Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A computer chip liquid cooling immersion structure cooling system

A cooling system and computer technology, applied in computing, instruments, electrical and digital data processing, etc., can solve problems such as bottlenecks, and achieve the effect of low noise, tight contact and low noise in the working medium

Active Publication Date: 2018-03-06
SHANGHAI JIAO TONG UNIV
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there have been a large number of research reports and practical application of coolants, mainly water-based coolants and liquid metal coolants, but there are still serious bottlenecks in meeting product application requirements.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A computer chip liquid cooling immersion structure cooling system
  • A computer chip liquid cooling immersion structure cooling system
  • A computer chip liquid cooling immersion structure cooling system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Such as Figure 1-Figure 3 Shown are schematic diagrams of three different structures of the computer chip liquid cooling immersion structure heat dissipation system of the present invention. The heat dissipation system is placed in the chassis, including the coolant pump 1, the coolant tank 2, and the condenser pipe 3, and the three are connected in sequence through the liquid pipe to form a loop. In this embodiment, the condenser pipe 3 is used as the liquid cooling radiator , can also use heat sink or similar rib structure (which can effectively increase the heat dissipation surface) as a liquid cooling radiator. At the same time, the above structure can further expand the heat dissipation surface by contacting with the chassis wall, and can also be equipped with a fan Air cool the radiator. The insulating heat transfer oil 4 is used as the cooling liquid in the loop of the system, but it is not limited to the use of heat transfer oil, and other cooling liquids with...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a computer chip liquid cooling submerged structure heat dissipation system, which comprises a cooling liquid pump, a cooling liquid tank, a liquid cooling radiator, and a liquid pipe, and the cooling liquid pump, the cooling liquid tank, and the liquid cooling radiator are sequentially connected through the liquid pipe , forming a loop; the insulating coolant is used in the loop; the cooling object is placed in the coolant tank. By immersing the cooling object in the cooling liquid, the two are in direct contact with each other, and the contact is close, which greatly improves the effect of heat exchange and cooling.

Description

technical field [0001] The invention relates to the technical field of computer chip liquid cooling and heat dissipation, in particular to a computer chip liquid cooling immersion structure heat dissipation system. Background technique [0002] In recent years, the key problem of thermal barrier of highly integrated computer chips has become one of the technical bottlenecks restricting its sustainable development. At present, the mainstream technology development direction to solve the heat dissipation of computer chips is to develop liquid cooling methods, and use coolant to enhance the heat dissipation effect of chips. Specifically, a structure such as an interface heat collector (cold head) is added to the heating chip, and the cooling liquid flows through the cold head to take away heat, thereby achieving the purpose of cooling. [0003] At present, there have been a large number of research reports and practical application of cooling fluids, mainly water-based cooling...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
Inventor 张亚非王楠赵波苏言杰张耀中
Owner SHANGHAI JIAO TONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com