A heat-conducting wave-absorbing patch

A wave-absorbing patch and wave-absorbing filler technology, which is applied in antennas, electrical components, magnetic field/electric field shielding, etc., can solve the problems of material machinability such as the deterioration of resilience hardness, the decline of mechanical properties of composite materials, and the impact on processability, etc.

Active Publication Date: 2021-09-14
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This processing scheme usually requires a higher filling amount to make the thermal conductivity of the material meet the industrial requirements. However, an excessively high filling amount will significantly reduce the mechanical properties of the composite material, and greatly deteriorate the processability of the material such as resilience and hardness. Seriously affect the processability

Method used

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  • A heat-conducting wave-absorbing patch
  • A heat-conducting wave-absorbing patch
  • A heat-conducting wave-absorbing patch

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Embodiment Construction

[0024] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0025] A heat-conducting wave-absorbing patch provided by the present invention includes an aluminum honeycomb skeleton and a wave-absorbing medium; wherein, the aluminum honeycomb skeleton has a plurality of periodically arranged honeycomb units, and the honeycomb units are cavity structures filled with wave-absorbing medium In each cavity structure; in the heat-conducting wave-absorbing patch,...

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Abstract

The invention discloses a heat-conducting wave-absorbing patch, which comprises an aluminum honeycomb frame and a wave-absorbing medium; the aluminum honeycomb frame has a plurality of periodically arranged cavity structures, and the wave-absorbing medium is filled in the cavity structure of the aluminum honeycomb frame Middle; the aluminum honeycomb skeleton is used to build a heat conduction network for heat flow propagation in the heat-conducting wave-absorbing patch, and the wave-absorbing medium filled inside the aluminum honeycomb skeleton is used to absorb electromagnetic waves, and the propagation constant of the wave-absorbing medium passes through the cavity structure In addition, the aluminum honeycomb skeleton has high electrical conductivity, and will absorb electromagnetic waves due to conduction loss under the action of electromagnetic waves; the present invention embeds an aluminum honeycomb skeleton that can form a heat conduction network in a wave-absorbing medium, and through phonon-electron collaborative transmission The heat greatly improves the thermal conductivity of the composite material; the control of the propagation constant and reflectivity of the absorbing medium by the aluminum honeycomb core wall and the conductance loss mechanism further improve the absorbing performance of the absorbing medium, and enhance the thermal conductivity of the absorbing patch mechanical properties.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and more specifically relates to a heat-conducting wave-absorbing patch. Background technique [0002] The wave-absorbing patch is a flexible sheet material with a polymer binder as the matrix and a soft magnetic alloy magnetic powder as the absorber, which has good absorption and shielding functions for electromagnetic noise. Absorbing patches are usually attached to the surface of electromagnetic noise radiation sources (such as chips, flexible circuit boards, etc.) or components that are susceptible to interference (communication modules, etc.), which can effectively solve electromagnetic interference and electromagnetic radiation problems, and are widely used It is used in electronic products and communication equipment such as smart phones, notebook computers, and GPS navigators. [0003] With the advancement of electronic technology, the new generation of electronic components...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00H01Q17/00
CPCH01Q17/00H05K9/0081
Inventor 王鲜汪旭文龚韦龚荣洲
Owner HUAZHONG UNIV OF SCI & TECH
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