High-efficiency electronic component heat dissipation device

A technology for electronic components and cooling devices, which is applied in the field of high-efficiency cooling devices for electronic components, can solve problems such as insufficient heat dissipation, increased thickness of circuit boards, and influence on installation, so as to increase flexibility, reduce thickness, and reduce installation difficulty Effect
CN110430733AActive Publication Date: 2019-11-08盐城市钊扬工业设计有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
盐城市钊扬工业设计有限公司
Publication Date
2019-11-08

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Abstract

The invention discloses a high-efficiency electronic component heat dissipation device, which comprises a heat dissipation box and an electronic component. A fan box is mounted on an upper end of theheat dissipating box; a fan is installed in the fan box; three anti-dust meshes are embedded in the upper top wall of the fan box; and the heat dissipation box is divided into a condensation chamber,a heat absorption chamber, a return chamber, a heating chamber and a heat conduction module chamber from the top to bottom in sequence, wherein the condensation chamber is internally equipped with a condensing and cooling mechanism. The high-efficiency electronic component heat dissipation device is reasonable in structural design; through a condensation heat dissipation pipe, the fan, the heat absorption chamber and the return chamber, a condensation return structure is formed, and circulating heat dissipation can be realized; the fan can be fixedly arranged on the side surface, thereby reducing the thickness of the heat dissipation device and reducing installation difficulty; graphite heat conducting sheets and flexible graphite connecting sheets can be attached to the surface of any electronic component, thereby increasing applicability and targeted performance of the device; and a heat conduction module can select suitable flexible graphite connecting sheets according to the numberof electronic components needing heat dissipating, thereby reducing energy consumption.
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Description

technical field

[0001] The invention relates to the field of heat dissipation of electronic components, in particular to an efficient heat dissipation device for electronic components. Background technique

[0002] Electronic components are components of electronic components and small electrical machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as electrical appliances, radios, and instruments, such as capacitors and transistors. The general term for sub-components such as springs, hairsprings, and springs. Usually on the circuit board, you can see a variety of electronic components welded on the board. Electronic components need to be powered during use, and electronic components have Internal resistance, with internal resistance, heat will be generated after power-on. Some electronic components have small internal resistance, and the heat generated after power-on is ...

Claims

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