Temperature equalization board

Abstract

A temperature-uniforming plate includes a bottom plate and a cover plate. A chamber is hermetically formed between the bottom plate and the cover plate, and filled with a working medium. A first capillary structure, a second capillary structure and a third capillary structure are arranged in the chamber respectively; the first capillary structure is arranged on the inner surface of the cover body; the third capillary structure is arranged on the inner surface of the bottom plate; the second capillary structure is connected between the first capillary structure and the third capillary structure; a first vapourous working medium flowing space around the periphery of the second capillary structure is formed in the temperature-uniforming plate; a second vapourous working medium flowing space is formed in the second capillary structure; and the first vapourous working medium flowing space and the second vapourous working medium flowing space are communicated. The temperature-uniforming plate can reduce the whole thickness of the temperature-uniforming plate on the premise that the performance of the temperature-uniforming plate is ensured.

Description

technical field [0001] The invention relates to a uniform temperature plate, in particular to a uniform temperature plate for cooling electronic components. Background technique [0002] High-power electronic components such as computer central processing units, north bridge chips, and light-emitting diodes are developing toward lighter, thinner, multi-functional, and faster-running trends, and the heat generated per unit area during operation is also increasing. These If the heat cannot be dissipated in a timely and effective manner, it will directly lead to a sharp rise in temperature, which will seriously affect the normal operation of the heating electronic components. For this reason, it is necessary to use a heat sink to dissipate heat from these electronic components. [0003] The most typical heat dissipation device is a finned radiator equipped with a fan, which achieves the purpose of heat dissipation through the contact between the radiator and the heating electr...

AI Technical Summary

Problems solved by technology

[0002] High-power electronic components such as computer central processing units, north bridge chips, and light-emitting diodes are developing toward lighter, thinner, multi-functional, and faster-running trends, and the heat generated per unit area during operation is also increasing. These If the heat cannot be dissipated in a timely and effective manner, it will directly lead to a sharp rise in temperature, which will seriously affect the normal operation of the heating electronic components

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