Double-component low-hardness high-heat-conductivity room-temperature-curing organosilicon heat conducting adhesive

Abstract

The invention relates to a double-component low-hardness high-heat-conductivity room-temperature-curing organosilicon heat conducting adhesive, belonging to the technical field of electric insulation adhesives for binding and packaging electronic and electric appliance elements. The double-component low-hardness high-heat-conductivity room-temperature-curing organosilicon heat conducting adhesive comprises a component A and a component B, wherein the component A is prepared by mixing the following components in parts by weight: 100 parts of base material and 0.1-0.5 part of platinum catalyst; the component B is prepared by mixing the following components in parts by weight: 100 parts of base material, 0.1-10 parts of terminal-hydrogen-containing silicone oil, 0.1-10 parts of side-hydrogen-containing silicone oil and 0.01-1 part of inhibitor; and the base material is prepared by the following steps: mixing 100 parts by weight of divinyl silicone oil and 800-1500 parts by weight of aluminum oxide, treating with hexamethyldisilazane at 115-125 DEG C, and cooling to room temperature to obtain the base material. The adhesive has the advantages of high heat conductivity (up to 2.5-3.6 W / (m.k)), low hardness and ideal mechanical properties; and the adhesive can be closely combined with the electronic element, and therefore, can be ideally used for heat dissipation of high-power elements.

Description

technical field [0001] The invention belongs to the technical field of insulating adhesives for bonding and packaging electronic and electrical components, and in particular relates to a two-component, low-hardness, high-thermal-conduction, room-temperature-curing silicone heat-conducting adhesive. Background technique [0002] With the rapid development of integrated circuit technology and assembly technology in the electronics industry, the volume of electronic components and their circuits tends to be miniaturized, so the requirements for the insulation performance, thermal conductivity and heat resistance of bonding and packaging materials are getting higher and higher. It is getting higher and higher, thus promoting the development process of this type of adhesive in the industry, and there is no shortage of technical information about thermal conductive adhesives for electronic components in the published Chinese patent documents. [0003] Invention Patent Publication ...

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Problems solved by technology

[0003] Invention Patent Publication No. CN1970666A recommends "thermally conductive glue". Although the patent application scheme has its famous thermal conductivity, it only uses polymers (polyols or inert polydimethylsiloxane) and thermally conductive fillers such as Thermally conductive powder (thermally conductive powder is silver, gold, copper, nickel, aluminum, aluminum oxide, zinc oxide, boron nitride, bauxite, graphite and / or carbon black) mixed, so the polymer does not form a cross-linked structure, in the long-term When in use, the polymer will slowly separate from the thermally conductive filler (the industry is accustomed to call this separation oil seepage), causing the outside air to enter the glue, and because air is a poor conductor of heat, it is not conducive to the heat diffusion of the thermally conductive glue.

[0004] Invention patent authorization announcement number CN100491490C provides "low-viscosity thermally conductive adhesive and its preparation method", publication number CN102220103A discloses "a low-viscosity thermally conductive adhesive for LED chips" and publication number CN102504707A discloses "a fast-curing thermally and its preparation method”, the first two of these three patented technologies are epoxy resin thermally conductive adhesives, and the latter one is acrylic resin thermally conductive adhesives. Due to the limitations of materials in these three patents, it is difficult to obtain ideal Temperature resistance, it is prone to aging and cracking when used for a long time in a high temperature environment

[0005] Invention Patent Publication No. CN102352213A published "Organosilicon thermally conductive adhesive for high-power LED lighting and its preparation method". No corrosion and other advantages, but the solvent, namely methanol, will be released during the curing process, and there are tiny pores inside the adhesive after curing, which is not conducive to heat dissipation. In addition, the hardness of this thermally conductive adhesive is too high

According to the thermal resistance calculation formula R=L / K+R 1 +R 2 (Where R represents the thermal resistance, L represents the thickness of the thermally conductive adhesive, K represents the thermal conductivity of the thermally conductive adhesive, R1 represents the interface thermal resistance between the electronic components that generate heat and the thermally conductive adhesive, R2 represents the interface between the thermally conductive adhesive and the heat sink thermal resistance), the thermal conductive adhesive is not only related to the thermal conductivity of the material in practical application, but also related to the thermal resistance of the thermal conductive material and the interface. Therefore, if the hardness of the adhesive is too high, the gap between the adhesive and the heat dissipation components will be The larger the interface thermal resistance will be, the lower it will affect the heat dissipation effect

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