Heat-conducting wave-absorbing patch

Abstract

The invention discloses a heat-conducting wave-absorbing patch, and the patch comprises an aluminum honeycomb skeleton and a wave-absorbing medium; the aluminum honeycomb skeleton is provided with a plurality of cavity structures which are periodically arranged, and the cavity structures of the aluminum honeycomb skeleton are filled with the wave-absorbing medium; the aluminum honeycomb skeleton is used for constructing a heat conduction network for heat flow propagation in the heat conduction and wave absorption patch, the wave absorption medium filled in the aluminum honeycomb skeleton is used for absorbing electromagnetic waves, and the propagation constant of the wave absorption medium is regulated and controlled through the size of the cavity structure; in addition, the aluminum honeycomb skeleton has high conductivity, and can absorb electromagnetic waves due to conductivity loss under the action of the electromagnetic waves; the aluminum honeycomb skeleton capable of forming a heat conduction network is embedded into the wave absorbing medium, and the heat conductivity of the composite material is greatly improved through phonon-electron synergistic heat transfer; the wave-absorbing performance of the wave-absorbing medium is further improved by utilizing the regulation and control of the aluminum honeycomb core wall on the propagation constant and reflectivity of the wave-absorbing medium and an electric conduction loss mechanism, and the mechanical property of the heat-conducting wave-absorbing patch is enhanced.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and more specifically relates to a heat-conducting wave-absorbing patch. Background technique [0002] The wave-absorbing patch is a flexible sheet material with a polymer binder as the matrix and a soft magnetic alloy magnetic powder as the absorber, which has good absorption and shielding functions for electromagnetic noise. Absorbing patches are usually attached to the surface of electromagnetic noise radiation sources (such as chips, flexible circuit boards, etc.) or components that are susceptible to interference (communication modules, etc.), which can effectively solve electromagnetic interference and electromagnetic radiation problems, and are widely used It is used in electronic products and communication equipment such as smart phones, notebook computers, and GPS navigators. [0003] With the advancement of electronic technology, the new generation of electronic components...

AI Technical Summary

Problems solved by technology

This processing scheme usually requires a higher filling amount to make the thermal conductivity of the material meet the industrial requirements. However, an excessively high filling amount will significantly reduce the mechanical properties of the composite material, and greatly deteriorate the processability of the material such as resilience and hardness. Seriously affect the processability

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