Variable density metal foam radiator

Abstract

A variable density metal foam radiator comprises a heat transfer substrate and through-hole metal foams of different sizes respectively sintered on the heat transfer substrate. The square through-holemetal foams are located in the middle part of the heat transfer substrate, and the annular through-hole metal foams are located in the outer periphery of the square through-hole metal foams and havesmaller pores. According to the invention, the through-hole metal foams with the smaller pores have larger capillary force, as a circulation way to supplement a liquid required for evaporation, the through-hole metal foams with the larger pores are more conducive to the escape of bubbles so that the through-hole metal foams can separate the circulation path of the supplement liquid from the bubbleescape path, the resistance encountered when the bubbles escape is greatly reduced, and thus the boiling heat transfer coefficient is increased. The maximum boiling heat transfer coefficient is 3 times more than that of a smooth copper plate. The boiling initial wall superheat degree is reduced to 2K. The special structure in the invention makes the temperature distribution of the heat transfer substrate more uniform and more suitable for the heat radiation of an electronic chip. Therefore, the heat transfer device of the invention has high heat transfer efficiency and can be widely used in the field of heat radiation of electronic devices.

Description

technical field [0001] The invention relates to a cooling device in the field of electronic devices, in particular to a variable-density metal foam radiator. Background technique [0002] With the development of the electronic industry, the performance of electronic devices is getting higher and higher, and their heating power is also increasing rapidly. The maximum heating power of current electronic chips has exceeded 100W / cm 2 , and is still increasing rapidly. Through-hole metal foam is a kind of high porosity (0.88-0.98), high specific surface area (10000-13000m 2 / m 3 ) porous material, the turbulence ability is very strong, which can greatly enhance the heat effect of gas-liquid phase transformation. Therefore, the use of high-density through-hole metal foam for heat exchange enhancement in the electronic device cooling device can significantly enhance the heat dissipation effect of the electronic device heat exchange device. Contents of the invention [0003] ...

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the disadvantages that the boiling heat transfer effect of the existing through-hole metal foam is not good, and the advantage of the large specific surface area of ​​the through-hole metal foam has not been fully utilized. The advantages of heat transfer, and can make full use of the advantages of large heat transfer specific surface area and strong turbulence ability of high-pore density metal foam, so as to achieve the effect of increasing the overall boiling heat transfer coefficient

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