31results about How to "Applicable cooling" patented technology

The invention relates to a double-component low-hardness high-heat-conductivity room-temperature-curing organosilicon heat conducting adhesive, belonging to the technical field of electric insulation adhesives for binding and packaging electronic and electric appliance elements. The double-component low-hardness high-heat-conductivity room-temperature-curing organosilicon heat conducting adhesive comprises a component A and a component B, wherein the component A is prepared by mixing the following components in parts by weight: 100 parts of base material and 0.1-0.5 part of platinum catalyst; the component B is prepared by mixing the following components in parts by weight: 100 parts of base material, 0.1-10 parts of terminal-hydrogen-containing silicone oil, 0.1-10 parts of side-hydrogen-containing silicone oil and 0.01-1 part of inhibitor; and the base material is prepared by the following steps: mixing 100 parts by weight of divinyl silicone oil and 800-1500 parts by weight of aluminum oxide, treating with hexamethyldisilazane at 115-125 DEG C, and cooling to room temperature to obtain the base material. The adhesive has the advantages of high heat conductivity (up to 2.5-3.6 W / (m.k)), low hardness and ideal mechanical properties; and the adhesive can be closely combined with the electronic element, and therefore, can be ideally used for heat dissipation of high-power elements.

The invention discloses a preparation method of an enhanced cooling carbon based composite film. The method comprises the specific steps of preparing a polyvinylidene fluoride-hexafluoropropylene precursor solution; fixing a graphite film to a flat plate; and applying the precursor solution to the graphite film. The prepared carbon based composite film can be suitable for cooling of a system and equipment, and is particularly suitable for a cooling technology of spacecrafts and cooling of outdoor electronic devices; and the applied polyvinylidene fluoride-hexafluoropropylene precursor solutioncan be combined with the graphite film more easily, and the performances of the precursor solution and the graphite film are not affected.

The invention relates to a sintering heat tube and a semiconductor refrigeration refrigerator with the same. The sintering heat tube provided by the invention comprises a main tube section, wherein both ends of which are closed. A branch tube section extends from one or each of more parts of one side of the main tube section; the working cavity of each branch tube section communicates with the working cavity of the man tube section. In addition, the invention also provides the semiconductor refrigeration refrigerator with the sintering heat tube. Since the sintering heat tube in the sintering heat tube and a semiconductor refrigeration refrigerator with the same disclosed by the invention is provided with the branch tube sections, compared with the structure of a conventional sintering heat tube extending along a unique route, the structure of the sintering heat tube has remarkable difference, moreover, the heat dissipation or cold transfer efficiency of the sintering heat tube in the invention is increased remarkably, and the sintering heat tube is particularly applicable to the heat dissipation of high-heat flux heat sources such as semiconductor refrigeration plates.

The invention relates to an apparatus and method for removing ammonia in ammoxidation gas. The apparatus and method mainly overcome the problem of low removal efficiency of ammonia in reaction gas from an outlet of an ammoxidation fluidized bed reactor in the prior art and the problems of increase of polymerization loss of organic matter, blockage of towers and pipelines and shortening of the operation cycle of equipment after ammonia enters a subsequent system in the prior art. The apparatus provided by the invention comprises a shell, a reaction gas inlet, a reaction gas outlet, a reaction gas neutralizing liquid inlet and a reaction gas neutralizing liquid outlet, wherein the reaction gas neutralizing liquid inlet is provided with spraying layers formed by geometrically arranged nozzles at positions above the reaction gas inlet in the apparatus, distances among the spraying layers gradually increase from bottom to top, an upper inter-spraying layer distance is 1 to 1.5 times of the lower adjacent inter-spraying layer distance, and the reaction gas inlet is provided with a gas distributor. According to the invention, neutralizing liquid and reaction gas are in countercurrent contact, so problems in the prior art are overcome; and the apparatus and method can be applied to an industrial apparatus used for ammoxidation.

The invention discloses a jet flow heat radiation mechanism and a jet flow heat radiator. The jet flow heat radiation mechanism comprises a cavity consisting of an outer shell and a diaphragm, wherein two magnets are fixedly arranged in the cavity at an interval; two magnetic poles with the same magnetism, of the two magnets, are arranged oppositely; an electromagnetic mechanism is arranged between the two magnets; the electromagnetic mechanism can move towards any magnet under the action of the magnetism of the two magnets; a tympanic membrane is fixedly arranged on the electromagnetic mechanism; a first air outlet and a second air outlet for connecting the cavity with the outside are formed in the cavity. The jet flow heat radiation mechanism is simple in structure, low in energy consumption, good in heat radiation effect and low in noise, and is applicable to heat radiators or heat resources of which the heat needs to be radiated. The jet flow heat radiation mechanism is applicable to heat radiation of heat radiators or heat sources of any shape or any size.

The invention belongs to the technical field of micro-channel heat dissipation, and discloses an air-cooled and water-cooled combined heat dissipation device based on paraffin. The present invention includes a heat dissipation cover plate, the heat dissipation cover plate is equipped with heat dissipation fins, a fan is arranged above the heat dissipation fins, and a heat dissipation cold plate is arranged below the heat dissipation cover plate, The heat dissipation cold plate is provided with a plurality of runner grids, one side of the runner grids is provided with protrusions, and the other side of the runner grids is provided with grooves, and the runner grids are provided with grooves. A plurality of holes are opened, and the holes are filled with metal foam and paraffin, and the holes and the heat dissipation fins on the heat dissipation cover are mutually adapted and connected together to form a sealed space; the heat dissipation cold plate A cooling liquid inlet and a cooling liquid outlet are provided, and the cooling liquid inlet and the cooling liquid outlet are communicated with the liquid storage tank through a pipeline, and a water pump is arranged on the pipeline.

The invention discloses a heat-conducting wave-absorbing patch, which comprises an aluminum honeycomb frame and a wave-absorbing medium; the aluminum honeycomb frame has a plurality of periodically arranged cavity structures, and the wave-absorbing medium is filled in the cavity structure of the aluminum honeycomb frame Middle; the aluminum honeycomb skeleton is used to build a heat conduction network for heat flow propagation in the heat-conducting wave-absorbing patch, and the wave-absorbing medium filled inside the aluminum honeycomb skeleton is used to absorb electromagnetic waves, and the propagation constant of the wave-absorbing medium passes through the cavity structure In addition, the aluminum honeycomb skeleton has high electrical conductivity, and will absorb electromagnetic waves due to conduction loss under the action of electromagnetic waves; the present invention embeds an aluminum honeycomb skeleton that can form a heat conduction network in a wave-absorbing medium, and through phonon-electron collaborative transmission The heat greatly improves the thermal conductivity of the composite material; the control of the propagation constant and reflectivity of the absorbing medium by the aluminum honeycomb core wall and the conductance loss mechanism further improve the absorbing performance of the absorbing medium, and enhance the thermal conductivity of the absorbing patch mechanical properties.

The invention discloses a liquid cooling system for a computer chip. Conduction oil with high heat conductivity and low viscosity coefficients is used as cooling liquid; the liquid cooling system comprises a cooling liquid pump, an interface heat collector (cold head), a liquid cooling radiator, a cooling liquid tank, a liquid pipe and the like. According to the liquid cooling system for the computer chip, the conduction oil with high heat conductivity and low viscosity coefficients is used as the cooling liquid, and a novel cooling system is adopted; the cooling performance of the chip is better than the water cooling effect, so that the liquid cooling system can meet the technical requirements on cooling of known high-power and high-integration computer chips and has the application performance which is more practical and reliable than that of a existing model machine adopting the water-based cooling liquid technology and the liquid metal cooling technology.

The invention discloses a separate sub zone control method applicable to a roll and disc-type cooling bed, belonging to the field of control. The cooling bed is the roll and disc-type cooling bed; the working zone of the whole cooling bed is divided into a plurality of sub zones; the cooling bed is subjected to partitioned detection; the number of steel plates which can be accommodated by each separate zone is calculated by a PLC program according to the width of supplied steel plates; models are set according to material distribution conditions at target zones of the cooling bed and cooling temperature required by the steel plates; and the operation modes of the zones are automatically selected, so that the utilization rate of the cooling bed is improved. By utilizing the device, the steel plates of different cooling models during a thermal treatment process can be simultaneously subjected to classified cooling treatment; the phenomenon of a low utilization rate caused by integral control of a conventional cooling bed can be effectively avoided; the waiting time for the steel plates to be loaded to or unloaded from the cooling bed is reduced; and therefore the steel plates of different specifications can be cooled on the cooling bed according to the respective cooling temperature control models, so that the utilization rate and control flexibility of the cooling bed are greatly improved. The separate sub zone control method can be widely applied to the field of cooling control of the cooling bed during a large-scale continuous production process of a thermal treatment line.

The electronic cooler comprises a micro channel evaporator and a condenser. The said micro channel evaporator possesses a metal base with high thermal coefficient, and micro channels are enclosed base seat arranged along region of the base plane. Micro channels of the evaporator through steam pipe and liquid pipe is connected to the condenser forming a one-way cycle loop in series. The micro channel evaporator is located in space position below the condenser, making working fluid cycle in loop. In the invented cooler, heat quantity of heating electronic component (chip) drives circular flow of working fluid in loop composed of micro channel evaporator, steam pipe, condenser and liquid pipe without need of rotational mechanical pump so as to provide features of compact structure, simple, no noise, small size, high thermal conduction, and good cost performance ratio.

The invention discloses a computer chip liquid cooling submerged structure heat dissipation system, which comprises a cooling liquid pump, a cooling liquid tank, a liquid cooling radiator, and a liquid pipe, and the cooling liquid pump, the cooling liquid tank, and the liquid cooling radiator are sequentially connected through the liquid pipe , forming a loop; the insulating coolant is used in the loop; the cooling object is placed in the coolant tank. By immersing the cooling object in the cooling liquid, the two are in direct contact with each other, and the contact is close, which greatly improves the effect of heat exchange and cooling.

The invention belongs to the technical field of heat radiators, and particularly relates to a heat radiator for radiating the heat of LED lamps. The heat radiator for radiating the heat of LED lamps comprises heat radiating fins and a heat radiating substrate, wherein a row of T-shaped embossments are uniformly distributed on the heat radiating substrate, a heat radiating fin installation groove is formed between two adjacent embossments, the heat radiating fin installation grooves are respectively provided with the heat radiating fins, both sides of openings at the lower parts of heat radiating main bodies of the heat radiating fins respectively stretch outwards to form mounting feet, and the mounting feet are arranged in the heat radiating fin installation grooves. The tops of the heat radiating main bodies of the heat radiating fins are provided with a list of heat radiating holes. Strip heat radiating grooves communicated with the openings at the lower part of the heat radiating main bodies are arranged crosswise and centrally on the heat radiating substrate. The invention has the advantages of small material consumption and light weight because the heat radiating substrate and the heat radiating fins of the hear radiator can be of split structures, and good heat radiating effect of heat radiating holes arranged in the structure and the heat radiating fins, and is applicable for the heat radiation of various LED lamps.

The invention discloses a jet flow heat radiation mechanism and a jet flow heat radiator. The jet flow heat radiation mechanism comprises a cavity consisting of an outer shell and a diaphragm, wherein two magnets are fixedly arranged in the cavity at an interval; two magnetic poles with the same magnetism, of the two magnets, are arranged oppositely; an electromagnetic mechanism is arranged between the two magnets; the electromagnetic mechanism can move towards any magnet under the action of the magnetism of the two magnets; a tympanic membrane is fixedly arranged on the electromagnetic mechanism; a first air outlet and a second air outlet for connecting the cavity with the outside are formed in the cavity. The jet flow heat radiation mechanism is simple in structure, low in energy consumption, good in heat radiation effect and low in noise, and is applicable to heat radiators or heat resources of which the heat needs to be radiated. The jet flow heat radiation mechanism is applicable to heat radiation of heat radiators or heat sources of any shape or any size.

The invention relates to an ammonia neutralization device and method. The device and the method are mainly used for solving the problems in the prior art that the rate of removal of ammonia from reactant gases in an ammonia oxidation reaction is low, the ammonia enters a subsequent system, the polymer loss of organic matters is increased, the clogging to towers and pipelines is caused, and the operation cycle of equipment is shortened. According to the ammonia neutralization device and method, by adopting the technical scheme that the ammonia neutralization device comprises a shell, a reactant gas inlet, a reactant gas outlet, a reactant gas neutralizing solution inlet and a reactant gas neutralizing solution outlet, a tower plate or filler which is located below the reactant gas neutralizing solution inlet and above the reactant gas inlet is arranged in the ammonia neutralization device, a liquid distributor is arranged at the neutralizing solution inlet, and a reactant gas neutralizing solution is in counter-flow contact with the reactant gases, the problems are better solved, and thus the device and the method can be applied to an industrial unit for the ammonia oxidation reaction.

The invention discloses a pulsating heat pipe heat-transfer device for low-grade heat energy utilization. A single-row multi-port flat tube with a plurality of channels is bent into a plurality of layers and after both ends of the flat tube are processed further, different connecting modes can be formed, so that the device works according to the mechanism of an open ended or loop pulsating heat pipe. Moreover, wavy fins can be additionally arranged between two adjacent layers of flat tubes of a cooling section and a heating section of the heat-transfer device as required to reduce the heat transfer resistances of the cooling section and the heating section. When the pulsating heat pipe heat-transfer device is used, heating fluid passes through one end of the device, and cooling fluid passes through the other end of the device, so that utilization of low-grade heat or cooling and heat dissipation is realized. The pulsating heat pipe heat-transfer device provided by the invention has the advantages of compact structure, light weight, low cost, simple manufacturing, good heat-transfer effect and the like.

The invention relates to a sintered heat pipe and a semiconductor refrigeration refrigerator with the same. The invention provides a sintered heat pipe, which comprises a main pipe section with both ends closed. A bifurcated pipe section respectively extends from one or more positions on one side of the main pipe section; the working cavity of each bifurcated pipe section communicates with the working chamber of the main pipe section. In addition, the present invention also provides a semiconductor refrigeration refrigerator with the above-mentioned sintered heat pipe. In the sintered heat pipe of the present invention and its semiconductor refrigeration refrigerator, because the sintered heat pipe has a bifurcated pipe section, its structure is significantly different from that of the existing traditional sintered heat pipe extending along a unique path, and the sintered heat pipe in the present invention is significantly improved. It improves its heat dissipation or cooling efficiency, and is especially suitable for heat dissipation with high heat flux density heat sources such as semiconductor refrigeration chips.