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80results about How to "Reduce overall thickness" patented technology

Fabricated invisible-beam floor plate

InactiveCN108385885AOvercoming construction techniquesReduce overall thicknessFloorsFloor plateRebar
The invention provides a fabricated invisible-beam floor plate, and belongs to the field of components of buildings. The invisible-beam floor plate is an integral module formed by beams whose web plates are provided with holes and a reinforced concrete floor plate, wherein the beams which are well prefabricated in a factory are firstly used as borders of the integral module of a beam plate; precast concrete is poured at the bottoms of the beams; afterwards, pipelines can be freely laid on precast concrete layers; the pipelines among different plate blocks pass through the holes of the web plates of the beams; lightweight concrete is poured after the laying is completed. According to the invisible-beam floor plate, through the integration of the beam plate, on the premise that the bearing capacity is not decreased, the integral thickness of the beam plate is decreased; the clear space of a building is improved; the space is arranged more flexibly; upper and lower flanges of the beams are all embedded in the concrete of the floor plate; on one hand, the local stableness of a component can be improved by the concrete reserved around the beams, and on the other hand, the fireproof andanticorrosive problems of a steel structural beam are relieved to a certain extent; the personalized layouts of the pipelines are facilitated by the ways that the web plates are provided with the holes and the floor plates are hierarchically poured, and the later maintenance and modification are convenient.
Owner:BEIJING UNIV OF TECH

Novel offset printing and hot stamping technique

A novel offset printing and hot stamping technique sequentially includes: (1) feeding articles to be printed to printing color cells of an offset printing press sequentially and printing with ultraviolet curing ink, wherein one or more printing color cells are utilized to perform full oil printing, and positions, required to be hot stamped, on full oil printing surfaces are hollowed out; ink in required colors is printed on printed surfaces of the articles to be printed in a screening manner by one or more printing color cells of other printing color cells according to the color of alumite requiring hot stamping, a lining ink layer is formed, and the surface color of the surface of positions, required to be hot stamped, of the articles to be printed is enabled to be consistent with that of the alumite; (2) hot stamping alumite on the articles to be printed by a hot stamping machine to form a hot stamping pattern layer covering the lining ink layer. The novel offset printing and hot stamping technique is good in hot stamping effect and capable of effectively avoiding quality problem, caused by incomplete hot stamping, of products which are subjected to offset printing prior to hot stamping, product quality is guaranteed, and product percentage of pass is increased.
Owner:广西真龙彩印包装有限公司

Miniature loudspeaker module and manufacturing method thereof

The invention discloses a miniature loudspeaker module and a manufacturing method thereof. The miniature loudspeaker module comprises a loudspeaker unit and an outer casing, and the outer casing is used for holding and fixing the loudspeaker unit. The outer casing consists of an upper casing and a lower casing which are integrated, the space inside the outer casing includes a mounting portion for mounting the loudspeaker unit, each of the upper casing and the lower casing is provided with a body made of plastics, two mounting holes are arranged at the positions of the bodies corresponding to the mounting portion, inserts made of metal are arranged on the two mounting holes, the thickness of each insert is smaller than that of each body, the thickness of the module can be reduced by the above design and thinning of products is realized. In the manufacturing method of the miniature loudspeaker module, positioning parts are integrally formed on the upper insert and the lower insert which are made of metal, the upper insert and the lower insert are positioned on an injection mold accurately through the positioning parts, then the body of the upper casing combined with the periphery of the upper insert and the body of the lower casing combined with the periphery of the lower insert are formed by injection molding, thereby yield and production efficiency of products are improved.
Owner:GOERTEK INC

Three-dimensional display and manufacturing method thereof

The invention provides a three-dimensional display and a manufacturing method thereof, wherein the three-dimensional display comprises a display panel, a liquid crystal layer, an alignment layer and an adhesion layer; the liquid crystal layer is positioned at one side (opposite to the display panel) of the display panel; the alignment layer is formed by curable resin, and is positioned at the other side of the liquid crystal layer; the alignment layer is provided with a plurality of first and second alignment regions, wherein the first and second alignment regions are staggered with one another and are parallel with one another; liquid crystal on the first and second alignment regions respectively provides first phase delay and second phase delay, and the difference between the first phase delay and the second phase delay is gamma/2; and the adhesion layer is configured between the display panel and the liquid crystal layer, the display panel is connected with the liquid crystal layer through the adhesion layer, the pencil hardness of the alignment layer is between 1B and 4H, and the adhesion force of the adhesion layer is 50-1500gf/25mm. The three-dimensional display provided by the invention does not have a base material which is used for bearing the liquid crystal layer, so that the integral thickness can be lowered greatly, and the manufacturing cost is low.
Owner:BENQ MATERIALS +1

Flexible-rigid circuit board and manufacturing method

The invention relates to a flexible-rigid circuit board comprising first and second rigid circuit boards and a flexible circuit board. The first rigid circuit board comprises a first adhesive layer, and a first outer line layer and a first dielectric layer which are on the two sides of the first adhesive layer. The flexible circuit board comprises a third adhesive layer, first and second inner line layers adhered to the two sides of the third adhesive layer respectively, and second and fourth dielectric layers covering the first and second inner line layers respectively. The first adhesive layer glues the first and second adhesive layers. The first rigid circuit board has a first open area provided with a first groove. The second dielectric layer is exposed from the first groove. The second rigid circuit board comprises a second adhesive layer, and a second outer line layer and a third dielectric layer which are on the two sides of the second adhesive layer. The second adhesive layer glues the third and fourth dielectric layers. The second rigid circuit board has a second open area which corresponds to the first open area and is provided with a second groove. The fourth dielectric layer is exposed from the second groove. All the line layers are electrically connected through conductive via holes. The invention further relates to a flexible-rigid circuit board manufacturing method.
Owner:AVARY HLDG (SHENZHEN) CO LTD +1

Backlight module and display device using same

The invention provides a backlight module and a display device using the same. The backlight module comprises a light guide plate and a light source device; the light source device comprises an LED (Light-Emitting Diode) chip of which the light extraction surface is directly towards the lateral surface of the light guide plate. The display device using the backlight module, which is provided by the invention, comprises the backlight module. According to the light source device in the backlight module provided by the invention, due to the cancel of a lamp cavity, the size can be greatly reduced, so that the thickness of the backlight module can further be correspondingly reduced. Due to the cancel of the lamp cavity, a light emitting angle of the light source device can further be increased and light emitted by each surface of the LED chip can enter the light guide plate from the lateral surface, so that a light entrance angle of the light which enters the light guide plate is greatly increased, and thus, light entrance spots are avoided and brightness of the backlight module is further promoted. The display device using the backlight module, which is provided by the invention, adopts the backlight module provided by the invention, so that the overall thickness of the display device can be reduced, the cost can be further reduced and the display quality of the display device is greatly improved.
Owner:BOE TECH GRP CO LTD +1

Cooling device and electronic equipment

The invention provides a cooling device and electronic equipment. The cooling device is used for being arranged on a printed circuit board so as to cool an electronic component arranged on the printed circuit board, and the cooling device comprises a supporting mechanism, and a first heat transfer part, wherein the supporting mechanism comprises a slablike body and a connecting part arranged at the edge of the body, the body and the connecting part form an internal space for containing the electronic component, the supporting mechanism can be connected with the printed circuit board through the connecting part, the body has a first surface and a second surface, the first surface and the second surface are oppositely arranged, the first surface faces the electronic component when the supporting mechanism is connected to the printed circuit board, the first heat transfer part is arranged on the first surface and is arranged corresponding to the electronic component, the first heat transfer part is in contact with the electronic component when the supporting mechanism is connected to the printed circuit board, and the thickness of the first heat transfer part is 2-15 mils. The cooling device is suitable for cooling the electronic equipment which needs to be light and thin.
Owner:TIANJIN LAIRD TECH LTD

Multilayer plane winding coil designing method suitable for double column magnetic core structure

The invention discloses a multilayer plane winding coil designing method suitable for double column magnetic core structure. The method comprises the following steps: installing through holes and a plurality of metalized hole welding plates on two parallel magnetic core columns of a PCB; drawing the head end and the tail end of windings in series connection on the whole board from two of the metalized hole welding plates of the PCB; using double-face copper-clad base materials for going wires and forming four windings around the two core column holes; obtaining a multilayer plane winding coil in such a manner that the edges of each core column hole are provided with going wires and through holes through multiple copper faces to make the copper clad going wires around the same core column form double layer series connection windings wrapped in the same direction; and lastly, providing an insulation layer between two adjacent PCBs; and providing insulation layers both at the top and the bottom of the multilayer plane winding coil of the double column magnetic core structure. In the invention, the technical limitation of the single-column winding of a planar transformer is changed, and under the same winding current-carrying density, winding coils are two times as many and winding inductance is four times as much as those of the single-layer board.
Owner:浙江求缺科技有限公司
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