A paraffin-based air-cooled and water-cooled combined heat sink

Abstract

The invention belongs to the technical field of micro-channel heat dissipation, and discloses an air-cooled and water-cooled combined heat dissipation device based on paraffin. The present invention includes a heat dissipation cover plate, the heat dissipation cover plate is equipped with heat dissipation fins, a fan is arranged above the heat dissipation fins, and a heat dissipation cold plate is arranged below the heat dissipation cover plate, The heat dissipation cold plate is provided with a plurality of runner grids, one side of the runner grids is provided with protrusions, and the other side of the runner grids is provided with grooves, and the runner grids are provided with grooves. A plurality of holes are opened, and the holes are filled with metal foam and paraffin, and the holes and the heat dissipation fins on the heat dissipation cover are mutually adapted and connected together to form a sealed space; the heat dissipation cold plate A cooling liquid inlet and a cooling liquid outlet are provided, and the cooling liquid inlet and the cooling liquid outlet are communicated with the liquid storage tank through a pipeline, and a water pump is arranged on the pipeline.

Description

Technical field [0001] The invention belongs to the technical field of micro-channel heat dissipation, and specifically relates to a paraffin-based air-cooled water-cooled combined heat dissipation device, which is mainly applied to heat dissipation of intermittent high-power chips. Background technique [0002] In recent years, with the development of microelectronics technology and electronic packaging technology, especially the continuous improvement of the integration of integrated circuits and devices, the operating speed and output power of various electronic components have been continuously improved, and due to the high-density packaging, the heat is distributed in a small area. The surface of electronic products poses a great threat to the reliability of electronic products. Studies have shown that about 55% of electronic components are damaged or defective due to excessive temperature. Therefore, high-efficiency thermal design for electronic components is very necessary...

AI Technical Summary

Problems solved by technology

The traditional air cooling method is increasingly unable to meet the needs of heat dissipation, and among the various technologies of liquid cooling, due to the advantages of simple structure, large heat dissipation, and small amount of refrigerant required to be stored, the microchannel radiator has become a relatively Ideal heat sink for high power microelectronic devices

[0004] The traditional micro-channel heat sink mainly has the following defects, the heat dissipation capacity of the heat sink is low, the wall temperature difference is large, and the temperature distribution is uneven

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