The invention discloses a heat dissipation method of an LED (light-emitting
diode) device, which comprises the following steps of: conducting the heat of the LED device into a
phase change material which emits heat with the external environment. The invention also discloses a
heat sink of the LED device; the
heat sink comprises a
metal shell, a heat dissipation
baseboard and a heat-conducting fin, wherein the
metal shell is internally filled with the
phase change material, and the heat dissipation
baseboard is connected with the
metal shell by the heat-conducting fin. The invention also discloses another
heat sink of the LED device; the heat sink comprise the metal shell, the heat dissipation
baseboard, a
heat pipe and a metal outer cover, wherein the metal shell and the metal outer cover are internally filled with the
phase change material, and the heat dissipation baseboard is connected with the metal shell by the
heat pipe. The phase change materials of the invention is a
composite phase change material of an
organic matter and an inorganic metal, has faster heat response rate and heat storage capacity, can rapidly absorb the heat generated by the LED device, and controls the
junction temperature of the LED device to be within 60 DEG C, thereby avoiding the luminous decay phenomenon caused by the overheating of the LED device and prolonging the service life of the LED device.