Large-power modular power supply and cooling structure thereof

Abstract

The invention relates to a large-power modular power supply and a cooling structure thereof. The large-power modular power supply comprises a shell, a circuit board, an electric input connector, an electric output connector and a cooling structure, wherein the shell is internally provided with a containing space for containing the circuit board which is connected with external equipment through the electric input connector and the electric output connector which are arranged on the shell, the cooling structure comprises a liquid cooling passage, an input port connector and an output port connector, the liquid cooling passage is integrally formed in the shell for cooling liquid to flow by, and the input port connector and the output port connector which are arranged on the shell and respectively and hermetically connected with both ends of the liquid cooling passage. The invention can remarkably save the mounting space, is convenient to process and maintain and has favorable cooling effect.

Description

technical field [0001] The invention relates to the field of power supplies, more specifically, to a high-power module power supply and its heat dissipation structure. Background technique [0002] Modular power supply is a power supply function component that can be directly mounted or installed on a printed circuit board through a connector to supply power to various loads in various electronic devices, which can greatly simplify electronic application systems. power supply design. Because the module power supply has the advantages of high efficiency, small size, convenient and flexible use, stable performance, and reliability, it has become an indispensable power supply solution for all walks of life, especially for high-end electronic products. [0003] With the continuous progress in technology and technology of products in various application fields of the electronics industry, higher requirements are constantly put forward for power supply performance indicators. Fo...

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Problems solved by technology

Liquid cooling needs to arrange heat-carrying fluid pipes inside or outside the module power supply. This kind of process structure using discrete pipes will inevitably lead to more installation space occupied by heat dissipation pipes and corresponding port components, not only the volume of the module power supply becomes larger , and the pipeline layout, shaping, welding, and assembly construction technology requirements are very high, the corresponding maintenance work is also relatively complicated, and the leakage prevention is also very difficult. These problems are more serious in the power supply system that needs to be composed of multiple high-power module power supplies protrude

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