesmaller pores. According to the invention, the through-hole metal foams with the smaller pores have larger capillary force, as a circulation way to supplement a liquid required for evaporation, the through-hole metal foams with the larger pores are more conducive to the escape of bubbles so that the through-hole metal foams can separate the circulation path of the supplement liquid from the bubbleescape path, the resistance encountered when the bubbles escape is greatly reduced, and thus the boiling heat transfer coefficient is increased. The maximum boiling heat transfer coefficient is 3 times more than that of a smooth copper plate. The boiling initial wall superheat degree is reduced to 2K. The special structure in the invention makes the temperature distribution of the heat transfer substrate more uniform and more suitable for the heat radiation of an electronic chip. Therefore, the heat transfer device of the invention has high heat transfer efficiency and can be widely used in the field of heat radiation of electronic devices.
Owner:SHANGHAI JIAO TONG UNIV
A paraffin-based air-cooled and water-cooled combined heat sink
InactiveCN105097733BIncrease disturbanceImprove heat transfer effectSemiconductor/solid-state device detailsSolid-state devicesParaffin oilsEngineering
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA
A heat-conducting wave-absorbing patch
ActiveCN112118720BImprove absorbing performanceImprove thermal conductivityMagnetic/electric field screeningAntennasAluminum honeycombEngineering
Owner:HUAZHONG UNIV OF SCI & TECH
A computer chip liquid cooling system
ActiveCN104216490BReduce volumeImprove cooling effectDigital data processing detailsWater basedNuclear engineering
The invention discloses a liquid cooling system for a computer chip. Conduction oil with high heat conductivity and low viscosity coefficients is used as cooling liquid; the liquid cooling system comprises a cooling liquid pump, an interface heat collector (cold head), a liquid cooling radiator, a cooling liquid tank, a liquid pipe and the like. According to the liquid cooling system for the computer chip, the conduction oil with high heat conductivity and low viscosity coefficients is used as the cooling liquid, and a novel cooling system is adopted; the cooling performance of the chip is better than the water cooling effect, so that the liquid cooling system can meet the technical requirements on cooling of known high-power and high-integration computer chips and has the application performance which is more practical and reliable than that of a existing model machine adopting the water-based cooling liquid technology and the liquid metal cooling technology.
Owner:SHANGHAI JIAO TONG UNIV
A method of independent partition control suitable for roller-disk cooling bed
ActiveCN106311775BApplicable coolingImprove ventilationCooling bedsMetal rolling arrangementsOperation modeEngineering
The invention discloses a separate sub zone control method applicable to a roll and disc-type cooling bed, belonging to the field of control. The cooling bed is the roll and disc-type cooling bed; the working zone of the whole cooling bed is divided into a plurality of sub zones; the cooling bed is subjected to partitioned detection; the number of steel plates which can be accommodated by each separate zone is calculated by a PLC program according to the width of supplied steel plates; models are set according to material distribution conditions at target zones of the cooling bed and cooling temperature required by the steel plates; and the operation modes of the zones are automatically selected, so that the utilization rate of the cooling bed is improved. By utilizing the device, the steel plates of different cooling models during a thermal treatment process can be simultaneously subjected to classified cooling treatment; the phenomenon of a low utilization rate caused by integral control of a conventional cooling bed can be effectively avoided; the waiting time for the steel plates to be loaded to or unloaded from the cooling bed is reduced; and therefore the steel plates of different specifications can be cooled on the cooling bed according to the respective cooling temperature control models, so that the utilization rate and control flexibility of the cooling bed are greatly improved. The separate sub zone control method can be widely applied to the field of cooling control of the cooling bed during a large-scale continuous production process of a thermal treatment line.
Owner:BAOSHAN IRON & STEEL CO LTD
Miniature efficient self-circulating electronic cooler
InactiveCN100423243CNo noiseCompact structureDigital data processing detailsSemiconductor/solid-state device detailsWorking fluidThermal coefficient
The electronic cooler comprises a micro channel evaporator and a condenser. The said micro channel evaporator possesses a metal base with high thermal coefficient, and micro channels are enclosed base seat arranged along region of the base plane. Micro channels of the evaporator through steam pipe and liquid pipe is connected to the condenser forming a one-way cycle loop in series. The micro channel evaporator is located in space position below the condenser, making working fluid cycle in loop. In the invented cooler, heat quantity of heating electronic component (chip) drives circular flow of working fluid in loop composed of micro channel evaporator, steam pipe, condenser and liquid pipe without need of rotational mechanical pump so as to provide features of compact structure, simple, no noise, small size, high thermal conduction, and good cost performance ratio.
Owner:GUANGZHOU INST OF ENERGY CONVERSION - CHINESE ACAD OF SCI
Ammonia neutralization device
InactiveCN105983317AReduce polymerization lossLow consumption levelDispersed particle separationAir quality improvementChemistryProduct gas
The invention relates to an ammonia neutralization device. The ammonia neutralization device is mainly used for solving the problems in the prior art that the rate of removal of ammonia from reactant gases in an ammonia oxidation reaction is low, the ammonia enters a subsequent system, the polymer loss of organic matters is increased, the clogging to towers and pipelines is caused, and the operation cycle of equipment is shortened. According to the ammonia neutralization device, by adopting the technical scheme that the ammonia neutralization device comprises a shell, a reactant gas inlet, a reactant gas outlet, a reactant gas neutralizing solution inlet and a reactant gas neutralizing solution outlet, a tower plate or filler which is located below the reactant gas neutralizing solution inlet and above the reactant gas inlet is arranged in the ammonia neutralization device, multiple spraying layers which are formed by sprayers in a manner of being distributed in a geometric shape are arranged at the reactant gas neutralizing solution inlet, a reactant gas neutralizing solution is in counter-flow contact with the reactant gases, and a demister is arranged above the reactant gas neutralizing solution inlet, the problems are better solved, and thus the ammonia neutralization device can be applied to an industrial unit for the ammonia oxidation reaction.
Owner:CHINA PETROLEUM & CHEM CORP +1
Ammonia neutralization device and method
ActiveCN105983321AEven contactReduce polymerization lossDispersed particle separationAir quality improvementOrganic matterTower
The invention relates to an ammonia neutralization device and method. The device and the method are mainly used for solving the problems in the prior art that the rate of removal of ammonia from reactant gases in an ammonia oxidation reaction is low, the ammonia enters a subsequent system, the polymer loss of organic matters is increased, the clogging to towers and pipelines is caused, and the operation cycle of equipment is shortened. According to the ammonia neutralization device and method, by adopting the technical scheme that the ammonia neutralization device comprises a shell, a reactant gas inlet, a reactant gas outlet, a reactant gas neutralizing solution inlet and a reactant gas neutralizing solution outlet, a tower plate or filler which is located below the reactant gas neutralizing solution inlet and above the reactant gas inlet is arranged in the ammonia neutralization device, a liquid distributor is arranged at the neutralizing solution inlet, and a reactant gas neutralizing solution is in counter-flow contact with the reactant gases, the problems are better solved, and thus the device and the method can be applied to an industrial unit for the ammonia oxidation reaction.
Owner:CHINA PETROLEUM & CHEM CORP +1
A computer chip liquid cooling immersion structure cooling system
ActiveCN104216492BClose contactImprove the cooling effect of heat exchangeDigital data processing detailsNuclear engineeringInner loop
The invention discloses a computer chip liquid cooling submerged structure heat dissipation system, which comprises a cooling liquid pump, a cooling liquid tank, a liquid cooling radiator, and a liquid pipe, and the cooling liquid pump, the cooling liquid tank, and the liquid cooling radiator are sequentially connected through the liquid pipe , forming a loop; the insulating coolant is used in the loop; the cooling object is placed in the coolant tank. By immersing the cooling object in the cooling liquid, the two are in direct contact with each other, and the contact is close, which greatly improves the effect of heat exchange and cooling.
Owner:SHANGHAI JIAO TONG UNIV
Modular heat radiator for LED lamps
InactiveCN102230604BLess consumablesLight in massPoint-like light sourceLighting heating/cooling arrangementsEngineeringLED lamp
Owner:安徽世纪金元光电有限公司
Combined micro-channel structure
PendingCN113188345AGuaranteed uptimeImprove heat transfer effectHeat exchanger casingsStationary tubular conduit assembliesPhysicsNanofluid
The invention relates to a Y-shape and multi-square combined micro-channel structure, and belongs to the machining field of micro-channel heat dissipation. The combined micro-channel structure comprises a heat dissipation alloy plate, a combined micro-channel structure body and a heating chip. Due to the fact that the design of the channel structure is extremely special, the flow rate and the mixing effect of micro-channel fluid can be promoted, such that the reaction rate of nanofluid in a micro-channel can be guaranteed, and the channel structure has use advantages and characteristics in the field of micro-channel nanofluid heat dissipation. The combined micro-channel structure is simple in structure, flexible in size, easy to implement, not high in manufacturing cost and wide in practicability.
Owner:GUILIN UNIV OF ELECTRONIC TECH
Jet cooling mechanism and jet radiator
ActiveCN104501646BReduce energy consumptionGood effectHeat transfer modificationJet flowElectrical polarity
Owner:李达
Ammonia neutralization device and neutralization method
ActiveCN105983321BEven contactReduce polymerization lossDispersed particle separationAir quality improvementOrganic matterTower
The invention relates to an ammonia neutralization device and method. The device and the method are mainly used for solving the problems in the prior art that the rate of removal of ammonia from reactant gases in an ammonia oxidation reaction is low, the ammonia enters a subsequent system, the polymer loss of organic matters is increased, the clogging to towers and pipelines is caused, and the operation cycle of equipment is shortened. According to the ammonia neutralization device and method, by adopting the technical scheme that the ammonia neutralization device comprises a shell, a reactant gas inlet, a reactant gas outlet, a reactant gas neutralizing solution inlet and a reactant gas neutralizing solution outlet, a tower plate or filler which is located below the reactant gas neutralizing solution inlet and above the reactant gas inlet is arranged in the ammonia neutralization device, a liquid distributor is arranged at the neutralizing solution inlet, and a reactant gas neutralizing solution is in counter-flow contact with the reactant gases, the problems are better solved, and thus the device and the method can be applied to an industrial unit for the ammonia oxidation reaction.
Owner:CHINA PETROLEUM & CHEM CORP +1
Pulsating heat pipe heat-transfer device for low grade heat energy utilization
InactiveCN101818999BLow costImprove heat transfer performanceIndirect heat exchangersTubular elementsThermal energyLower grade
The invention discloses a pulsating heat pipe heat-transfer device for low-grade heat energy utilization. A single-row multi-port flat tube with a plurality of channels is bent into a plurality of layers and after both ends of the flat tube are processed further, different connecting modes can be formed, so that the device works according to the mechanism of an open ended or loop pulsating heat pipe. Moreover, wavy fins can be additionally arranged between two adjacent layers of flat tubes of a cooling section and a heating section of the heat-transfer device as required to reduce the heat transfer resistances of the cooling section and the heating section. When the pulsating heat pipe heat-transfer device is used, heating fluid passes through one end of the device, and cooling fluid passes through the other end of the device, so that utilization of low-grade heat or cooling and heat dissipation is realized. The pulsating heat pipe heat-transfer device provided by the invention has the advantages of compact structure, light weight, low cost, simple manufacturing, good heat-transfer effect and the like.
Owner:CENT SOUTH UNIV
Hollow polygon prism-shaped heat exchanger
ActiveCN114485228AImprove heat transfer efficiencyImprove the heat transfer effect per unit volumeThermoelectric device with peltier/seeback effectSemiconductor/solid-state device detailsEvaporation heat transferEngineering
The hollow polygon prism-shaped heat exchanger comprises a polygon prism main body connected with a heat source, the polygon prism main body is provided with a refrigerant flow channel parallel to the axial direction of the polygon prism main body, and the refrigerant flow channel is filled with foam metal; the polygon prism body is further provided with an inlet allowing refrigerants to flow in and an outlet allowing the refrigerants to flow out, the refrigerants enter the refrigerant flow channel through the inlet, and the refrigerants in the refrigerant flow channel flow out of the refrigerant flow channel through the outlet after heat exchange between the refrigerants in the refrigerant flow channel and a heat source is completed. A through first air channel is formed in the middle of the polygon prism main body and is provided with an axial flow fan; the air guide cover is arranged outside the polygon prism body in a sleeving mode, and a second air channel communicated with the first air channel is formed between the outer wall of the polygon prism body and the inner wall of the air guide cover. According to the heat exchanger, the foam metal is filled in the refrigerant flow channel, the refrigerant is boiled and exchanges heat in the foam metal, meanwhile, the air guide cover and the axial flow fan are integrated, forced convection heat exchange is conducted, and the heat exchange efficiency of the heat exchanger is greatly improved.
Owner:ZHEJIANG UNIV
Sintered heat pipe and semiconductor refrigeration refrigerator with it
ActiveCN104654655BImprove cooling effectImprove efficiencyDomestic refrigeratorsEvaporators/condensersMetallurgyRefrigeration
Owner:HAIER SMART HOME CO LTD
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