Miniature efficient self-circulating electronic cooler

Abstract

The electronic cooler comprises a micro channel evaporator and a condenser. The said micro channel evaporator possesses a metal base with high thermal coefficient, and micro channels are enclosed base seat arranged along region of the base plane. Micro channels of the evaporator through steam pipe and liquid pipe is connected to the condenser forming a one-way cycle loop in series. The micro channel evaporator is located in space position below the condenser, making working fluid cycle in loop. In the invented cooler, heat quantity of heating electronic component (chip) drives circular flow of working fluid in loop composed of micro channel evaporator, steam pipe, condenser and liquid pipe without need of rotational mechanical pump so as to provide features of compact structure, simple, no noise, small size, high thermal conduction, and good cost performance ratio.

Description

technical field [0001] The invention relates to a heat radiation cooling device for electronic components, in particular to a heat radiation cooling device for high heat flux density electronic components. Background technique [0002] In recent years, with the development of high-tech information industry, people are eager to speed up the research on "thermal management" technology. One of the reasons is that the integration degree of electronic circuits has been greatly improved, and the heat generation has increased. The second is that the high-tech industry is improving. At the same time of integration, advanced and compact electronic packaging technology is also being developed. The above two reasons have greatly improved the heat flux. [0003] In electronic cooler products, typical traditional products such as radiators and fans can no longer meet the current cooling needs of electronic components. Therefore, electronic cooler products with micro heat pipes and capill...

AI Technical Summary

Problems solved by technology

[0003] In electronic cooler products, typical traditional products such as radiators and fans can no longer meet the current cooling needs of electronic components. Therefore, electronic cooler products with micro heat pipes and capillary pump circuits have begun to appear.

The advantage of micro heat pipe and capillary pump circuit is that it belongs to passive cooling, but the heat flux that can be removed is still relatively low when using heat pipe and micro heat pipe technology to solve the heat dissipation problem of laptop computer CPU chips, communication base stations, and high-power electronic components.

The use of coolers that require mechanical components such as pumps and fans has disadvantages such as complicated equipment, low reliability, pipeline connectors, valves, etc., occupying a large volume of space, and high operation and maintenance costs.

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