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Paraffin-based air-cooled and water-cooled combined cooling device

An air-cooled, water-cooled, and heat-dissipating device technology, which is applied to electrical components, electrical solid devices, circuits, etc., can solve the problems of large temperature difference on the wall surface, small amount of refrigerant, and low heat dissipation capacity of the radiator, so as to ensure normal operation and improve life expectancy. Effect

Inactive Publication Date: 2015-11-25
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional air cooling method is increasingly unable to meet the needs of heat dissipation, and among the various technologies of liquid cooling, due to the advantages of simple structure, large heat dissipation, and small amount of refrigerant required to be stored, the microchannel radiator has become a relatively Ideal heat sink for high power microelectronic devices
[0004] The traditional micro-channel heat sink mainly has the following defects, the heat dissipation capacity of the heat sink is low, the wall temperature difference is large, and the temperature distribution is uneven

Method used

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  • Paraffin-based air-cooled and water-cooled combined cooling device

Examples

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Effect test

Embodiment 1

[0039]The paraffin-based air-cooled water-cooled combined heat dissipation device of this embodiment includes a heat dissipation cover plate, the heat dissipation cover plate is equipped with heat dissipation fins, a fan is arranged above the heat dissipation fins, and a heat dissipation cold plate is also included. The heat dissipation cold plate is arranged under the heat dissipation cover plate, and the heat dissipation cover plate is provided with a plurality of runner grids, one side of the runner grids is provided with protrusions, and the other side of the runner grids is There is a groove on one side, and a plurality of holes are opened on the runner grid, and the holes are filled with metal foam and paraffin, and the holes are matched with the heat dissipation fins on the heat dissipation cover plate and They are connected together to form a sealed space; the heat dissipation cold plate is provided with a coolant inlet and a coolant outlet, and the coolant inlet and co...

Embodiment 2

[0041] The paraffin-based air-cooled water-cooled combined heat dissipation device of this embodiment includes a heat dissipation cover plate, the heat dissipation cover plate is equipped with heat dissipation fins, a fan is arranged above the heat dissipation fins, and a heat dissipation cold plate is also included. The heat dissipation cold plate is arranged under the heat dissipation cover plate, and the heat dissipation cover plate is provided with a plurality of runner grids, one side of the runner grids is provided with protrusions, and the other side of the runner grids is There is a groove on one side, and a plurality of holes are opened on the runner grid, and the holes are filled with metal foam and paraffin, and the holes are matched with the heat dissipation fins on the heat dissipation cover plate and Connected together to form a sealed space; the heat dissipation cold plate is provided with a coolant inlet and a coolant outlet, and the coolant inlet and coolant ou...

Embodiment 3

[0043] The paraffin-based air-cooled water-cooled combined heat dissipation device of this embodiment includes a heat dissipation cover plate, the heat dissipation cover plate is equipped with heat dissipation fins, a fan is arranged above the heat dissipation fins, and a heat dissipation cold plate is also included. The heat dissipation cold plate is arranged under the heat dissipation cover plate, and the heat dissipation cover plate is provided with a plurality of runner grids, one side of the runner grids is provided with protrusions, and the other side of the runner grids is There is a groove on one side, and a plurality of holes are opened on the runner grid, and the holes are filled with metal foam and paraffin, and the holes are matched with the heat dissipation fins on the heat dissipation cover plate and Connected together to form a sealed space; the heat dissipation cold plate is provided with a coolant inlet and a coolant outlet, and the coolant inlet and coolant ou...

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Abstract

The invention belongs to the technical field of micro-channel cooling, and discloses a paraffin-based air-cooled and water-cooled combined cooling device. The paraffin-based air-cooled and water-cooled combined cooling device comprises a cooling cover board and a cooling cold plate, wherein cooling fins are arranged on the cooling cover board; a fan is arranged above the cooling fins; the cooling cold plate is arranged under the cooling cover board; a plurality of channel groove gates are arranged on the cooling cold plate; a bump is arranged at one side of each channel groove gate; a groove is formed in the other side of each channel groove gate; a plurality of holes are formed in the channel groove gates; the holes are filled with foam metal and paraffin; the holes and the cooling fins on the cooling cover board are matched with each other and are connected with each other to form an airtight space; a cooling liquid inlet and a cooling liquid outlet are formed in the cooling cold plate, and are communicated with a liquid storage tank through pipelines; and water pumps are arranged on the pipelines.

Description

technical field [0001] The invention belongs to the technical field of microchannel heat dissipation, and in particular relates to a paraffin-based air-cooled and water-cooled combined heat dissipation device, which is mainly used for heat dissipation of intermittent high-power chips. Background technique [0002] In recent years, with the development of microelectronics technology and electronic packaging technology, especially the continuous improvement of the integration of integrated circuits and devices, the operating speed and output power of various electronic components have been continuously improved, and due to the high-density packaging, the heat is distributed in a small area. The surface of the surface poses a great threat to the reliability of electronic products. Studies have shown that about 55% of electronic components are damaged or defective due to excessive temperature. Therefore, efficient thermal design of electronic components is very necessary. [00...

Claims

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Application Information

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IPC IPC(8): H01L23/467H01L23/473
Inventor 杨丽丽徐尚龙李悦闫昆吴益昊胡兴隆
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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