Combined micro-channel structure

A technology of microchannel structure and channel structure, which is applied in the direction of fixed tubular conduit components, heat exchange equipment, heat exchanger types, etc., can solve the problems that the heat dissipation performance cannot be fully utilized, the network structure is complicated, and the complexity and other problems

Pending Publication Date: 2021-07-30
GUILIN UNIV OF ELECTRONIC TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Changing the shape, flow direction and flow trend of the microchannel is a common method to improve the design of the microchannel. The pipe can improve its pressure drop and temperature uniformity, but obviously its network structure is relatively complex, first of all, it is not easy to manufacture in the process of production, and secondly, the complexity of this structure leads to the inability to fully exert the heat dissipation performance
This will lead to problems such as low reaction efficiency

Method used

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  • Combined micro-channel structure
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Examples

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Embodiment Construction

[0026] The invention will be described in detail below in conjunction with the accompanying drawings and examples.

[0027] Such as figure 1 As shown, this example discloses a combined microchannel structure including a Y-shaped structure and a multi-square unit structure.

[0028] Such as image 3 Shown, described microchannel structure comprises: microchannel inlet 4, microchannel outlet 10, and some units 9, and described microchannel entrance and exit are Y-shaped, and described several units 9 are square, and the port of structure Y type is all provided with In the opening, several units 9 are first connected in sequence, and together with the Y-shaped entrance and exit constitute the microchannel stated in the present invention.

[0029] Such as image 3 As shown, the long midpoint 8 of one side of the square microchannel matches the rectangular channel 7 and is completely overlapped and connected. By analogy, the long midpoint of one side of the square microchannel w...

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Abstract

The invention relates to a Y-shape and multi-square combined micro-channel structure, and belongs to the machining field of micro-channel heat dissipation. The combined micro-channel structure comprises a heat dissipation alloy plate, a combined micro-channel structure body and a heating chip. Due to the fact that the design of the channel structure is extremely special, the flow rate and the mixing effect of micro-channel fluid can be promoted, such that the reaction rate of nanofluid in a micro-channel can be guaranteed, and the channel structure has use advantages and characteristics in the field of micro-channel nanofluid heat dissipation. The combined micro-channel structure is simple in structure, flexible in size, easy to implement, not high in manufacturing cost and wide in practicability.

Description

technical field [0001] The invention relates to a Y-shaped, multi-square combined microchannel structure, and proposes a novel structure for dissipating heat from the microchannel. Background technique [0002] The micro-channel structure is a type of micro-container used for heat dissipation of electronic components. Different from traditional reactors, this structure is a micro-scale structure that permeates the millimeter level. Within a small range, it has basic functions such as heat exchange, cooling, and heat dissipation. Because these microchannel structures are used for heat dissipation, the requirements for size and size ratio are more prominent. [0003] Changing the shape, flow direction and flow trend of the microchannel is a common method to improve the design of the microchannel. The pipe can improve its pressure drop and temperature uniformity, but obviously its network structure is relatively complex, firstly, it is not easy to manufacture in process produ...

Claims

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Application Information

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IPC IPC(8): F28D7/00F28F9/22
CPCF28D7/00F28F9/22
Inventor 尚玉玲谢文强李春泉郭文杰韦淞译胡为何翔曾丽云
Owner GUILIN UNIV OF ELECTRONIC TECH
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