Temperature equalization board

A technology of temperature uniformity plate and bottom plate, applied in cooling/ventilation/heating transformation, electrical components, electric solid-state devices, etc., can solve the problems affecting the normal operation of heating electronic components, temperature rise, etc., to improve heat transfer efficiency, reduce Overall thickness, the effect of reducing resistance

Inactive Publication Date: 2009-07-01
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] High-power electronic components such as computer central processing units, north bridge chips, and light-emitting diodes are developing toward lighter, thinner, multi-functional, and faster-running trends, and the heat generated per unit area

Method used

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  • Temperature equalization board
  • Temperature equalization board
  • Temperature equalization board

Examples

Experimental program
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Example Embodiment

[0015] like figure 1 and Figure 4 As shown, it is the first embodiment of the vapor chamber of the present invention. The temperature equalizing plate includes a bottom plate 100 with a cavity 102 and a cover plate 200. The cover plate 200 covers the bottom plate 100 and seals the cavity 102 on the bottom plate 100 to form a cavity (not shown) , the chamber is pumped to a low pressure and is equipped with a working medium such as water, ethanol, paraffin, etc. that can undergo phase change. The temperature chamber also includes a first capillary structure 220 disposed on the inner surface 201 of the cover plate 200 , a second capillary structure 221 disposed in the chamber, and a third capillary structure disposed on the inner surface 101 of the bottom plate 100 The structure 110, the first vapor working medium flow space 300 arranged around the periphery of the second capillary structure 221, and a second vapor working medium flow space 400 formed inside the second capilla...

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Abstract

A temperature-uniforming plate includes a bottom plate and a cover plate. A chamber is hermetically formed between the bottom plate and the cover plate, and filled with a working medium. A first capillary structure, a second capillary structure and a third capillary structure are arranged in the chamber respectively; the first capillary structure is arranged on the inner surface of the cover body; the third capillary structure is arranged on the inner surface of the bottom plate; the second capillary structure is connected between the first capillary structure and the third capillary structure; a first vapourous working medium flowing space around the periphery of the second capillary structure is formed in the temperature-uniforming plate; a second vapourous working medium flowing space is formed in the second capillary structure; and the first vapourous working medium flowing space and the second vapourous working medium flowing space are communicated. The temperature-uniforming plate can reduce the whole thickness of the temperature-uniforming plate on the premise that the performance of the temperature-uniforming plate is ensured.

Description

technical field [0001] The invention relates to a uniform temperature plate, in particular to a uniform temperature plate for cooling electronic components. Background technique [0002] High-power electronic components such as computer central processing units, north bridge chips, and light-emitting diodes are developing toward lighter, thinner, multi-functional, and faster-running trends, and the heat generated per unit area during operation is also increasing. These If the heat cannot be dissipated in a timely and effective manner, it will directly lead to a sharp rise in temperature, which will seriously affect the normal operation of the heating electronic components. For this reason, it is necessary to use a heat sink to dissipate heat from these electronic components. [0003] The most typical heat dissipation device is a finned radiator equipped with a fan, which achieves the purpose of heat dissipation through the contact between the radiator and the heating electr...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/427
Inventor 赖振田周志勇丁巧利
Owner FU ZHUN PRECISION IND SHENZHEN
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