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Sintered heat pipe and semiconductor refrigeration refrigerator with it

A technology for sintering heat pipes and semiconductors, which is applied in refrigerators, refrigeration components, household refrigerators, etc., can solve the problems of ineffective sintering heat pipes, and achieve the effect of improving heat dissipation or cooling efficiency

Active Publication Date: 2016-11-23
HAIER SMART HOME CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing sintered heat pipes may not be able to achieve the desired effect for heat sources with high heat flux density such as semiconductor refrigeration chips

Method used

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  • Sintered heat pipe and semiconductor refrigeration refrigerator with it
  • Sintered heat pipe and semiconductor refrigeration refrigerator with it
  • Sintered heat pipe and semiconductor refrigeration refrigerator with it

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] figure 1 is a schematic structural diagram of a sintered heat pipe according to an embodiment of the present invention. Such as figure 1 shown, and refer to figure 2 , the embodiment of the present invention provides a sintered heat pipe 200 with a novel structure, which has high heat dissipation or cooling efficiency, can be applied to various heat exchange devices, and is especially suitable for heat sources with high heat flux such as semiconductor refrigeration chips 150 To dissipate heat. Specifically, the sintered heat pipe 200 may include a main pipe section 210 with both ends closed. In particular, a bifurcated pipe section 220 extends from one or more positions on one side of the main pipe section 210 to improve the heat dissipation or cooling efficiency of the sintered heat pipe 200 . The working chamber 230 of each bifurcated pipe section 220 can communicate with the working chamber 230 of the main pipe section 210 to facilitate the flow of steam in the ...

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Abstract

The invention relates to a sintered heat pipe and a semiconductor refrigeration refrigerator with the same. The invention provides a sintered heat pipe, which comprises a main pipe section with both ends closed. A bifurcated pipe section respectively extends from one or more positions on one side of the main pipe section; the working cavity of each bifurcated pipe section communicates with the working chamber of the main pipe section. In addition, the present invention also provides a semiconductor refrigeration refrigerator with the above-mentioned sintered heat pipe. In the sintered heat pipe of the present invention and its semiconductor refrigeration refrigerator, because the sintered heat pipe has a bifurcated pipe section, its structure is significantly different from that of the existing traditional sintered heat pipe extending along a unique path, and the sintered heat pipe in the present invention is significantly improved. It improves its heat dissipation or cooling efficiency, and is especially suitable for heat dissipation with high heat flux density heat sources such as semiconductor refrigeration chips.

Description

technical field [0001] The invention relates to a sintered heat pipe, in particular to a sintered heat pipe and a semiconductor refrigeration refrigerator with the sintered heat pipe. Background technique [0002] Sintered heat pipe is a high-efficiency heat transfer element, which transfers heat through the phase change process of evaporation and condensation of liquid in a fully enclosed vacuum tube, with extremely high thermal conductivity and excellent isothermal properties. The sintered heat pipe is composed of a tube shell, a liquid-absorbing core and an end cover. After pumping the inside of the tube into a negative pressure of 1.3×(10 minus 1-10 minus 4) Pa, it is filled with an appropriate amount of working liquid, so that the liquid-absorbing core close to the inner wall of the tube The capillary porous material is filled with liquid and then sealed. One end of the tube is the evaporating section (heating section), and the other end is the condensing section (cool...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B21/02F28D15/02F25D11/00
CPCF25B21/02F25D11/00F28D15/02F25B2321/02F25B39/00F28D15/0233F28D15/046F28F2255/18F28D15/0266F25B39/04F25D3/005
Inventor 陶海波张奎刘建如李鹏李春阳戚斐斐姬立胜
Owner HAIER SMART HOME CO LTD
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