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Liquid cooling system for computer chip

A heat dissipation system and computer technology, applied in computing, instruments, electrical digital data processing, etc., can solve the problems of high flow pipeline requirements, overheating and burning of devices, and high price, and achieve the expansion of heat dissipation surface, low noise of working medium, and wide application area wide effect

Active Publication Date: 2014-12-17
SHANGHAI JIAO TONG UNIV
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  • Description
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Problems solved by technology

There have been a large number of research reports on water-based coolant technology and liquid metal heat dissipation technology, and some progress has been made in the experimental research and application of chip cooling, but there are still serious bottlenecks in meeting product application requirements. For example: water-based coolant is mainly The boiling point is low, and bubbles will be generated at the heat exchange interface, which will evaporate and cause heat loss and heat resistance, which will lead to corrosion and overheating of the device. In addition, it is not conducive to miniaturization. When the temperature is below zero, it will freeze and expand; while the liquid state Alternative materials for metal cooling liquid are very scarce. Gallium, which is expensive and scarce in resources, is the main cooling liquid component. When the temperature is lower than the melting point of gallium (29.77°C), it will phase-transform into a solid and expand, thus affecting the flow of the pipeline. The requirements are extremely high, and its reliability needs to be improved

Method used

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  • Liquid cooling system for computer chip

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Embodiment Construction

[0026] Such as figure 1 Shown is a structure diagram of a liquid cooling system based on the present invention. The system includes a coolant pump, an interface heat collector (cold head), a liquid-cooled radiator, and a coolant tank. The arrow lines in the figure indicate the liquid pipes that connect the above components. The coolant tank is used to store coolant, and driven by the coolant pump, the coolant circulates in the system along the direction of the arrow in the figure. The cooling pump preferably adopts a double-cavity parallel piezoelectric pump or an electrostatically driven silent pump. The interface heat collector is in direct contact with objects that need to be cooled, such as CPU, motherboard, memory, graphics card, and so on. The shape and size of the interface heat collector and the fixing method match the object that needs to be cooled. For example, for the CPU, the shape and size of the corresponding CPU cold head need to match the chip area of ​​the C...

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Abstract

The invention discloses a liquid cooling system for a computer chip. Conduction oil with high heat conductivity and low viscosity coefficients is used as cooling liquid; the liquid cooling system comprises a cooling liquid pump, an interface heat collector (cold head), a liquid cooling radiator, a cooling liquid tank, a liquid pipe and the like. According to the liquid cooling system for the computer chip, the conduction oil with high heat conductivity and low viscosity coefficients is used as the cooling liquid, and a novel cooling system is adopted; the cooling performance of the chip is better than the water cooling effect, so that the liquid cooling system can meet the technical requirements on cooling of known high-power and high-integration computer chips and has the application performance which is more practical and reliable than that of a existing model machine adopting the water-based cooling liquid technology and the liquid metal cooling technology.

Description

technical field [0001] The invention relates to the technical field of computer chip heat dissipation, in particular to a liquid cooling heat dissipation system. Background technique [0002] In recent years, the key problem of thermal barrier of highly integrated computer chips has become one of the technical bottlenecks restricting its sustainable development. At present, the mainstream technology development direction to solve the high-power consumption and high-density heat dissipation of computer chips is to develop liquid cooling methods, and use coolant to enhance the heat dissipation effect of chips. There have been a large number of research reports on water-based coolant technology and liquid metal heat dissipation technology, and some progress has been made in the experimental research and application of chip cooling, but there are still serious bottlenecks in meeting product application requirements. For example: water-based coolant is mainly The boiling point i...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 张亚非姜国华杨志赵波苏言杰
Owner SHANGHAI JIAO TONG UNIV
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