A high-efficiency heat dissipation device for electronic components

A technology for electronic components and heat dissipation devices, applied in the field of efficient heat dissipation devices for electronic components, can solve the problems of insufficient heat dissipation, affecting installation, and increasing the thickness of circuit boards, so as to increase flexibility, reduce installation difficulty, and reduce thickness. Effect
CN110430733BActive Publication Date: 2020-11-20CHONGQING JINGBIAO ELECTRONIC TECH CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Patents(China)
Current Assignee / Owner
CHONGQING JINGBIAO ELECTRONIC TECH CO LTD
Publication Date
2020-11-20

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Abstract

The invention discloses an efficient heat dissipation device for an electronic component. The efficient heat dissipation device comprises a heat dissipation box and electronic components, wherein a fan box is installed at the upper end of the heat dissipation box, a fan is installed in the fan box, a third dustproof net is embedded in the upper top wall of the fan box, the heat dissipation box issequentially divided into a condensation cavity, a heat absorption cavity, a reflux cavity, a heating cavity and a heat conduction module cavity from top to bottom, and a condensation and heat dissipation mechanism is installed in the condensation cavity. According to the invention, the device is reasonable in structural design; a condensation and reflux structure is formed by a condensation and heat dissipation pipe, a fan, a heat absorption cavity and a reflux cavity, so that heat dissipation can be circulated; the fan can be fixed on the side surface, so that the thickness of the heat dissipation device is reduced, and the installation difficulty is reduced; a graphite heat conduction sheet and a flexible graphite connecting sheet can be connected and attached to the surface of any electronic component, so that the applicability and pertinence of the device are improved; and a heat conduction module block can select the proper flexible graphite connecting sheets according to the number of electronic components needing heat dissipation, so that energy losses are reduced.
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Description

technical field

[0001] The invention relates to the field of heat dissipation of electronic components, in particular to an efficient heat dissipation device for electronic components. Background technique

[0002] Electronic components are components of electronic components and small electrical machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as electrical appliances, radios, and instruments, such as capacitors and transistors. The general term for sub-components such as springs, hairsprings, and springs. Usually on the circuit board, you can see a variety of electronic components welded on the board. Electronic components need to be powered during use, and electronic components have Internal resistance, with internal resistance, heat will be generated after power-on. Some electronic components have small internal resistance, and the heat generated after power-on is ...

Claims

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